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| author | Daniel Baumann <daniel.baumann@progress-linux.org> | 2024-05-06 01:02:30 +0000 |
|---|---|---|
| committer | Daniel Baumann <daniel.baumann@progress-linux.org> | 2024-05-06 01:02:30 +0000 |
| commit | 76cb841cb886eef6b3bee341a2266c76578724ad (patch) | |
| tree | f5892e5ba6cc11949952a6ce4ecbe6d516d6ce58 /Documentation/devicetree/bindings/thermal | |
| parent | Initial commit. (diff) | |
| download | linux-upstream/4.19.249.tar.xz linux-upstream/4.19.249.zip | |
Adding upstream version 4.19.249.upstream/4.19.249upstream
Signed-off-by: Daniel Baumann <daniel.baumann@progress-linux.org>
Diffstat (limited to 'Documentation/devicetree/bindings/thermal')
29 files changed, 2172 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/thermal/armada-thermal.txt b/Documentation/devicetree/bindings/thermal/armada-thermal.txt new file mode 100644 index 000000000..f3b441100 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/armada-thermal.txt @@ -0,0 +1,41 @@ +* Marvell Armada 370/375/380/XP thermal management + +Required properties: + +- compatible: Should be set to one of the following: + * marvell,armada370-thermal + * marvell,armada375-thermal + * marvell,armada380-thermal + * marvell,armadaxp-thermal + * marvell,armada-ap806-thermal + * marvell,armada-cp110-thermal + +Note: these bindings are deprecated for AP806/CP110 and should instead +follow the rules described in: +Documentation/devicetree/bindings/arm/marvell/ap806-system-controller.txt +Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt + +- reg: Device's register space. + Two entries are expected, see the examples below. The first one points + to the status register (4B). The second one points to the control + registers (8B). + Note: The compatibles marvell,armada370-thermal, + marvell,armada380-thermal, and marvell,armadaxp-thermal must point to + "control MSB/control 1", with size of 4 (deprecated binding), or point + to "control LSB/control 0" with size of 8 (current binding). All other + compatibles must point to "control LSB/control 0" with size of 8. + +Examples: + + /* Legacy bindings */ + thermal@d0018300 { + compatible = "marvell,armada370-thermal"; + reg = <0xd0018300 0x4 + 0xd0018304 0x4>; + }; + + ap_thermal: thermal@6f8084 { + compatible = "marvell,armada-ap806-thermal"; + reg = <0x6f808C 0x4>, + <0x6f8084 0x8>; + }; diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.txt b/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.txt new file mode 100644 index 000000000..43a9ed545 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.txt @@ -0,0 +1,19 @@ +* Broadcom STB thermal management + +Thermal management core, provided by the AVS TMON hardware block. + +Required properties: +- compatible: must be "brcm,avs-tmon" and/or "brcm,avs-tmon-bcm7445" +- reg: address range for the AVS TMON registers +- interrupts: temperature monitor interrupt, for high/low threshold triggers +- interrupt-names: should be "tmon" + +Example: + + thermal@f04d1500 { + compatible = "brcm,avs-tmon-bcm7445", "brcm,avs-tmon"; + reg = <0xf04d1500 0x28>; + interrupts = <0x6>; + interrupt-names = "tmon"; + interrupt-parent = <&avs_host_l2_intc>; + }; diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt new file mode 100644 index 000000000..da8c5b73a --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt @@ -0,0 +1,41 @@ +Binding for Thermal Sensor driver for BCM2835 SoCs. + +Required parameters: +------------------- + +compatible: should be one of: "brcm,bcm2835-thermal", + "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal" +reg: Address range of the thermal registers. +clocks: Phandle of the clock used by the thermal sensor. +#thermal-sensor-cells: should be 0 (see thermal.txt) + +Example: + +thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + + thermal-sensors = <&thermal>; + + trips { + cpu-crit { + temperature = <80000>; + hysteresis = <0>; + type = "critical"; + }; + }; + + coefficients = <(-538) 407000>; + + cooling-maps { + }; + }; +}; + +thermal: thermal@7e212000 { + compatible = "brcm,bcm2835-thermal"; + reg = <0x7e212000 0x8>; + clocks = <&clocks BCM2835_CLOCK_TSENS>; + #thermal-sensor-cells = <0>; +}; diff --git a/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt new file mode 100644 index 000000000..68e047170 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt @@ -0,0 +1,37 @@ +* Broadcom Northstar Thermal + +This binding describes thermal sensor that is part of Northstar's DMU (Device +Management Unit). + +Required properties: +- compatible : Must be "brcm,ns-thermal" +- reg : iomem address range of PVTMON registers +- #thermal-sensor-cells : Should be <0> + +Example: + +thermal: thermal@1800c2c0 { + compatible = "brcm,ns-thermal"; + reg = <0x1800c2c0 0x10>; + #thermal-sensor-cells = <0>; +}; + +thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + coefficients = <(-556) 418000>; + thermal-sensors = <&thermal>; + + trips { + cpu-crit { + temperature = <125000>; + hysteresis = <0>; + type = "critical"; + }; + }; + + cooling-maps { + }; + }; +}; diff --git a/Documentation/devicetree/bindings/thermal/da9062-thermal.txt b/Documentation/devicetree/bindings/thermal/da9062-thermal.txt new file mode 100644 index 000000000..e241bb5a5 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/da9062-thermal.txt @@ -0,0 +1,36 @@ +* Dialog DA9062/61 TJUNC Thermal Module + +This module is part of the DA9061/DA9062. For more details about entire +DA9062 and DA9061 chips see Documentation/devicetree/bindings/mfd/da9062.txt + +Junction temperature thermal module uses an interrupt signal to identify +high THERMAL_TRIP_HOT temperatures for the PMIC device. + +Required properties: + +- compatible: should be one of the following valid compatible string lines: + "dlg,da9061-thermal", "dlg,da9062-thermal" + "dlg,da9062-thermal" + +Optional properties: + +- polling-delay-passive : Specify the polling period, measured in + milliseconds, between thermal zone device update checks. + +Example: DA9062 + + pmic0: da9062@58 { + thermal { + compatible = "dlg,da9062-thermal"; + polling-delay-passive = <3000>; + }; + }; + +Example: DA9061 using a fall-back compatible for the DA9062 onkey driver + + pmic0: da9061@58 { + thermal { + compatible = "dlg,da9061-thermal", "dlg,da9062-thermal"; + polling-delay-passive = <3000>; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/db8500-thermal.txt b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt new file mode 100644 index 000000000..2e1c06fad --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt @@ -0,0 +1,44 @@ +* ST-Ericsson DB8500 Thermal + +** Thermal node properties: + +- compatible : "stericsson,db8500-thermal"; +- reg : address range of the thermal sensor registers; +- interrupts : interrupts generated from PRCMU; +- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH"; +- num-trips : number of total trip points, this is required, set it 0 if none, + if greater than 0, the following properties must be defined; +- tripN-temp : temperature of trip point N, should be in ascending order; +- tripN-type : type of trip point N, should be one of "active" "passive" "hot" + "critical"; +- tripN-cdev-num : number of the cooling devices which can be bound to trip + point N, this is required if trip point N is defined, set it 0 if none, + otherwise the following cooling device names must be defined; +- tripN-cdev-nameM : name of the No. M cooling device of trip point N; + +Usually the num-trips and tripN-*** are separated in board related dts files. + +Example: +thermal@801573c0 { + compatible = "stericsson,db8500-thermal"; + reg = <0x801573c0 0x40>; + interrupts = <21 0x4>, <22 0x4>; + interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH"; + + num-trips = <3>; + + trip0-temp = <75000>; + trip0-type = "active"; + trip0-cdev-num = <1>; + trip0-cdev-name0 = "thermal-cpufreq-0"; + + trip1-temp = <80000>; + trip1-type = "active"; + trip1-cdev-num = <2>; + trip1-cdev-name0 = "thermal-cpufreq-0"; + trip1-cdev-name1 = "thermal-fan"; + + trip2-temp = <85000>; + trip2-type = "critical"; + trip2-cdev-num = <0>; +} diff --git a/Documentation/devicetree/bindings/thermal/dove-thermal.txt b/Documentation/devicetree/bindings/thermal/dove-thermal.txt new file mode 100644 index 000000000..6f474677d --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/dove-thermal.txt @@ -0,0 +1,18 @@ +* Dove Thermal + +This driver is for Dove SoCs which contain a thermal sensor. + +Required properties: +- compatible : "marvell,dove-thermal" +- reg : Address range of the thermal registers + +The reg properties should contain two ranges. The first is for the +three Thermal Manager registers, while the second range contains the +Thermal Diode Control Registers. + +Example: + + thermal@10078 { + compatible = "marvell,dove-thermal"; + reg = <0xd001c 0x0c>, <0xd005c 0x08>; + }; diff --git a/Documentation/devicetree/bindings/thermal/exynos-thermal.txt b/Documentation/devicetree/bindings/thermal/exynos-thermal.txt new file mode 100644 index 000000000..33004ce7e --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/exynos-thermal.txt @@ -0,0 +1,106 @@ +* Exynos Thermal Management Unit (TMU) + +** Required properties: + +- compatible : One of the following: + "samsung,exynos3250-tmu" + "samsung,exynos4412-tmu" + "samsung,exynos4210-tmu" + "samsung,exynos5250-tmu" + "samsung,exynos5260-tmu" + "samsung,exynos5420-tmu" for TMU channel 0, 1 on Exynos5420 + "samsung,exynos5420-tmu-ext-triminfo" for TMU channels 2, 3 and 4 + Exynos5420 (Must pass triminfo base and triminfo clock) + "samsung,exynos5433-tmu" + "samsung,exynos7-tmu" +- reg : Address range of the thermal registers. For soc's which has multiple + instances of TMU and some registers are shared across all TMU's like + interrupt related then 2 set of register has to supplied. First set + belongs to register set of TMU instance and second set belongs to + registers shared with the TMU instance. + + NOTE: On Exynos5420, the TRIMINFO register is misplaced for TMU + channels 2, 3 and 4 + Use "samsung,exynos5420-tmu-ext-triminfo" in cases, there is a misplaced + register, also provide clock to access that base. + + TRIMINFO at 0x1006c000 contains data for TMU channel 3 + TRIMINFO at 0x100a0000 contains data for TMU channel 4 + TRIMINFO at 0x10068000 contains data for TMU channel 2 + +- interrupts : Should contain interrupt for thermal system +- clocks : The main clocks for TMU device + -- 1. operational clock for TMU channel + -- 2. optional clock to access the shared registers of TMU channel + -- 3. optional special clock for functional operation +- clock-names : Thermal system clock name + -- "tmu_apbif" operational clock for current TMU channel + -- "tmu_triminfo_apbif" clock to access the shared triminfo register + for current TMU channel + -- "tmu_sclk" clock for functional operation of the current TMU + channel + +The Exynos TMU supports generating interrupts when reaching given +temperature thresholds. Number of supported thermal trip points depends +on the SoC (only first trip points defined in DT will be configured): + - most of SoC: 4 + - samsung,exynos5433-tmu: 8 + - samsung,exynos7-tmu: 8 + +** Optional properties: + +- vtmu-supply: This entry is optional and provides the regulator node supplying + voltage to TMU. If needed this entry can be placed inside + board/platform specific dts file. + +Example 1): + + tmu@100c0000 { + compatible = "samsung,exynos4412-tmu"; + interrupt-parent = <&combiner>; + reg = <0x100C0000 0x100>; + interrupts = <2 4>; + clocks = <&clock 383>; + clock-names = "tmu_apbif"; + vtmu-supply = <&tmu_regulator_node>; + #thermal-sensor-cells = <0>; + }; + +Example 2): (In case of Exynos5420 "with misplaced TRIMINFO register") + tmu_cpu2: tmu@10068000 { + compatible = "samsung,exynos5420-tmu-ext-triminfo"; + reg = <0x10068000 0x100>, <0x1006c000 0x4>; + interrupts = <0 184 0>; + clocks = <&clock 318>, <&clock 318>; + clock-names = "tmu_apbif", "tmu_triminfo_apbif"; + #thermal-sensor-cells = <0>; + }; + + tmu_cpu3: tmu@1006c000 { + compatible = "samsung,exynos5420-tmu-ext-triminfo"; + reg = <0x1006c000 0x100>, <0x100a0000 0x4>; + interrupts = <0 185 0>; + clocks = <&clock 318>, <&clock 319>; + clock-names = "tmu_apbif", "tmu_triminfo_apbif"; + #thermal-sensor-cells = <0>; + }; + + tmu_gpu: tmu@100a0000 { + compatible = "samsung,exynos5420-tmu-ext-triminfo"; + reg = <0x100a0000 0x100>, <0x10068000 0x4>; + interrupts = <0 215 0>; + clocks = <&clock 319>, <&clock 318>; + clock-names = "tmu_apbif", "tmu_triminfo_apbif"; + #thermal-sensor-cells = <0>; + }; + +Note: For multi-instance tmu each instance should have an alias correctly +numbered in "aliases" node. + +Example: + +aliases { + tmuctrl0 = &tmuctrl_0; + tmuctrl1 = &tmuctrl_1; + tmuctrl2 = &tmuctrl_2; +}; diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt new file mode 100644 index 000000000..cef716a23 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt @@ -0,0 +1,32 @@ +* Temperature Sensor on hisilicon SoCs + +** Required properties : + +- compatible: "hisilicon,tsensor". +- reg: physical base address of thermal sensor and length of memory mapped + region. +- interrupt: The interrupt number to the cpu. Defines the interrupt used + by /SOCTHERM/tsensor. +- clock-names: Input clock name, should be 'thermal_clk'. +- clocks: phandles for clock specified in "clock-names" property. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : + +for Hi6220: + tsensor: tsensor@0,f7030700 { + compatible = "hisilicon,tsensor"; + reg = <0x0 0xf7030700 0x0 0x1000>; + interrupts = <0 7 0x4>; + clocks = <&sys_ctrl HI6220_TSENSOR_CLK>; + clock-names = "thermal_clk"; + #thermal-sensor-cells = <1>; + } + +for Hi3660: + tsensor: tsensor@fff30000 { + compatible = "hisilicon,hi3660-tsensor"; + reg = <0x0 0xfff30000 0x0 0x1000>; + interrupts = <GIC_SPI 145 IRQ_TYPE_LEVEL_HIGH>; + #thermal-sensor-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/imx-thermal.txt b/Documentation/devicetree/bindings/thermal/imx-thermal.txt new file mode 100644 index 000000000..823e4176e --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/imx-thermal.txt @@ -0,0 +1,61 @@ +* Temperature Monitor (TEMPMON) on Freescale i.MX SoCs + +Required properties: +- compatible : must be one of following: + - "fsl,imx6q-tempmon" for i.MX6Q, + - "fsl,imx6sx-tempmon" for i.MX6SX, + - "fsl,imx7d-tempmon" for i.MX7S/D. +- interrupts : the interrupt output of the controller: + i.MX6Q has one IRQ which will be triggered when temperature is higher than high threshold, + i.MX6SX and i.MX7S/D have two more IRQs than i.MX6Q, one is IRQ_LOW and the other is IRQ_PANIC, + when temperature is below than low threshold, IRQ_LOW will be triggered, when temperature + is higher than panic threshold, system will auto reboot by SRC module. +- fsl,tempmon : phandle pointer to system controller that contains TEMPMON + control registers, e.g. ANATOP on imx6q. +- nvmem-cells: A phandle to the calibration cells provided by ocotp. +- nvmem-cell-names: Should be "calib", "temp_grade". + +Deprecated properties: +- fsl,tempmon-data : phandle pointer to fuse controller that contains TEMPMON + calibration data, e.g. OCOTP on imx6q. The details about calibration data + can be found in SoC Reference Manual. + +Direct access to OCOTP via fsl,tempmon-data is incorrect on some newer chips +because it does not handle OCOTP clock requirements. + +Optional properties: +- clocks : thermal sensor's clock source. + +Example: +ocotp: ocotp@21bc000 { + #address-cells = <1>; + #size-cells = <1>; + compatible = "fsl,imx6sx-ocotp", "syscon"; + reg = <0x021bc000 0x4000>; + clocks = <&clks IMX6SX_CLK_OCOTP>; + + tempmon_calib: calib@38 { + reg = <0x38 4>; + }; + + tempmon_temp_grade: temp-grade@20 { + reg = <0x20 4>; + }; +}; + +tempmon: tempmon { + compatible = "fsl,imx6sx-tempmon", "fsl,imx6q-tempmon"; + interrupts = <GIC_SPI 49 IRQ_TYPE_LEVEL_HIGH>; + fsl,tempmon = <&anatop>; + nvmem-cells = <&tempmon_calib>, <&tempmon_temp_grade>; + nvmem-cell-names = "calib", "temp_grade"; + clocks = <&clks IMX6SX_CLK_PLL3_USB_OTG>; +}; + +Legacy method (Deprecated): +tempmon { + compatible = "fsl,imx6q-tempmon"; + fsl,tempmon = <&anatop>; + fsl,tempmon-data = <&ocotp>; + clocks = <&clks 172>; +}; diff --git a/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt b/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt new file mode 100644 index 000000000..8c0f5eb86 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt @@ -0,0 +1,15 @@ +* Kirkwood Thermal + +This version is for Kirkwood 88F8262 & 88F6283 SoCs. Other kirkwoods +don't contain a thermal sensor. + +Required properties: +- compatible : "marvell,kirkwood-thermal" +- reg : Address range of the thermal registers + +Example: + + thermal@10078 { + compatible = "marvell,kirkwood-thermal"; + reg = <0x10078 0x4>; + }; diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt new file mode 100644 index 000000000..323a3b382 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt @@ -0,0 +1,70 @@ +Thermal driver for MAX77620 Power management IC from Maxim Semiconductor. + +Maxim Semiconductor MAX77620 supports alarm interrupts when its +die temperature crosses 120C and 140C. These threshold temperatures +are not configurable. Device does not provide the real temperature +of die other than just indicating whether temperature is above or +below threshold level. + +Required properties: +------------------- +#thermal-sensor-cells: Please refer <devicetree/bindings/thermal/thermal.txt> + for more details. + The value must be 0. + +For more details, please refer generic thermal DT binding document +<devicetree/bindings/thermal/thermal.txt>. + +Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding +document for the MAX77620. + +Example: +-------- +#include <dt-bindings/mfd/max77620.h> +#include <dt-bindings/thermal/thermal.h> +... + +i2c@7000d000 { + spmic: max77620@3c { + compatible = "maxim,max77620"; + ::::: + #thermal-sensor-cells = <0>; + ::: + }; +}; + +cool_dev: cool-dev { + compatible = "cooling-dev"; + #cooling-cells = <2>; +}; + +thermal-zones { + PMIC-Die { + polling-delay = <0>; + polling-delay-passive = <0>; + thermal-sensors = <&spmic>; + + trips { + pmic_die_warn_temp_thresh: hot-die { + temperature = <120000>; + type = "hot"; + hysteresis = <0>; + }; + + pmic_die_cirt_temp_thresh: cirtical-die { + temperature = <140000>; + type = "critical"; + hysteresis = <0>; + }; + }; + + cooling-maps { + map0 { + trip = <&pmic_die_warn_temp_thresh>; + cooling-device = <&cool_dev THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + contribution = <100>; + }; + }; + }; +}; diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt new file mode 100644 index 000000000..41d6a443a --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt @@ -0,0 +1,47 @@ +* Mediatek Thermal + +This describes the device tree binding for the Mediatek thermal controller +which measures the on-SoC temperatures. This device does not have its own ADC, +instead it directly controls the AUXADC via AHB bus accesses. For this reason +this device needs phandles to the AUXADC. Also it controls a mux in the +apmixedsys register space via AHB bus accesses, so a phandle to the APMIXEDSYS +is also needed. + +Required properties: +- compatible: + - "mediatek,mt8173-thermal" : For MT8173 family of SoCs + - "mediatek,mt2701-thermal" : For MT2701 family of SoCs + - "mediatek,mt2712-thermal" : For MT2712 family of SoCs + - "mediatek,mt7622-thermal" : For MT7622 SoC +- reg: Address range of the thermal controller +- interrupts: IRQ for the thermal controller +- clocks, clock-names: Clocks needed for the thermal controller. required + clocks are: + "therm": Main clock needed for register access + "auxadc": The AUXADC clock +- resets: Reference to the reset controller controlling the thermal controller. +- mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses +- mediatek,apmixedsys: A phandle to the APMIXEDSYS controller. +- #thermal-sensor-cells : Should be 0. See ./thermal.txt for a description. + +Optional properties: +- nvmem-cells: A phandle to the calibration data provided by a nvmem device. If + unspecified default values shall be used. +- nvmem-cell-names: Should be "calibration-data" + +Example: + + thermal: thermal@1100b000 { + #thermal-sensor-cells = <1>; + compatible = "mediatek,mt8173-thermal"; + reg = <0 0x1100b000 0 0x1000>; + interrupts = <0 70 IRQ_TYPE_LEVEL_LOW>; + clocks = <&pericfg CLK_PERI_THERM>, <&pericfg CLK_PERI_AUXADC>; + clock-names = "therm", "auxadc"; + resets = <&pericfg MT8173_PERI_THERM_SW_RST>; + reset-names = "therm"; + mediatek,auxadc = <&auxadc>; + mediatek,apmixedsys = <&apmixedsys>; + nvmem-cells = <&thermal_calibration_data>; + nvmem-cell-names = "calibration-data"; + }; diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt new file mode 100644 index 000000000..b6c0ae53d --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt @@ -0,0 +1,184 @@ +Tegra124 SOCTHERM thermal management system + +The SOCTHERM IP block contains thermal sensors, support for polled +or interrupt-based thermal monitoring, CPU and GPU throttling based +on temperature trip points, and handling external overcurrent +notifications. It is also used to manage emergency shutdown in an +overheating situation. + +Required properties : +- compatible : For Tegra124, must contain "nvidia,tegra124-soctherm". + For Tegra132, must contain "nvidia,tegra132-soctherm". + For Tegra210, must contain "nvidia,tegra210-soctherm". +- reg : Should contain at least 2 entries for each entry in reg-names: + - SOCTHERM register set + - Tegra CAR register set: Required for Tegra124 and Tegra210. + - CCROC register set: Required for Tegra132. +- reg-names : Should contain at least 2 entries: + - soctherm-reg + - car-reg + - ccroc-reg +- interrupts : Defines the interrupt used by SOCTHERM +- clocks : Must contain an entry for each entry in clock-names. + See ../clocks/clock-bindings.txt for details. +- clock-names : Must include the following entries: + - tsensor + - soctherm +- resets : Must contain an entry for each entry in reset-names. + See ../reset/reset.txt for details. +- reset-names : Must include the following entries: + - soctherm +- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description + of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a + list of valid values when referring to thermal sensors. +- throttle-cfgs: A sub-node which is a container of configuration for each + hardware throttle events. These events can be set as cooling devices. + * throttle events: Sub-nodes must be named as "light" or "heavy". + Properties: + - nvidia,priority: Each throttles has its own throttle settings, so the + SW need to set priorities for various throttle, the HW arbiter can select + the final throttle settings. + Bigger value indicates higher priority, In general, higher priority + translates to lower target frequency. SW needs to ensure that critical + thermal alarms are given higher priority, and ensure that there is + no race if priority of two vectors is set to the same value. + The range of this value is 1~100. + - nvidia,cpu-throt-percent: This property is for Tegra124 and Tegra210. + It is the throttling depth of pulse skippers, it's the percentage + throttling. + - nvidia,cpu-throt-level: This property is only for Tegra132, it is the + level of pulse skippers, which used to throttle clock frequencies. It + indicates cpu clock throttling depth, and the depth can be programmed. + Must set as following values: + TEGRA_SOCTHERM_THROT_LEVEL_LOW, TEGRA_SOCTHERM_THROT_LEVEL_MED + TEGRA_SOCTHERM_THROT_LEVEL_HIGH, TEGRA_SOCTHERM_THROT_LEVEL_NONE + - #cooling-cells: Should be 1. This cooling device only support on/off state. + See ./thermal.txt for a description of this property. + +Note: +- the "critical" type trip points will be set to SOC_THERM hardware as the +shut down temperature. Once the temperature of this thermal zone is higher +than it, the system will be shutdown or reset by hardware. +- the "hot" type trip points will be set to SOC_THERM hardware as the throttle +temperature. Once the the temperature of this thermal zone is higher +than it, it will trigger the HW throttle event. + +Example : + + soctherm@700e2000 { + compatible = "nvidia,tegra124-soctherm"; + reg = <0x0 0x700e2000 0x0 0x600 /* SOC_THERM reg_base */ + 0x0 0x60006000 0x0 0x400 /* CAR reg_base */ + reg-names = "soctherm-reg", "car-reg"; + interrupts = <GIC_SPI 48 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&tegra_car TEGRA124_CLK_TSENSOR>, + <&tegra_car TEGRA124_CLK_SOC_THERM>; + clock-names = "tsensor", "soctherm"; + resets = <&tegra_car 78>; + reset-names = "soctherm"; + + #thermal-sensor-cells = <1>; + + throttle-cfgs { + /* + * When the "heavy" cooling device triggered, + * the HW will skip cpu clock's pulse in 85% depth + */ + throttle_heavy: heavy { + nvidia,priority = <100>; + nvidia,cpu-throt-percent = <85>; + + #cooling-cells = <1>; + }; + + /* + * When the "light" cooling device triggered, + * the HW will skip cpu clock's pulse in 50% depth + */ + throttle_light: light { + nvidia,priority = <80>; + nvidia,cpu-throt-percent = <50>; + + #cooling-cells = <1>; + }; + + /* + * If these two devices are triggered in same time, the HW throttle + * arbiter will select the highest priority as the final throttle + * settings to skip cpu pulse. + */ + }; + }; + +Example: referring to Tegra132's "reg", "reg-names" and "throttle-cfgs" : + + soctherm@700e2000 { + compatible = "nvidia,tegra132-soctherm"; + reg = <0x0 0x700e2000 0x0 0x600 /* SOC_THERM reg_base */ + 0x0 0x70040000 0x0 0x200>; /* CCROC reg_base */; + reg-names = "soctherm-reg", "ccroc-reg"; + + throttle-cfgs { + /* + * When the "heavy" cooling device triggered, + * the HW will skip cpu clock's pulse in HIGH level + */ + throttle_heavy: heavy { + nvidia,priority = <100>; + nvidia,cpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_HIGH>; + + #cooling-cells = <1>; + }; + + /* + * When the "light" cooling device triggered, + * the HW will skip cpu clock's pulse in MED level + */ + throttle_light: light { + nvidia,priority = <80>; + nvidia,cpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_MED>; + + #cooling-cells = <1>; + }; + + /* + * If these two devices are triggered in same time, the HW throttle + * arbiter will select the highest priority as the final throttle + * settings to skip cpu pulse. + */ + + }; + }; + +Example: referring to thermal sensors : + + thermal-zones { + cpu { + polling-delay-passive = <1000>; + polling-delay = <1000>; + + thermal-sensors = + <&soctherm TEGRA124_SOCTHERM_SENSOR_CPU>; + + trips { + cpu_shutdown_trip: shutdown-trip { + temperature = <102500>; + hysteresis = <1000>; + type = "critical"; + }; + + cpu_throttle_trip: throttle-trip { + temperature = <100000>; + hysteresis = <1000>; + type = "hot"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_throttle_trip>; + cooling-device = <&throttle_heavy 1 1>; + }; + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt new file mode 100644 index 000000000..276387dd6 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt @@ -0,0 +1,32 @@ +NVIDIA Tegra186 BPMP thermal sensor + +In Tegra186, the BPMP (Boot and Power Management Processor) implements an +interface that is used to read system temperatures, including CPU cluster +and GPU temperatures. This binding describes the thermal sensor that is +exposed by BPMP. + +The BPMP thermal node must be located directly inside the main BPMP node. See +../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding. + +This node represents a thermal sensor. See thermal.txt for details of the +core thermal binding. + +Required properties: +- compatible: + Array of strings. + One of: + - "nvidia,tegra186-bpmp-thermal". +- #thermal-sensor-cells: Cell for sensor index. + Single-cell integer. + Must be <1>. + +Example: + +bpmp { + ... + + bpmp_thermal: thermal { + compatible = "nvidia,tegra186-bpmp-thermal"; + #thermal-sensor-cells = <1>; + }; +}; diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt new file mode 100644 index 000000000..290ec06fa --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt @@ -0,0 +1,57 @@ +Qualcomm QPNP PMIC Temperature Alarm + +QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips +that utilize the Qualcomm SPMI implementation. These peripherals provide an +interrupt signal and status register to identify high PMIC die temperature. + +Required properties: +- compatible: Should contain "qcom,spmi-temp-alarm". +- reg: Specifies the SPMI address and length of the controller's + registers. +- interrupts: PMIC temperature alarm interrupt. +- #thermal-sensor-cells: Should be 0. See thermal.txt for a description. + +Optional properties: +- io-channels: Should contain IIO channel specifier for the ADC channel, + which report chip die temperature. +- io-channel-names: Should contain "thermal". + +Example: + + pm8941_temp: thermal-alarm@2400 { + compatible = "qcom,spmi-temp-alarm"; + reg = <0x2400 0x100>; + interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>; + #thermal-sensor-cells = <0>; + + io-channels = <&pm8941_vadc VADC_DIE_TEMP>; + io-channel-names = "thermal"; + }; + + thermal-zones { + pm8941 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&pm8941_temp>; + + trips { + passive { + temperature = <1050000>; + hysteresis = <2000>; + type = "passive"; + }; + alert { + temperature = <125000>; + hysteresis = <2000>; + type = "hot"; + }; + crit { + temperature = <145000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.txt b/Documentation/devicetree/bindings/thermal/qcom-tsens.txt new file mode 100644 index 000000000..1d9e8cf61 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.txt @@ -0,0 +1,41 @@ +* QCOM SoC Temperature Sensor (TSENS) + +Required properties: +- compatible: + Must be one of the following: + - "qcom,msm8916-tsens" (MSM8916) + - "qcom,msm8974-tsens" (MSM8974) + - "qcom,msm8996-tsens" (MSM8996) + - "qcom,msm8998-tsens", "qcom,tsens-v2" (MSM8998) + - "qcom,sdm845-tsens", "qcom,tsens-v2" (SDM845) + The generic "qcom,tsens-v2" property must be used as a fallback for any SoC + with version 2 of the TSENS IP. MSM8996 is the only exception because the + generic property did not exist when support was added. + +- reg: Address range of the thermal registers. + New platforms containing v2.x.y of the TSENS IP must specify the SROT and TM + register spaces separately, with order being TM before SROT. + See Example 2, below. + +- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description. +- #qcom,sensors: Number of sensors in tsens block +- Refer to Documentation/devicetree/bindings/nvmem/nvmem.txt to know how to specify +nvmem cells + +Example 1 (legacy support before a fallback tsens-v2 property was introduced): +tsens: thermal-sensor@900000 { + compatible = "qcom,msm8916-tsens"; + reg = <0x4a8000 0x2000>; + nvmem-cells = <&tsens_caldata>, <&tsens_calsel>; + nvmem-cell-names = "caldata", "calsel"; + #thermal-sensor-cells = <1>; + }; + +Example 2 (for any platform containing v2 of the TSENS IP): +tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0xc263000 0x1ff>, /* TM */ + <0xc222000 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + #thermal-sensor-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/qoriq-thermal.txt b/Documentation/devicetree/bindings/thermal/qoriq-thermal.txt new file mode 100644 index 000000000..20ca4ef9d --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qoriq-thermal.txt @@ -0,0 +1,70 @@ +* Thermal Monitoring Unit (TMU) on Freescale QorIQ SoCs + +Required properties: +- compatible : Must include "fsl,qoriq-tmu". The version of the device is + determined by the TMU IP Block Revision Register (IPBRR0) at + offset 0x0BF8. + Table of correspondences between IPBRR0 values and example chips: + Value Device + ---------- ----- + 0x01900102 T1040 +- reg : Address range of TMU registers. +- interrupts : Contains the interrupt for TMU. +- fsl,tmu-range : The values to be programmed into TTRnCR, as specified by + the SoC reference manual. The first cell is TTR0CR, the second is + TTR1CR, etc. +- fsl,tmu-calibration : A list of cell pairs containing temperature + calibration data, as specified by the SoC reference manual. + The first cell of each pair is the value to be written to TTCFGR, + and the second is the value to be written to TSCFGR. +- #thermal-sensor-cells : Must be 1. The sensor specifier is the monitoring + site ID, and represents the "n" in TRITSRn and TRATSRn. + +Optional property: +- little-endian : If present, the TMU registers are little endian. If absent, + the default is big endian. + +Example: + +tmu@f0000 { + compatible = "fsl,qoriq-tmu"; + reg = <0xf0000 0x1000>; + interrupts = <18 2 0 0>; + fsl,tmu-range = <0x000a0000 0x00090026 0x0008004a 0x0001006a>; + fsl,tmu-calibration = <0x00000000 0x00000025 + 0x00000001 0x00000028 + 0x00000002 0x0000002d + 0x00000003 0x00000031 + 0x00000004 0x00000036 + 0x00000005 0x0000003a + 0x00000006 0x00000040 + 0x00000007 0x00000044 + 0x00000008 0x0000004a + 0x00000009 0x0000004f + 0x0000000a 0x00000054 + + 0x00010000 0x0000000d + 0x00010001 0x00000013 + 0x00010002 0x00000019 + 0x00010003 0x0000001f + 0x00010004 0x00000025 + 0x00010005 0x0000002d + 0x00010006 0x00000033 + 0x00010007 0x00000043 + 0x00010008 0x0000004b + 0x00010009 0x00000053 + + 0x00020000 0x00000010 + 0x00020001 0x00000017 + 0x00020002 0x0000001f + 0x00020003 0x00000029 + 0x00020004 0x00000031 + 0x00020005 0x0000003c + 0x00020006 0x00000042 + 0x00020007 0x0000004d + 0x00020008 0x00000056 + + 0x00030000 0x00000012 + 0x00030001 0x0000001d>; + #thermal-sensor-cells = <1>; +}; diff --git a/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.txt b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.txt new file mode 100644 index 000000000..cfa154bb0 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.txt @@ -0,0 +1,56 @@ +* DT bindings for Renesas R-Car Gen3 Thermal Sensor driver + +On R-Car Gen3 SoCs, the thermal sensor controllers (TSC) control the thermal +sensors (THS) which are the analog circuits for measuring temperature (Tj) +inside the LSI. + +Required properties: +- compatible : "renesas,<soctype>-thermal", + Examples with soctypes are: + - "renesas,r8a7795-thermal" (R-Car H3) + - "renesas,r8a7796-thermal" (R-Car M3-W) + - "renesas,r8a77965-thermal" (R-Car M3-N) +- reg : Address ranges of the thermal registers. Each sensor + needs one address range. Sorting must be done in + increasing order according to datasheet, i.e. + TSC1, TSC2, ... +- clocks : Must contain a reference to the functional clock. +- #thermal-sensor-cells : must be <1>. + +Optional properties: + +- interrupts : interrupts routed to the TSC (3 for H3, M3-W and M3-N) +- power-domain : Must contain a reference to the power domain. This + property is mandatory if the thermal sensor instance + is part of a controllable power domain. + +Example: + + tsc: thermal@e6198000 { + compatible = "renesas,r8a7795-thermal"; + reg = <0 0xe6198000 0 0x100>, + <0 0xe61a0000 0 0x100>, + <0 0xe61a8000 0 0x100>; + interrupts = <GIC_SPI 67 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 68 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&cpg CPG_MOD 522>; + power-domains = <&sysc R8A7795_PD_ALWAYS_ON>; + #thermal-sensor-cells = <1>; + }; + + thermal-zones { + sensor_thermal1: sensor-thermal1 { + polling-delay-passive = <250>; + polling-delay = <1000>; + thermal-sensors = <&tsc 0>; + + trips { + sensor1_crit: sensor1-crit { + temperature = <90000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/rcar-thermal.txt b/Documentation/devicetree/bindings/thermal/rcar-thermal.txt new file mode 100644 index 000000000..67c563f1b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/rcar-thermal.txt @@ -0,0 +1,74 @@ +* Renesas R-Car Thermal + +Required properties: +- compatible : "renesas,thermal-<soctype>", + "renesas,rcar-gen2-thermal" (with thermal-zone) or + "renesas,rcar-thermal" (without thermal-zone) as + fallback except R-Car D3. + Examples with soctypes are: + - "renesas,thermal-r8a73a4" (R-Mobile APE6) + - "renesas,thermal-r8a7743" (RZ/G1M) + - "renesas,thermal-r8a7779" (R-Car H1) + - "renesas,thermal-r8a7790" (R-Car H2) + - "renesas,thermal-r8a7791" (R-Car M2-W) + - "renesas,thermal-r8a7792" (R-Car V2H) + - "renesas,thermal-r8a7793" (R-Car M2-N) + - "renesas,thermal-r8a77995" (R-Car D3) +- reg : Address range of the thermal registers. + The 1st reg will be recognized as common register + if it has "interrupts". + +Option properties: + +- interrupts : If present should contain 3 interrupts for + R-Car D3 or 1 interrupt otherwise. + +Example (non interrupt support): + +thermal@ffc48000 { + compatible = "renesas,thermal-r8a7779", "renesas,rcar-thermal"; + reg = <0xffc48000 0x38>; +}; + +Example (interrupt support): + +thermal@e61f0000 { + compatible = "renesas,thermal-r8a73a4", "renesas,rcar-thermal"; + reg = <0xe61f0000 0x14 + 0xe61f0100 0x38 + 0xe61f0200 0x38 + 0xe61f0300 0x38>; + interrupts = <0 69 IRQ_TYPE_LEVEL_HIGH>; +}; + +Example (with thermal-zone): + +thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <1000>; + polling-delay = <5000>; + + thermal-sensors = <&thermal>; + + trips { + cpu-crit { + temperature = <115000>; + hysteresis = <0>; + type = "critical"; + }; + }; + cooling-maps { + }; + }; +}; + +thermal: thermal@e61f0000 { + compatible = "renesas,thermal-r8a7790", + "renesas,rcar-gen2-thermal", + "renesas,rcar-thermal"; + reg = <0 0xe61f0000 0 0x14>, <0 0xe61f0100 0 0x38>; + interrupts = <0 69 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&mstp5_clks R8A7790_CLK_THERMAL>; + power-domains = <&cpg_clocks>; + #thermal-sensor-cells = <0>; +}; diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt new file mode 100644 index 000000000..43d744e53 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt @@ -0,0 +1,84 @@ +* Temperature Sensor ADC (TSADC) on rockchip SoCs + +Required properties: +- compatible : should be "rockchip,<name>-tsadc" + "rockchip,rv1108-tsadc": found on RV1108 SoCs + "rockchip,rk3228-tsadc": found on RK3228 SoCs + "rockchip,rk3288-tsadc": found on RK3288 SoCs + "rockchip,rk3328-tsadc": found on RK3328 SoCs + "rockchip,rk3368-tsadc": found on RK3368 SoCs + "rockchip,rk3399-tsadc": found on RK3399 SoCs +- reg : physical base address of the controller and length of memory mapped + region. +- interrupts : The interrupt number to the cpu. The interrupt specifier format + depends on the interrupt controller. +- clocks : Must contain an entry for each entry in clock-names. +- clock-names : Shall be "tsadc" for the converter-clock, and "apb_pclk" for + the peripheral clock. +- resets : Must contain an entry for each entry in reset-names. + See ../reset/reset.txt for details. +- reset-names : Must include the name "tsadc-apb". +- pinctrl-names : The pin control state names; +- pinctrl-0 : The "init" pinctrl state, it will be set before device probe. +- pinctrl-1 : The "default" pinctrl state, it will be set after reset the + TSADC controller. +- pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend. +- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description. + +Optional properties: +- rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value. +- rockchip,hw-tshut-mode : The hardware-controlled shutdown mode 0:CRU 1:GPIO. +- rockchip,hw-tshut-polarity : The hardware-controlled active polarity 0:LOW + 1:HIGH. +- rockchip,grf : The phandle of the syscon node for the general register file. + +Exiample: +tsadc: tsadc@ff280000 { + compatible = "rockchip,rk3288-tsadc"; + reg = <0xff280000 0x100>; + interrupts = <GIC_SPI 37 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&cru SCLK_TSADC>, <&cru PCLK_TSADC>; + clock-names = "tsadc", "apb_pclk"; + resets = <&cru SRST_TSADC>; + reset-names = "tsadc-apb"; + pinctrl-names = "init", "default", "sleep"; + pinctrl-0 = <&otp_gpio>; + pinctrl-1 = <&otp_out>; + pinctrl-2 = <&otp_gpio>; + #thermal-sensor-cells = <1>; + rockchip,hw-tshut-temp = <95000>; + rockchip,hw-tshut-mode = <0>; + rockchip,hw-tshut-polarity = <0>; +}; + +Example: referring to thermal sensors: +thermal-zones { + cpu_thermal: cpu_thermal { + polling-delay-passive = <1000>; /* milliseconds */ + polling-delay = <5000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&tsadc 1>; + + trips { + cpu_alert0: cpu_alert { + temperature = <70000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + cpu_crit: cpu_crit { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_alert0>; + cooling-device = + <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + }; + }; + }; +}; diff --git a/Documentation/devicetree/bindings/thermal/spear-thermal.txt b/Documentation/devicetree/bindings/thermal/spear-thermal.txt new file mode 100644 index 000000000..93e3b67c1 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/spear-thermal.txt @@ -0,0 +1,14 @@ +* SPEAr Thermal + +Required properties: +- compatible : "st,thermal-spear1340" +- reg : Address range of the thermal registers +- st,thermal-flags: flags used to enable thermal sensor + +Example: + + thermal@fc000000 { + compatible = "st,thermal-spear1340"; + reg = <0xfc000000 0x1000>; + st,thermal-flags = <0x7000>; + }; diff --git a/Documentation/devicetree/bindings/thermal/st-thermal.txt b/Documentation/devicetree/bindings/thermal/st-thermal.txt new file mode 100644 index 000000000..a2f939137 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/st-thermal.txt @@ -0,0 +1,32 @@ +Binding for Thermal Sensor driver for STMicroelectronics STi series of SoCs. + +Required parameters: +------------------- + +compatible : Should be "st,stih407-thermal" + +clock-names : Should be "thermal". + See: Documentation/devicetree/bindings/resource-names.txt +clocks : Phandle of the clock used by the thermal sensor. + See: Documentation/devicetree/bindings/clock/clock-bindings.txt + +Optional parameters: +------------------- + +reg : For non-sysconf based sensors, this should be the physical base + address and length of the sensor's registers. +interrupts : Standard way to define interrupt number. + NB: For thermal sensor's for which no interrupt has been + defined, a polling delay of 1000ms will be used to read the + temperature from device. + +Example: + + temp0@91a0000 { + compatible = "st,stih407-thermal"; + reg = <0x91a0000 0x28>; + clock-names = "thermal"; + clocks = <&CLK_SYSIN>; + interrupts = <GIC_SPI 205 IRQ_TYPE_EDGE_RISING>; + st,passive_cooling_temp = <110>; + }; diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt new file mode 100644 index 000000000..212198d4b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt @@ -0,0 +1,17 @@ +* Tango Thermal + +The SMP8758 SoC includes 3 instances of this temperature sensor +(in the CPU, video decoder, and PCIe controller). + +Required properties: +- #thermal-sensor-cells: Should be 0 (see thermal.txt) +- compatible: "sigma,smp8758-thermal" +- reg: Address range of the thermal registers + +Example: + + cpu_temp: thermal@920100 { + #thermal-sensor-cells = <0>; + compatible = "sigma,smp8758-thermal"; + reg = <0x920100 12>; + }; diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt new file mode 100644 index 000000000..d72355502 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt @@ -0,0 +1,89 @@ +General Purpose Analog To Digital Converter (ADC) based thermal sensor. + +On some of platforms, thermal sensor like thermistors are connected to +one of ADC channel and sensor resistance is read via voltage across the +sensor resistor. The voltage read across the sensor is mapped to +temperature using voltage-temperature lookup table. + +Required properties: +=================== +- compatible: Must be "generic-adc-thermal". +- temperature-lookup-table: Two dimensional array of Integer; lookup table + to map the relation between ADC value and + temperature. When ADC is read, the value is + looked up on the table to get the equivalent + temperature. + The first value of the each row of array is the + temperature in milliCelsius and second value of + the each row of array is the ADC read value. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description + of this property. + +Example : +#include <dt-bindings/thermal/thermal.h> + +i2c@7000c400 { + ads1015: ads1015@4a { + reg = <0x4a>; + compatible = "ads1015"; + sampling-frequency = <3300>; + #io-channel-cells = <1>; + }; +}; + +tboard_thermistor: thermal-sensor { + compatible = "generic-adc-thermal"; + #thermal-sensor-cells = <0>; + io-channels = <&ads1015 1>; + io-channel-names = "sensor-channel"; + temperature-lookup-table = < (-40000) 2578 + (-39000) 2577 + (-38000) 2576 + (-37000) 2575 + (-36000) 2574 + (-35000) 2573 + (-34000) 2572 + (-33000) 2571 + (-32000) 2569 + (-31000) 2568 + (-30000) 2567 + :::::::::: + 118000 254 + 119000 247 + 120000 240 + 121000 233 + 122000 226 + 123000 220 + 124000 214 + 125000 208>; +}; + +dummy_cool_dev: dummy-cool-dev { + compatible = "dummy-cooling-dev"; + #cooling-cells = <2>; /* min followed by max */ +}; + +thermal-zones { + Tboard { + polling-delay = <15000>; /* milliseconds */ + polling-delay-passive = <0>; /* milliseconds */ + thermal-sensors = <&tboard_thermistor>; + + trips { + therm_est_trip: therm_est_trip { + temperature = <40000>; + type = "active"; + hysteresis = <1000>; + }; + }; + + cooling-maps { + map0 { + trip = <&therm_est_trip>; + cooling-device = <&dummy_cool_dev THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + contribution = <100>; + }; + + }; + }; +}; diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt new file mode 100644 index 000000000..eb7ee9155 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal.txt @@ -0,0 +1,586 @@ +* Thermal Framework Device Tree descriptor + +This file describes a generic binding to provide a way of +defining hardware thermal structure using device tree. +A thermal structure includes thermal zones and their components, +such as trip points, polling intervals, sensors and cooling devices +binding descriptors. + +The target of device tree thermal descriptors is to describe only +the hardware thermal aspects. The thermal device tree bindings are +not about how the system must control or which algorithm or policy +must be taken in place. + +There are five types of nodes involved to describe thermal bindings: +- thermal sensors: devices which may be used to take temperature + measurements. +- cooling devices: devices which may be used to dissipate heat. +- trip points: describe key temperatures at which cooling is recommended. The + set of points should be chosen based on hardware limits. +- cooling maps: used to describe links between trip points and cooling devices; +- thermal zones: used to describe thermal data within the hardware; + +The following is a description of each of these node types. + +* Thermal sensor devices + +Thermal sensor devices are nodes providing temperature sensing capabilities on +thermal zones. Typical devices are I2C ADC converters and bandgaps. These are +nodes providing temperature data to thermal zones. Thermal sensor devices may +control one or more internal sensors. + +Required property: +- #thermal-sensor-cells: Used to provide sensor device specific information + Type: unsigned while referring to it. Typically 0 on thermal sensor + Size: one cell nodes with only one sensor, and at least 1 on nodes + with several internal sensors, in order + to identify uniquely the sensor instances within + the IC. See thermal zone binding for more details + on how consumers refer to sensor devices. + +* Cooling device nodes + +Cooling devices are nodes providing control on power dissipation. There +are essentially two ways to provide control on power dissipation. First +is by means of regulating device performance, which is known as passive +cooling. A typical passive cooling is a CPU that has dynamic voltage and +frequency scaling (DVFS), and uses lower frequencies as cooling states. +Second is by means of activating devices in order to remove +the dissipated heat, which is known as active cooling, e.g. regulating +fan speeds. In both cases, cooling devices shall have a way to determine +the state of cooling in which the device is. + +Any cooling device has a range of cooling states (i.e. different levels +of heat dissipation). For example a fan's cooling states correspond to +the different fan speeds possible. Cooling states are referred to by +single unsigned integers, where larger numbers mean greater heat +dissipation. The precise set of cooling states associated with a device +should be defined in a particular device's binding. +For more examples of cooling devices, refer to the example sections below. + +Required properties: +- #cooling-cells: Used to provide cooling device specific information + Type: unsigned while referring to it. Must be at least 2, in order + Size: one cell to specify minimum and maximum cooling state used + in the reference. The first cell is the minimum + cooling state requested and the second cell is + the maximum cooling state requested in the reference. + See Cooling device maps section below for more details + on how consumers refer to cooling devices. + +* Trip points + +The trip node is a node to describe a point in the temperature domain +in which the system takes an action. This node describes just the point, +not the action. + +Required properties: +- temperature: An integer indicating the trip temperature level, + Type: signed in millicelsius. + Size: one cell + +- hysteresis: A low hysteresis value on temperature property (above). + Type: unsigned This is a relative value, in millicelsius. + Size: one cell + +- type: a string containing the trip type. Expected values are: + "active": A trip point to enable active cooling + "passive": A trip point to enable passive cooling + "hot": A trip point to notify emergency + "critical": Hardware not reliable. + Type: string + +* Cooling device maps + +The cooling device maps node is a node to describe how cooling devices +get assigned to trip points of the zone. The cooling devices are expected +to be loaded in the target system. + +Required properties: +- cooling-device: A list of phandles of cooling devices with their specifiers, + Type: phandle + referring to which cooling devices are used in this + cooling specifier binding. In the cooling specifier, the first cell + is the minimum cooling state and the second cell + is the maximum cooling state used in this map. +- trip: A phandle of a trip point node within the same thermal + Type: phandle of zone. + trip point node + +Optional property: +- contribution: The cooling contribution to the thermal zone of the + Type: unsigned referred cooling device at the referred trip point. + Size: one cell The contribution is a ratio of the sum + of all cooling contributions within a thermal zone. + +Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle +limit specifier means: +(i) - minimum state allowed for minimum cooling state used in the reference. +(ii) - maximum state allowed for maximum cooling state used in the reference. +Refer to include/dt-bindings/thermal/thermal.h for definition of this constant. + +* Thermal zone nodes + +The thermal zone node is the node containing all the required info +for describing a thermal zone, including its cooling device bindings. The +thermal zone node must contain, apart from its own properties, one sub-node +containing trip nodes and one sub-node containing all the zone cooling maps. + +Required properties: +- polling-delay: The maximum number of milliseconds to wait between polls + Type: unsigned when checking this thermal zone. + Size: one cell + +- polling-delay-passive: The maximum number of milliseconds to wait + Type: unsigned between polls when performing passive cooling. + Size: one cell + +- thermal-sensors: A list of thermal sensor phandles and sensor specifier + Type: list of used while monitoring the thermal zone. + phandles + sensor + specifier + +- trips: A sub-node which is a container of only trip point nodes + Type: sub-node required to describe the thermal zone. + +- cooling-maps: A sub-node which is a container of only cooling device + Type: sub-node map nodes, used to describe the relation between trips + and cooling devices. + +Optional property: +- coefficients: An array of integers (one signed cell) containing + Type: array coefficients to compose a linear relation between + Elem size: one cell the sensors listed in the thermal-sensors property. + Elem type: signed Coefficients defaults to 1, in case this property + is not specified. A simple linear polynomial is used: + Z = c0 * x0 + c1 + x1 + ... + c(n-1) * x(n-1) + cn. + + The coefficients are ordered and they match with sensors + by means of sensor ID. Additional coefficients are + interpreted as constant offset. + +- sustainable-power: An estimate of the sustainable power (in mW) that the + Type: unsigned thermal zone can dissipate at the desired + Size: one cell control temperature. For reference, the + sustainable power of a 4'' phone is typically + 2000mW, while on a 10'' tablet is around + 4500mW. + +Note: The delay properties are bound to the maximum dT/dt (temperature +derivative over time) in two situations for a thermal zone: +(i) - when passive cooling is activated (polling-delay-passive); and +(ii) - when the zone just needs to be monitored (polling-delay) or +when active cooling is activated. + +The maximum dT/dt is highly bound to hardware power consumption and dissipation +capability. The delays should be chosen to account for said max dT/dt, +such that a device does not cross several trip boundaries unexpectedly +between polls. Choosing the right polling delays shall avoid having the +device in temperature ranges that may damage the silicon structures and +reduce silicon lifetime. + +* The thermal-zones node + +The "thermal-zones" node is a container for all thermal zone nodes. It shall +contain only sub-nodes describing thermal zones as in the section +"Thermal zone nodes". The "thermal-zones" node appears under "/". + +* Examples + +Below are several examples on how to use thermal data descriptors +using device tree bindings: + +(a) - CPU thermal zone + +The CPU thermal zone example below describes how to setup one thermal zone +using one single sensor as temperature source and many cooling devices and +power dissipation control sources. + +#include <dt-bindings/thermal/thermal.h> + +cpus { + /* + * Here is an example of describing a cooling device for a DVFS + * capable CPU. The CPU node describes its four OPPs. + * The cooling states possible are 0..3, and they are + * used as OPP indexes. The minimum cooling state is 0, which means + * all four OPPs can be available to the system. The maximum + * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V) + * can be available in the system. + */ + cpu0: cpu@0 { + ... + operating-points = < + /* kHz uV */ + 970000 1200000 + 792000 1100000 + 396000 950000 + 198000 850000 + >; + #cooling-cells = <2>; /* min followed by max */ + }; + ... +}; + +&i2c1 { + ... + /* + * A simple fan controller which supports 10 speeds of operation + * (represented as 0-9). + */ + fan0: fan@48 { + ... + #cooling-cells = <2>; /* min followed by max */ + }; +}; + +ocp { + ... + /* + * A simple IC with a single bandgap temperature sensor. + */ + bandgap0: bandgap@0000ed00 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + thermal-sensors = <&bandgap0>; + + trips { + cpu_alert0: cpu-alert0 { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "active"; + }; + cpu_alert1: cpu-alert1 { + temperature = <100000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + cpu_crit: cpu-crit { + temperature = <125000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_alert0>; + cooling-device = <&fan0 THERMAL_NO_LIMIT 4>; + }; + map1 { + trip = <&cpu_alert1>; + cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + }; + }; + }; +}; + +In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is +used to monitor the zone 'cpu-thermal' using its sole sensor. A fan +device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten +different cooling states 0-9. It is used to remove the heat out of +the thermal zone 'cpu-thermal' using its cooling states +from its minimum to 4, when it reaches trip point 'cpu_alert0' +at 90C, as an example of active cooling. The same cooling device is used at +'cpu_alert1', but from 5 to its maximum state. The cpu@0 device is also +linked to the same thermal zone, 'cpu-thermal', as a passive cooling device, +using all its cooling states at trip point 'cpu_alert1', +which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the +temperature of 125C, represented by the trip point 'cpu_crit', the silicon +is not reliable anymore. + +(b) - IC with several internal sensors + +The example below describes how to deploy several thermal zones based off a +single sensor IC, assuming it has several internal sensors. This is a common +case on SoC designs with several internal IPs that may need different thermal +requirements, and thus may have their own sensor to monitor or detect internal +hotspots in their silicon. + +#include <dt-bindings/thermal/thermal.h> + +ocp { + ... + /* + * A simple IC with several bandgap temperature sensors. + */ + bandgap0: bandgap@0000ed00 { + ... + #thermal-sensor-cells = <1>; + }; +}; + +thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 0>; + + trips { + /* each zone within the SoC may have its own trips */ + cpu_alert: cpu-alert { + temperature = <100000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + cpu_crit: cpu-crit { + temperature = <125000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; + + gpu_thermal: gpu-thermal { + polling-delay-passive = <120>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 1>; + + trips { + /* each zone within the SoC may have its own trips */ + gpu_alert: gpu-alert { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + gpu_crit: gpu-crit { + temperature = <105000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; + + dsp_thermal: dsp-thermal { + polling-delay-passive = <50>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 2>; + + trips { + /* each zone within the SoC may have its own trips */ + dsp_alert: dsp-alert { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + dsp_crit: gpu-crit { + temperature = <135000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; +}; + +In the example above, there is one bandgap IC which has the capability to +monitor three sensors. The hardware has been designed so that sensors are +placed on different places in the DIE to monitor different temperature +hotspots: one for CPU thermal zone, one for GPU thermal zone and the +other to monitor a DSP thermal zone. + +Thus, there is a need to assign each sensor provided by the bandgap IC +to different thermal zones. This is achieved by means of using the +#thermal-sensor-cells property and using the first cell of the sensor +specifier as sensor ID. In the example, then, <bandgap 0> is used to +monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal +zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone +may be uncorrelated, having its own dT/dt requirements, trips +and cooling maps. + + +(c) - Several sensors within one single thermal zone + +The example below illustrates how to use more than one sensor within +one thermal zone. + +#include <dt-bindings/thermal/thermal.h> + +&i2c1 { + ... + /* + * A simple IC with a single temperature sensor. + */ + adc: sensor@49 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +ocp { + ... + /* + * A simple IC with a single bandgap temperature sensor. + */ + bandgap0: bandgap@0000ed00 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + thermal-sensors = <&bandgap0>, /* cpu */ + <&adc>; /* pcb north */ + + /* hotspot = 100 * bandgap - 120 * adc + 484 */ + coefficients = <100 -120 484>; + + trips { + ... + }; + + cooling-maps { + ... + }; + }; +}; + +In some cases, there is a need to use more than one sensor to extrapolate +a thermal hotspot in the silicon. The above example illustrates this situation. +For instance, it may be the case that a sensor external to CPU IP may be placed +close to CPU hotspot and together with internal CPU sensor, it is used +to determine the hotspot. Assuming this is the case for the above example, +the hypothetical extrapolation rule would be: + hotspot = 100 * bandgap - 120 * adc + 484 + +In other context, the same idea can be used to add fixed offset. For instance, +consider the hotspot extrapolation rule below: + hotspot = 1 * adc + 6000 + +In the above equation, the hotspot is always 6C higher than what is read +from the ADC sensor. The binding would be then: + thermal-sensors = <&adc>; + + /* hotspot = 1 * adc + 6000 */ + coefficients = <1 6000>; + +(d) - Board thermal + +The board thermal example below illustrates how to setup one thermal zone +with many sensors and many cooling devices. + +#include <dt-bindings/thermal/thermal.h> + +&i2c1 { + ... + /* + * An IC with several temperature sensor. + */ + adc_dummy: sensor@50 { + ... + #thermal-sensor-cells = <1>; /* sensor internal ID */ + }; +}; + +thermal-zones { + batt-thermal { + polling-delay-passive = <500>; /* milliseconds */ + polling-delay = <2500>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&adc_dummy 4>; + + trips { + ... + }; + + cooling-maps { + ... + }; + }; + + board_thermal: board-thermal { + polling-delay-passive = <1000>; /* milliseconds */ + polling-delay = <2500>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&adc_dummy 0>, /* pcb top edge */ + <&adc_dummy 1>, /* lcd */ + <&adc_dummy 2>; /* back cover */ + /* + * An array of coefficients describing the sensor + * linear relation. E.g.: + * z = c1*x1 + c2*x2 + c3*x3 + */ + coefficients = <1200 -345 890>; + + sustainable-power = <2500>; + + trips { + /* Trips are based on resulting linear equation */ + cpu_trip: cpu-trip { + temperature = <60000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + gpu_trip: gpu-trip { + temperature = <55000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + } + lcd_trip: lcp-trip { + temperature = <53000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + crit_trip: crit-trip { + temperature = <68000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_trip>; + cooling-device = <&cpu0 0 2>; + contribution = <55>; + }; + map1 { + trip = <&gpu_trip>; + cooling-device = <&gpu0 0 2>; + contribution = <20>; + }; + map2 { + trip = <&lcd_trip>; + cooling-device = <&lcd0 5 10>; + contribution = <15>; + }; + }; + }; +}; + +The above example is a mix of previous examples, a sensor IP with several internal +sensors used to monitor different zones, one of them is composed by several sensors and +with different cooling devices. diff --git a/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt new file mode 100644 index 000000000..6299dd8de --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt @@ -0,0 +1,88 @@ +* Texas Instrument OMAP SCM bandgap bindings + +In the System Control Module, OMAP supplies a voltage reference +and a temperature sensor feature that are gathered in the band +gap voltage and temperature sensor (VBGAPTS) module. The band +gap provides current and voltage reference for its internal +circuits and other analog IP blocks. The analog-to-digital +converter (ADC) produces an output value that is proportional +to the silicon temperature. + +Required properties: +- compatible : Should be: + - "ti,omap34xx-bandgap" : for OMAP34xx bandgap + - "ti,omap36xx-bandgap" : for OMAP36xx bandgap + - "ti,omap4430-bandgap" : for OMAP4430 bandgap + - "ti,omap4460-bandgap" : for OMAP4460 bandgap + - "ti,omap4470-bandgap" : for OMAP4470 bandgap + - "ti,omap5430-bandgap" : for OMAP5430 bandgap +- interrupts : this entry should indicate which interrupt line +the talert signal is routed to; +Specific: +- gpios : this entry should be used to inform which GPIO +line the tshut signal is routed to. The informed GPIO will +be treated as an IRQ; +- regs : this entry must also be specified and it is specific +to each bandgap version, because the mapping may change from +soc to soc, apart of depending on available features. + +Example: +OMAP34xx: +bandgap { + reg = <0x48002524 0x4>; + compatible = "ti,omap34xx-bandgap"; +}; + +OMAP36xx: +bandgap { + reg = <0x48002524 0x4>; + compatible = "ti,omap36xx-bandgap"; +}; + +OMAP4430: +bandgap { + reg = <0x4a002260 0x4 0x4a00232C 0x4>; + compatible = "ti,omap4430-bandgap"; +}; + +OMAP4460: +bandgap { + reg = <0x4a002260 0x4 + 0x4a00232C 0x4 + 0x4a002378 0x18>; + compatible = "ti,omap4460-bandgap"; + interrupts = <0 126 4>; /* talert */ + gpios = <&gpio3 22 0>; /* tshut */ +}; + +OMAP4470: +bandgap { + reg = <0x4a002260 0x4 + 0x4a00232C 0x4 + 0x4a002378 0x18>; + compatible = "ti,omap4470-bandgap"; + interrupts = <0 126 4>; /* talert */ + gpios = <&gpio3 22 0>; /* tshut */ +}; + +OMAP5430: +bandgap { + reg = <0x4a0021e0 0xc + 0x4a00232c 0xc + 0x4a002380 0x2c + 0x4a0023C0 0x3c>; + compatible = "ti,omap5430-bandgap"; + interrupts = <0 126 4>; /* talert */ +}; + +DRA752: +bandgap { + reg = <0x4a0021e0 0xc + 0x4a00232c 0xc + 0x4a002380 0x2c + 0x4a0023C0 0x3c + 0x4a002564 0x8 + 0x4a002574 0x50>; + compatible = "ti,dra752-bandgap"; + interrupts = <0 126 4>; /* talert */ +}; diff --git a/Documentation/devicetree/bindings/thermal/uniphier-thermal.txt b/Documentation/devicetree/bindings/thermal/uniphier-thermal.txt new file mode 100644 index 000000000..ceb92a957 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/uniphier-thermal.txt @@ -0,0 +1,65 @@ +* UniPhier Thermal bindings + +This describes the devicetree bindings for thermal monitor supported by +PVT(Process, Voltage and Temperature) monitoring unit implemented on Socionext +UniPhier SoCs. + +Required properties: +- compatible : + - "socionext,uniphier-pxs2-thermal" : For UniPhier PXs2 SoC + - "socionext,uniphier-ld20-thermal" : For UniPhier LD20 SoC + - "socionext,uniphier-pxs3-thermal" : For UniPhier PXs3 SoC +- interrupts : IRQ for the temperature alarm +- #thermal-sensor-cells : Should be 0. See ./thermal.txt for details. + +Optional properties: +- socionext,tmod-calibration: A pair of calibrated values referred from PVT, + in case that the values aren't set on SoC, + like a reference board. + +Example: + + sysctrl@61840000 { + compatible = "socionext,uniphier-ld20-sysctrl", + "simple-mfd", "syscon"; + reg = <0x61840000 0x10000>; + ... + pvtctl: pvtctl { + compatible = "socionext,uniphier-ld20-thermal"; + interrupts = <0 3 1>; + #thermal-sensor-cells = <0>; + }; + ... + }; + + thermal-zones { + cpu_thermal { + polling-delay-passive = <250>; /* 250ms */ + polling-delay = <1000>; /* 1000ms */ + thermal-sensors = <&pvtctl>; + + trips { + cpu_crit: cpu_crit { + temperature = <110000>; /* 110C */ + hysteresis = <2000>; + type = "critical"; + }; + cpu_alert: cpu_alert { + temperature = <100000>; /* 100C */ + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_alert>; + cooling-device = <&cpu0 (-1) (-1)>; + }; + map1 { + trip = <&cpu_alert>; + cooling-device = <&cpu2 (-1) (-1)>; + }; + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt b/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt new file mode 100644 index 000000000..3dc1c6bf0 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt @@ -0,0 +1,116 @@ +* ZTE zx2967 family Thermal + +Required Properties: +- compatible: should be one of the following. + * zte,zx296718-thermal +- reg: physical base address of the controller and length of memory mapped + region. +- clocks : Pairs of phandle and specifier referencing the controller's clocks. +- clock-names: "topcrm" for the topcrm clock. + "apb" for the apb clock. +- #thermal-sensor-cells: must be 0. + +Please note: slope coefficient defined in thermal-zones section need to be +multiplied by 1000. + +Example for tempsensor: + + tempsensor: tempsensor@148a000 { + compatible = "zte,zx296718-thermal"; + reg = <0x0148a000 0x20>; + clocks = <&topcrm TEMPSENSOR_GATE>, <&audiocrm AUDIO_TS_PCLK>; + clock-names = "topcrm", "apb"; + #thermal-sensor-cells = <0>; + }; + +Example for cooling device: + + cooling_dev: cooling_dev { + cluster0_cooling_dev: cluster0-cooling-dev { + #cooling-cells = <2>; + cpumask = <0xf>; + capacitance = <1500>; + }; + + cluster1_cooling_dev: cluster1-cooling-dev { + #cooling-cells = <2>; + cpumask = <0x30>; + capacitance = <2000>; + }; + }; + +Example for thermal zones: + + thermal-zones { + zx296718_thermal: zx296718_thermal { + polling-delay-passive = <500>; + polling-delay = <1000>; + sustainable-power = <6500>; + + thermal-sensors = <&tempsensor 0>; + /* + * slope need to be multiplied by 1000. + */ + coefficients = <1951 (-922)>; + + trips { + trip0: switch_on_temperature { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + + trip1: desired_temperature { + temperature = <100000>; + hysteresis = <2000>; + type = "passive"; + }; + + crit: critical_temperature { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&trip0>; + cooling-device = <&gpu 2 5>; + }; + + map1 { + trip = <&trip0>; + cooling-device = <&cluster0_cooling_dev 1 2>; + }; + + map2 { + trip = <&trip1>; + cooling-device = <&cluster0_cooling_dev 1 2>; + }; + + map3 { + trip = <&crit>; + cooling-device = <&cluster0_cooling_dev 1 2>; + }; + + map4 { + trip = <&trip0>; + cooling-device = <&cluster1_cooling_dev 1 2>; + contribution = <9000>; + }; + + map5 { + trip = <&trip1>; + cooling-device = <&cluster1_cooling_dev 1 2>; + contribution = <4096>; + }; + + map6 { + trip = <&crit>; + cooling-device = <&cluster1_cooling_dev 1 2>; + contribution = <4096>; + }; + }; + }; + }; |