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+===================================
+Generic Thermal Sysfs driver How To
+===================================
+
+Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
+
+Updated: 2 January 2008
+
+Copyright (c)  2008 Intel Corporation
+
+
+0. Introduction
+===============
+
+The generic thermal sysfs provides a set of interfaces for thermal zone
+devices (sensors) and thermal cooling devices (fan, processor...) to register
+with the thermal management solution and to be a part of it.
+
+This how-to focuses on enabling new thermal zone and cooling devices to
+participate in thermal management.
+This solution is platform independent and any type of thermal zone devices
+and cooling devices should be able to make use of the infrastructure.
+
+The main task of the thermal sysfs driver is to expose thermal zone attributes
+as well as cooling device attributes to the user space.
+An intelligent thermal management application can make decisions based on
+inputs from thermal zone attributes (the current temperature and trip point
+temperature) and throttle appropriate devices.
+
+- `[0-*]`	denotes any positive number starting from 0
+- `[1-*]`	denotes any positive number starting from 1
+
+1. thermal sysfs driver interface functions
+===========================================
+
+1.1 thermal zone device interface
+---------------------------------
+
+    ::
+
+	struct thermal_zone_device
+	*thermal_zone_device_register(char *type,
+				      int trips, int mask, void *devdata,
+				      struct thermal_zone_device_ops *ops,
+				      const struct thermal_zone_params *tzp,
+				      int passive_delay, int polling_delay))
+
+    This interface function adds a new thermal zone device (sensor) to
+    /sys/class/thermal folder as `thermal_zone[0-*]`. It tries to bind all the
+    thermal cooling devices registered at the same time.
+
+    type:
+	the thermal zone type.
+    trips:
+	the total number of trip points this thermal zone supports.
+    mask:
+	Bit string: If 'n'th bit is set, then trip point 'n' is writeable.
+    devdata:
+	device private data
+    ops:
+	thermal zone device call-backs.
+
+	.bind:
+		bind the thermal zone device with a thermal cooling device.
+	.unbind:
+		unbind the thermal zone device with a thermal cooling device.
+	.get_temp:
+		get the current temperature of the thermal zone.
+	.set_trips:
+		    set the trip points window. Whenever the current temperature
+		    is updated, the trip points immediately below and above the
+		    current temperature are found.
+	.get_mode:
+		   get the current mode (enabled/disabled) of the thermal zone.
+
+			- "enabled" means the kernel thermal management is
+			  enabled.
+			- "disabled" will prevent kernel thermal driver action
+			  upon trip points so that user applications can take
+			  charge of thermal management.
+	.set_mode:
+		set the mode (enabled/disabled) of the thermal zone.
+	.get_trip_type:
+		get the type of certain trip point.
+	.get_trip_temp:
+			get the temperature above which the certain trip point
+			will be fired.
+	.set_emul_temp:
+			set the emulation temperature which helps in debugging
+			different threshold temperature points.
+    tzp:
+	thermal zone platform parameters.
+    passive_delay:
+	number of milliseconds to wait between polls when
+	performing passive cooling.
+    polling_delay:
+	number of milliseconds to wait between polls when checking
+	whether trip points have been crossed (0 for interrupt driven systems).
+
+    ::
+
+	void thermal_zone_device_unregister(struct thermal_zone_device *tz)
+
+    This interface function removes the thermal zone device.
+    It deletes the corresponding entry from /sys/class/thermal folder and
+    unbinds all the thermal cooling devices it uses.
+
+	::
+
+	   struct thermal_zone_device
+	   *thermal_zone_of_sensor_register(struct device *dev, int sensor_id,
+				void *data,
+				const struct thermal_zone_of_device_ops *ops)
+
+	This interface adds a new sensor to a DT thermal zone.
+	This function will search the list of thermal zones described in
+	device tree and look for the zone that refer to the sensor device
+	pointed by dev->of_node as temperature providers. For the zone
+	pointing to the sensor node, the sensor will be added to the DT
+	thermal zone device.
+
+	The parameters for this interface are:
+
+	dev:
+			Device node of sensor containing valid node pointer in
+			dev->of_node.
+	sensor_id:
+			a sensor identifier, in case the sensor IP has more
+			than one sensors
+	data:
+			a private pointer (owned by the caller) that will be
+			passed back, when a temperature reading is needed.
+	ops:
+			`struct thermal_zone_of_device_ops *`.
+
+			==============  =======================================
+			get_temp	a pointer to a function that reads the
+					sensor temperature. This is mandatory
+					callback provided by sensor driver.
+			set_trips	a pointer to a function that sets a
+					temperature window. When this window is
+					left the driver must inform the thermal
+					core via thermal_zone_device_update.
+			get_trend 	a pointer to a function that reads the
+					sensor temperature trend.
+			set_emul_temp	a pointer to a function that sets
+					sensor emulated temperature.
+			==============  =======================================
+
+	The thermal zone temperature is provided by the get_temp() function
+	pointer of thermal_zone_of_device_ops. When called, it will
+	have the private pointer @data back.
+
+	It returns error pointer if fails otherwise valid thermal zone device
+	handle. Caller should check the return handle with IS_ERR() for finding
+	whether success or not.
+
+	::
+
+	    void thermal_zone_of_sensor_unregister(struct device *dev,
+						   struct thermal_zone_device *tzd)
+
+	This interface unregisters a sensor from a DT thermal zone which was
+	successfully added by interface thermal_zone_of_sensor_register().
+	This function removes the sensor callbacks and private data from the
+	thermal zone device registered with thermal_zone_of_sensor_register()
+	interface. It will also silent the zone by remove the .get_temp() and
+	get_trend() thermal zone device callbacks.
+
+	::
+
+	  struct thermal_zone_device
+	  *devm_thermal_zone_of_sensor_register(struct device *dev,
+				int sensor_id,
+				void *data,
+				const struct thermal_zone_of_device_ops *ops)
+
+	This interface is resource managed version of
+	thermal_zone_of_sensor_register().
+
+	All details of thermal_zone_of_sensor_register() described in
+	section 1.1.3 is applicable here.
+
+	The benefit of using this interface to register sensor is that it
+	is not require to explicitly call thermal_zone_of_sensor_unregister()
+	in error path or during driver unbinding as this is done by driver
+	resource manager.
+
+	::
+
+		void devm_thermal_zone_of_sensor_unregister(struct device *dev,
+						struct thermal_zone_device *tzd)
+
+	This interface is resource managed version of
+	thermal_zone_of_sensor_unregister().
+	All details of thermal_zone_of_sensor_unregister() described in
+	section 1.1.4 is applicable here.
+	Normally this function will not need to be called and the resource
+	management code will ensure that the resource is freed.
+
+	::
+
+		int thermal_zone_get_slope(struct thermal_zone_device *tz)
+
+	This interface is used to read the slope attribute value
+	for the thermal zone device, which might be useful for platform
+	drivers for temperature calculations.
+
+	::
+
+		int thermal_zone_get_offset(struct thermal_zone_device *tz)
+
+	This interface is used to read the offset attribute value
+	for the thermal zone device, which might be useful for platform
+	drivers for temperature calculations.
+
+1.2 thermal cooling device interface
+------------------------------------
+
+
+    ::
+
+	struct thermal_cooling_device
+	*thermal_cooling_device_register(char *name,
+			void *devdata, struct thermal_cooling_device_ops *)
+
+    This interface function adds a new thermal cooling device (fan/processor/...)
+    to /sys/class/thermal/ folder as `cooling_device[0-*]`. It tries to bind itself
+    to all the thermal zone devices registered at the same time.
+
+    name:
+	the cooling device name.
+    devdata:
+	device private data.
+    ops:
+	thermal cooling devices call-backs.
+
+	.get_max_state:
+		get the Maximum throttle state of the cooling device.
+	.get_cur_state:
+		get the Currently requested throttle state of the
+		cooling device.
+	.set_cur_state:
+		set the Current throttle state of the cooling device.
+
+    ::
+
+	void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
+
+    This interface function removes the thermal cooling device.
+    It deletes the corresponding entry from /sys/class/thermal folder and
+    unbinds itself from all the thermal zone devices using it.
+
+1.3 interface for binding a thermal zone device with a thermal cooling device
+-----------------------------------------------------------------------------
+
+    ::
+
+	int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
+		int trip, struct thermal_cooling_device *cdev,
+		unsigned long upper, unsigned long lower, unsigned int weight);
+
+    This interface function binds a thermal cooling device to a particular trip
+    point of a thermal zone device.
+
+    This function is usually called in the thermal zone device .bind callback.
+
+    tz:
+	  the thermal zone device
+    cdev:
+	  thermal cooling device
+    trip:
+	  indicates which trip point in this thermal zone the cooling device
+	  is associated with.
+    upper:
+	  the Maximum cooling state for this trip point.
+	  THERMAL_NO_LIMIT means no upper limit,
+	  and the cooling device can be in max_state.
+    lower:
+	  the Minimum cooling state can be used for this trip point.
+	  THERMAL_NO_LIMIT means no lower limit,
+	  and the cooling device can be in cooling state 0.
+    weight:
+	  the influence of this cooling device in this thermal
+	  zone.  See 1.4.1 below for more information.
+
+    ::
+
+	int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
+				int trip, struct thermal_cooling_device *cdev);
+
+    This interface function unbinds a thermal cooling device from a particular
+    trip point of a thermal zone device. This function is usually called in
+    the thermal zone device .unbind callback.
+
+    tz:
+	the thermal zone device
+    cdev:
+	thermal cooling device
+    trip:
+	indicates which trip point in this thermal zone the cooling device
+	is associated with.
+
+1.4 Thermal Zone Parameters
+---------------------------
+
+    ::
+
+	struct thermal_bind_params
+
+    This structure defines the following parameters that are used to bind
+    a zone with a cooling device for a particular trip point.
+
+    .cdev:
+	     The cooling device pointer
+    .weight:
+	     The 'influence' of a particular cooling device on this
+	     zone. This is relative to the rest of the cooling
+	     devices. For example, if all cooling devices have a
+	     weight of 1, then they all contribute the same. You can
+	     use percentages if you want, but it's not mandatory. A
+	     weight of 0 means that this cooling device doesn't
+	     contribute to the cooling of this zone unless all cooling
+	     devices have a weight of 0. If all weights are 0, then
+	     they all contribute the same.
+    .trip_mask:
+	       This is a bit mask that gives the binding relation between
+	       this thermal zone and cdev, for a particular trip point.
+	       If nth bit is set, then the cdev and thermal zone are bound
+	       for trip point n.
+    .binding_limits:
+		     This is an array of cooling state limits. Must have
+		     exactly 2 * thermal_zone.number_of_trip_points. It is an
+		     array consisting of tuples <lower-state upper-state> of
+		     state limits. Each trip will be associated with one state
+		     limit tuple when binding. A NULL pointer means
+		     <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips.
+		     These limits are used when binding a cdev to a trip point.
+    .match:
+	    This call back returns success(0) if the 'tz and cdev' need to
+	    be bound, as per platform data.
+
+    ::
+
+	struct thermal_zone_params
+
+    This structure defines the platform level parameters for a thermal zone.
+    This data, for each thermal zone should come from the platform layer.
+    This is an optional feature where some platforms can choose not to
+    provide this data.
+
+    .governor_name:
+	       Name of the thermal governor used for this zone
+    .no_hwmon:
+	       a boolean to indicate if the thermal to hwmon sysfs interface
+	       is required. when no_hwmon == false, a hwmon sysfs interface
+	       will be created. when no_hwmon == true, nothing will be done.
+	       In case the thermal_zone_params is NULL, the hwmon interface
+	       will be created (for backward compatibility).
+    .num_tbps:
+	       Number of thermal_bind_params entries for this zone
+    .tbp:
+	       thermal_bind_params entries
+
+2. sysfs attributes structure
+=============================
+
+==	================
+RO	read only value
+WO	write only value
+RW	read/write value
+==	================
+
+Thermal sysfs attributes will be represented under /sys/class/thermal.
+Hwmon sysfs I/F extension is also available under /sys/class/hwmon
+if hwmon is compiled in or built as a module.
+
+Thermal zone device sys I/F, created once it's registered::
+
+  /sys/class/thermal/thermal_zone[0-*]:
+    |---type:			Type of the thermal zone
+    |---temp:			Current temperature
+    |---mode:			Working mode of the thermal zone
+    |---policy:			Thermal governor used for this zone
+    |---available_policies:	Available thermal governors for this zone
+    |---trip_point_[0-*]_temp:	Trip point temperature
+    |---trip_point_[0-*]_type:	Trip point type
+    |---trip_point_[0-*]_hyst:	Hysteresis value for this trip point
+    |---emul_temp:		Emulated temperature set node
+    |---sustainable_power:      Sustainable dissipatable power
+    |---k_po:                   Proportional term during temperature overshoot
+    |---k_pu:                   Proportional term during temperature undershoot
+    |---k_i:                    PID's integral term in the power allocator gov
+    |---k_d:                    PID's derivative term in the power allocator
+    |---integral_cutoff:        Offset above which errors are accumulated
+    |---slope:                  Slope constant applied as linear extrapolation
+    |---offset:                 Offset constant applied as linear extrapolation
+
+Thermal cooling device sys I/F, created once it's registered::
+
+  /sys/class/thermal/cooling_device[0-*]:
+    |---type:			Type of the cooling device(processor/fan/...)
+    |---max_state:		Maximum cooling state of the cooling device
+    |---cur_state:		Current cooling state of the cooling device
+    |---stats:			Directory containing cooling device's statistics
+    |---stats/reset:		Writing any value resets the statistics
+    |---stats/time_in_state_ms:	Time (msec) spent in various cooling states
+    |---stats/total_trans:	Total number of times cooling state is changed
+    |---stats/trans_table:	Cooing state transition table
+
+
+Then next two dynamic attributes are created/removed in pairs. They represent
+the relationship between a thermal zone and its associated cooling device.
+They are created/removed for each successful execution of
+thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
+
+::
+
+  /sys/class/thermal/thermal_zone[0-*]:
+    |---cdev[0-*]:		[0-*]th cooling device in current thermal zone
+    |---cdev[0-*]_trip_point:	Trip point that cdev[0-*] is associated with
+    |---cdev[0-*]_weight:       Influence of the cooling device in
+				this thermal zone
+
+Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
+the generic thermal driver also creates a hwmon sysfs I/F for each _type_
+of thermal zone device. E.g. the generic thermal driver registers one hwmon
+class device and build the associated hwmon sysfs I/F for all the registered
+ACPI thermal zones.
+
+::
+
+  /sys/class/hwmon/hwmon[0-*]:
+    |---name:			The type of the thermal zone devices
+    |---temp[1-*]_input:	The current temperature of thermal zone [1-*]
+    |---temp[1-*]_critical:	The critical trip point of thermal zone [1-*]
+
+Please read Documentation/hwmon/sysfs-interface.rst for additional information.
+
+Thermal zone attributes
+-----------------------
+
+type
+	Strings which represent the thermal zone type.
+	This is given by thermal zone driver as part of registration.
+	E.g: "acpitz" indicates it's an ACPI thermal device.
+	In order to keep it consistent with hwmon sys attribute; this should
+	be a short, lowercase string, not containing spaces nor dashes.
+	RO, Required
+
+temp
+	Current temperature as reported by thermal zone (sensor).
+	Unit: millidegree Celsius
+	RO, Required
+
+mode
+	One of the predefined values in [enabled, disabled].
+	This file gives information about the algorithm that is currently
+	managing the thermal zone. It can be either default kernel based
+	algorithm or user space application.
+
+	enabled
+			  enable Kernel Thermal management.
+	disabled
+			  Preventing kernel thermal zone driver actions upon
+			  trip points so that user application can take full
+			  charge of the thermal management.
+
+	RW, Optional
+
+policy
+	One of the various thermal governors used for a particular zone.
+
+	RW, Required
+
+available_policies
+	Available thermal governors which can be used for a particular zone.
+
+	RO, Required
+
+`trip_point_[0-*]_temp`
+	The temperature above which trip point will be fired.
+
+	Unit: millidegree Celsius
+
+	RO, Optional
+
+`trip_point_[0-*]_type`
+	Strings which indicate the type of the trip point.
+
+	E.g. it can be one of critical, hot, passive, `active[0-*]` for ACPI
+	thermal zone.
+
+	RO, Optional
+
+`trip_point_[0-*]_hyst`
+	The hysteresis value for a trip point, represented as an integer
+	Unit: Celsius
+	RW, Optional
+
+`cdev[0-*]`
+	Sysfs link to the thermal cooling device node where the sys I/F
+	for cooling device throttling control represents.
+
+	RO, Optional
+
+`cdev[0-*]_trip_point`
+	The trip point in this thermal zone which `cdev[0-*]` is associated
+	with; -1 means the cooling device is not associated with any trip
+	point.
+
+	RO, Optional
+
+`cdev[0-*]_weight`
+	The influence of `cdev[0-*]` in this thermal zone. This value
+	is relative to the rest of cooling devices in the thermal
+	zone. For example, if a cooling device has a weight double
+	than that of other, it's twice as effective in cooling the
+	thermal zone.
+
+	RW, Optional
+
+passive
+	Attribute is only present for zones in which the passive cooling
+	policy is not supported by native thermal driver. Default is zero
+	and can be set to a temperature (in millidegrees) to enable a
+	passive trip point for the zone. Activation is done by polling with
+	an interval of 1 second.
+
+	Unit: millidegrees Celsius
+
+	Valid values: 0 (disabled) or greater than 1000
+
+	RW, Optional
+
+emul_temp
+	Interface to set the emulated temperature method in thermal zone
+	(sensor). After setting this temperature, the thermal zone may pass
+	this temperature to platform emulation function if registered or
+	cache it locally. This is useful in debugging different temperature
+	threshold and its associated cooling action. This is write only node
+	and writing 0 on this node should disable emulation.
+	Unit: millidegree Celsius
+
+	WO, Optional
+
+	  WARNING:
+	    Be careful while enabling this option on production systems,
+	    because userland can easily disable the thermal policy by simply
+	    flooding this sysfs node with low temperature values.
+
+sustainable_power
+	An estimate of the sustained power that can be dissipated by
+	the thermal zone. Used by the power allocator governor. For
+	more information see Documentation/driver-api/thermal/power_allocator.rst
+
+	Unit: milliwatts
+
+	RW, Optional
+
+k_po
+	The proportional term of the power allocator governor's PID
+	controller during temperature overshoot. Temperature overshoot
+	is when the current temperature is above the "desired
+	temperature" trip point. For more information see
+	Documentation/driver-api/thermal/power_allocator.rst
+
+	RW, Optional
+
+k_pu
+	The proportional term of the power allocator governor's PID
+	controller during temperature undershoot. Temperature undershoot
+	is when the current temperature is below the "desired
+	temperature" trip point. For more information see
+	Documentation/driver-api/thermal/power_allocator.rst
+
+	RW, Optional
+
+k_i
+	The integral term of the power allocator governor's PID
+	controller. This term allows the PID controller to compensate
+	for long term drift. For more information see
+	Documentation/driver-api/thermal/power_allocator.rst
+
+	RW, Optional
+
+k_d
+	The derivative term of the power allocator governor's PID
+	controller. For more information see
+	Documentation/driver-api/thermal/power_allocator.rst
+
+	RW, Optional
+
+integral_cutoff
+	Temperature offset from the desired temperature trip point
+	above which the integral term of the power allocator
+	governor's PID controller starts accumulating errors. For
+	example, if integral_cutoff is 0, then the integral term only
+	accumulates error when temperature is above the desired
+	temperature trip point. For more information see
+	Documentation/driver-api/thermal/power_allocator.rst
+
+	Unit: millidegree Celsius
+
+	RW, Optional
+
+slope
+	The slope constant used in a linear extrapolation model
+	to determine a hotspot temperature based off the sensor's
+	raw readings. It is up to the device driver to determine
+	the usage of these values.
+
+	RW, Optional
+
+offset
+	The offset constant used in a linear extrapolation model
+	to determine a hotspot temperature based off the sensor's
+	raw readings. It is up to the device driver to determine
+	the usage of these values.
+
+	RW, Optional
+
+Cooling device attributes
+-------------------------
+
+type
+	String which represents the type of device, e.g:
+
+	- for generic ACPI: should be "Fan", "Processor" or "LCD"
+	- for memory controller device on intel_menlow platform:
+	  should be "Memory controller".
+
+	RO, Required
+
+max_state
+	The maximum permissible cooling state of this cooling device.
+
+	RO, Required
+
+cur_state
+	The current cooling state of this cooling device.
+	The value can any integer numbers between 0 and max_state:
+
+	- cur_state == 0 means no cooling
+	- cur_state == max_state means the maximum cooling.
+
+	RW, Required
+
+stats/reset
+	Writing any value resets the cooling device's statistics.
+	WO, Required
+
+stats/time_in_state_ms:
+	The amount of time spent by the cooling device in various cooling
+	states. The output will have "<state> <time>" pair in each line, which
+	will mean this cooling device spent <time> msec of time at <state>.
+	Output will have one line for each of the supported states.  usertime
+	units here is 10mS (similar to other time exported in /proc).
+	RO, Required
+
+
+stats/total_trans:
+	A single positive value showing the total number of times the state of a
+	cooling device is changed.
+
+	RO, Required
+
+stats/trans_table:
+	This gives fine grained information about all the cooling state
+	transitions. The cat output here is a two dimensional matrix, where an
+	entry <i,j> (row i, column j) represents the number of transitions from
+	State_i to State_j. If the transition table is bigger than PAGE_SIZE,
+	reading this will return an -EFBIG error.
+	RO, Required
+
+3. A simple implementation
+==========================
+
+ACPI thermal zone may support multiple trip points like critical, hot,
+passive, active. If an ACPI thermal zone supports critical, passive,
+active[0] and active[1] at the same time, it may register itself as a
+thermal_zone_device (thermal_zone1) with 4 trip points in all.
+It has one processor and one fan, which are both registered as
+thermal_cooling_device. Both are considered to have the same
+effectiveness in cooling the thermal zone.
+
+If the processor is listed in _PSL method, and the fan is listed in _AL0
+method, the sys I/F structure will be built like this::
+
+ /sys/class/thermal:
+  |thermal_zone1:
+    |---type:			acpitz
+    |---temp:			37000
+    |---mode:			enabled
+    |---policy:			step_wise
+    |---available_policies:	step_wise fair_share
+    |---trip_point_0_temp:	100000
+    |---trip_point_0_type:	critical
+    |---trip_point_1_temp:	80000
+    |---trip_point_1_type:	passive
+    |---trip_point_2_temp:	70000
+    |---trip_point_2_type:	active0
+    |---trip_point_3_temp:	60000
+    |---trip_point_3_type:	active1
+    |---cdev0:			--->/sys/class/thermal/cooling_device0
+    |---cdev0_trip_point:	1	/* cdev0 can be used for passive */
+    |---cdev0_weight:           1024
+    |---cdev1:			--->/sys/class/thermal/cooling_device3
+    |---cdev1_trip_point:	2	/* cdev1 can be used for active[0]*/
+    |---cdev1_weight:           1024
+
+  |cooling_device0:
+    |---type:			Processor
+    |---max_state:		8
+    |---cur_state:		0
+
+  |cooling_device3:
+    |---type:			Fan
+    |---max_state:		2
+    |---cur_state:		0
+
+ /sys/class/hwmon:
+  |hwmon0:
+    |---name:			acpitz
+    |---temp1_input:		37000
+    |---temp1_crit:		100000
+
+4. Export Symbol APIs
+=====================
+
+4.1. get_tz_trend
+-----------------
+
+This function returns the trend of a thermal zone, i.e the rate of change
+of temperature of the thermal zone. Ideally, the thermal sensor drivers
+are supposed to implement the callback. If they don't, the thermal
+framework calculated the trend by comparing the previous and the current
+temperature values.
+
+4.2. get_thermal_instance
+-------------------------
+
+This function returns the thermal_instance corresponding to a given
+{thermal_zone, cooling_device, trip_point} combination. Returns NULL
+if such an instance does not exist.
+
+4.3. thermal_notify_framework
+-----------------------------
+
+This function handles the trip events from sensor drivers. It starts
+throttling the cooling devices according to the policy configured.
+For CRITICAL and HOT trip points, this notifies the respective drivers,
+and does actual throttling for other trip points i.e ACTIVE and PASSIVE.
+The throttling policy is based on the configured platform data; if no
+platform data is provided, this uses the step_wise throttling policy.
+
+4.4. thermal_cdev_update
+------------------------
+
+This function serves as an arbitrator to set the state of a cooling
+device. It sets the cooling device to the deepest cooling state if
+possible.
+
+5. thermal_emergency_poweroff
+=============================
+
+On an event of critical trip temperature crossing. Thermal framework
+allows the system to shutdown gracefully by calling orderly_poweroff().
+In the event of a failure of orderly_poweroff() to shut down the system
+we are in danger of keeping the system alive at undesirably high
+temperatures. To mitigate this high risk scenario we program a work
+queue to fire after a pre-determined number of seconds to start
+an emergency shutdown of the device using the kernel_power_off()
+function. In case kernel_power_off() fails then finally
+emergency_restart() is called in the worst case.
+
+The delay should be carefully profiled so as to give adequate time for
+orderly_poweroff(). In case of failure of an orderly_poweroff() the
+emergency poweroff kicks in after the delay has elapsed and shuts down
+the system.
+
+If set to 0 emergency poweroff will not be supported. So a carefully
+profiled non-zero positive value is a must for emergerncy poweroff to be
+triggered.