summaryrefslogtreecommitdiffstats
path: root/Documentation/devicetree/bindings/thermal
diff options
context:
space:
mode:
authorDaniel Baumann <daniel.baumann@progress-linux.org>2024-04-27 10:05:51 +0000
committerDaniel Baumann <daniel.baumann@progress-linux.org>2024-04-27 10:05:51 +0000
commit5d1646d90e1f2cceb9f0828f4b28318cd0ec7744 (patch)
treea94efe259b9009378be6d90eb30d2b019d95c194 /Documentation/devicetree/bindings/thermal
parentInitial commit. (diff)
downloadlinux-5d1646d90e1f2cceb9f0828f4b28318cd0ec7744.tar.xz
linux-5d1646d90e1f2cceb9f0828f4b28318cd0ec7744.zip
Adding upstream version 5.10.209.upstream/5.10.209upstream
Signed-off-by: Daniel Baumann <daniel.baumann@progress-linux.org>
Diffstat (limited to 'Documentation/devicetree/bindings/thermal')
-rw-r--r--Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml164
-rw-r--r--Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt33
-rw-r--r--Documentation/devicetree/bindings/thermal/amlogic,thermal.yaml58
-rw-r--r--Documentation/devicetree/bindings/thermal/armada-thermal.txt41
-rw-r--r--Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml48
-rw-r--r--Documentation/devicetree/bindings/thermal/brcm,avs-tmon.txt23
-rw-r--r--Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt41
-rw-r--r--Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt37
-rw-r--r--Documentation/devicetree/bindings/thermal/brcm,sr-thermal.txt105
-rw-r--r--Documentation/devicetree/bindings/thermal/da9062-thermal.txt36
-rw-r--r--Documentation/devicetree/bindings/thermal/db8500-thermal.txt44
-rw-r--r--Documentation/devicetree/bindings/thermal/dove-thermal.txt18
-rw-r--r--Documentation/devicetree/bindings/thermal/exynos-thermal.txt106
-rw-r--r--Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt32
-rw-r--r--Documentation/devicetree/bindings/thermal/imx-thermal.yaml102
-rw-r--r--Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml62
-rw-r--r--Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt15
-rw-r--r--Documentation/devicetree/bindings/thermal/max77620_thermal.txt70
-rw-r--r--Documentation/devicetree/bindings/thermal/mediatek-thermal.txt48
-rw-r--r--Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt238
-rw-r--r--Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt33
-rw-r--r--Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt51
-rw-r--r--Documentation/devicetree/bindings/thermal/qcom-tsens.yaml179
-rw-r--r--Documentation/devicetree/bindings/thermal/qoriq-thermal.yaml114
-rw-r--r--Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml100
-rw-r--r--Documentation/devicetree/bindings/thermal/rcar-thermal.yaml145
-rw-r--r--Documentation/devicetree/bindings/thermal/rockchip-thermal.txt85
-rw-r--r--Documentation/devicetree/bindings/thermal/socionext,uniphier-thermal.yaml58
-rw-r--r--Documentation/devicetree/bindings/thermal/spear-thermal.txt14
-rw-r--r--Documentation/devicetree/bindings/thermal/sprd-thermal.yaml111
-rw-r--r--Documentation/devicetree/bindings/thermal/st,stm32-thermal.yaml79
-rw-r--r--Documentation/devicetree/bindings/thermal/st-thermal.txt32
-rw-r--r--Documentation/devicetree/bindings/thermal/tango-thermal.txt17
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml118
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt95
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-idle.yaml146
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-sensor.yaml74
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-zones.yaml342
-rw-r--r--Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml56
-rw-r--r--Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt88
-rw-r--r--Documentation/devicetree/bindings/thermal/zx2967-thermal.txt116
41 files changed, 3374 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
new file mode 100644
index 000000000..31edd0512
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
@@ -0,0 +1,164 @@
+# SPDX-License-Identifier: GPL-2.0
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/allwinner,sun8i-a83t-ths.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Allwinner SUN8I Thermal Controller Device Tree Bindings
+
+maintainers:
+ - Vasily Khoruzhick <anarsoul@gmail.com>
+ - Yangtao Li <tiny.windzz@gmail.com>
+
+properties:
+ compatible:
+ enum:
+ - allwinner,sun8i-a83t-ths
+ - allwinner,sun8i-h3-ths
+ - allwinner,sun8i-r40-ths
+ - allwinner,sun50i-a64-ths
+ - allwinner,sun50i-a100-ths
+ - allwinner,sun50i-h5-ths
+ - allwinner,sun50i-h6-ths
+
+ clocks:
+ minItems: 1
+ maxItems: 2
+ items:
+ - description: Bus Clock
+ - description: Module Clock
+
+ clock-names:
+ minItems: 1
+ maxItems: 2
+ items:
+ - const: bus
+ - const: mod
+
+ reg:
+ maxItems: 1
+
+ interrupts:
+ maxItems: 1
+
+ resets:
+ maxItems: 1
+
+ nvmem-cells:
+ maxItems: 1
+ description: Calibration data for thermal sensors
+
+ nvmem-cell-names:
+ const: calibration
+
+ # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
+ "#thermal-sensor-cells":
+ enum:
+ - 0
+ - 1
+
+allOf:
+ - if:
+ properties:
+ compatible:
+ contains:
+ enum:
+ - allwinner,sun50i-a100-ths
+ - allwinner,sun50i-h6-ths
+
+ then:
+ properties:
+ clocks:
+ maxItems: 1
+
+ clock-names:
+ maxItems: 1
+
+ else:
+ properties:
+ clocks:
+ minItems: 2
+
+ clock-names:
+ minItems: 2
+
+ - if:
+ properties:
+ compatible:
+ contains:
+ const: allwinner,sun8i-h3-ths
+
+ then:
+ properties:
+ "#thermal-sensor-cells":
+ const: 0
+
+ else:
+ properties:
+ "#thermal-sensor-cells":
+ const: 1
+
+ - if:
+ properties:
+ compatible:
+ contains:
+ enum:
+ - const: allwinner,sun8i-h3-ths
+ - const: allwinner,sun8i-r40-ths
+ - const: allwinner,sun50i-a64-ths
+ - const: allwinner,sun50i-a100-ths
+ - const: allwinner,sun50i-h5-ths
+ - const: allwinner,sun50i-h6-ths
+
+ then:
+ required:
+ - clocks
+ - clock-names
+ - resets
+
+required:
+ - compatible
+ - reg
+ - interrupts
+ - '#thermal-sensor-cells'
+
+additionalProperties: false
+
+examples:
+ - |
+ thermal-sensor@1f04000 {
+ compatible = "allwinner,sun8i-a83t-ths";
+ reg = <0x01f04000 0x100>;
+ interrupts = <0 31 0>;
+ nvmem-cells = <&ths_calibration>;
+ nvmem-cell-names = "calibration";
+ #thermal-sensor-cells = <1>;
+ };
+
+ - |
+ thermal-sensor@1c25000 {
+ compatible = "allwinner,sun8i-h3-ths";
+ reg = <0x01c25000 0x400>;
+ clocks = <&ccu 0>, <&ccu 1>;
+ clock-names = "bus", "mod";
+ resets = <&ccu 2>;
+ interrupts = <0 31 0>;
+ nvmem-cells = <&ths_calibration>;
+ nvmem-cell-names = "calibration";
+ #thermal-sensor-cells = <0>;
+ };
+
+ - |
+ thermal-sensor@5070400 {
+ compatible = "allwinner,sun50i-h6-ths";
+ reg = <0x05070400 0x100>;
+ clocks = <&ccu 0>;
+ clock-names = "bus";
+ resets = <&ccu 2>;
+ interrupts = <0 15 0>;
+ nvmem-cells = <&ths_calibration>;
+ nvmem-cell-names = "calibration";
+ #thermal-sensor-cells = <1>;
+ };
+
+...
diff --git a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
new file mode 100644
index 000000000..12fc4ef04
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
@@ -0,0 +1,33 @@
+Amazon's Annapurna Labs Thermal Sensor
+
+Simple thermal device that allows temperature reading by a single MMIO
+transaction.
+
+Required properties:
+- compatible: "amazon,al-thermal".
+- reg: The physical base address and length of the sensor's registers.
+- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
+
+Example:
+ thermal: thermal {
+ compatible = "amazon,al-thermal";
+ reg = <0x0 0x05002860 0x0 0x1>;
+ #thermal-sensor-cells = <0x1>;
+ };
+
+ thermal-zones {
+ thermal-z0 {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+ thermal-sensors = <&thermal 0>;
+ trips {
+ critical {
+ temperature = <105000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+
+ };
+ };
+
diff --git a/Documentation/devicetree/bindings/thermal/amlogic,thermal.yaml b/Documentation/devicetree/bindings/thermal/amlogic,thermal.yaml
new file mode 100644
index 000000000..999c6b365
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/amlogic,thermal.yaml
@@ -0,0 +1,58 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/amlogic,thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Amlogic Thermal
+
+maintainers:
+ - Guillaume La Roque <glaroque@baylibre.com>
+
+description: Binding for Amlogic Thermal
+
+properties:
+ compatible:
+ items:
+ - enum:
+ - amlogic,g12a-cpu-thermal
+ - amlogic,g12a-ddr-thermal
+ - const: amlogic,g12a-thermal
+
+ reg:
+ maxItems: 1
+
+ interrupts:
+ maxItems: 1
+
+ clocks:
+ maxItems: 1
+
+ amlogic,ao-secure:
+ description: phandle to the ao-secure syscon
+ $ref: '/schemas/types.yaml#/definitions/phandle'
+
+ '#thermal-sensor-cells':
+ const: 0
+
+required:
+ - compatible
+ - reg
+ - interrupts
+ - clocks
+ - amlogic,ao-secure
+
+additionalProperties: false
+
+examples:
+ - |
+ cpu_temp: temperature-sensor@ff634800 {
+ compatible = "amlogic,g12a-cpu-thermal",
+ "amlogic,g12a-thermal";
+ reg = <0xff634800 0x50>;
+ interrupts = <0x0 0x24 0x0>;
+ clocks = <&clk 164>;
+ #thermal-sensor-cells = <0>;
+ amlogic,ao-secure = <&sec_AO>;
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/armada-thermal.txt b/Documentation/devicetree/bindings/thermal/armada-thermal.txt
new file mode 100644
index 000000000..b0bee7e42
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/armada-thermal.txt
@@ -0,0 +1,41 @@
+* Marvell Armada 370/375/380/XP thermal management
+
+Required properties:
+
+- compatible: Should be set to one of the following:
+ * marvell,armada370-thermal
+ * marvell,armada375-thermal
+ * marvell,armada380-thermal
+ * marvell,armadaxp-thermal
+ * marvell,armada-ap806-thermal
+ * marvell,armada-cp110-thermal
+
+Note: these bindings are deprecated for AP806/CP110 and should instead
+follow the rules described in:
+Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
+Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
+
+- reg: Device's register space.
+ Two entries are expected, see the examples below. The first one points
+ to the status register (4B). The second one points to the control
+ registers (8B).
+ Note: The compatibles marvell,armada370-thermal,
+ marvell,armada380-thermal, and marvell,armadaxp-thermal must point to
+ "control MSB/control 1", with size of 4 (deprecated binding), or point
+ to "control LSB/control 0" with size of 8 (current binding). All other
+ compatibles must point to "control LSB/control 0" with size of 8.
+
+Examples:
+
+ /* Legacy bindings */
+ thermal@d0018300 {
+ compatible = "marvell,armada370-thermal";
+ reg = <0xd0018300 0x4
+ 0xd0018304 0x4>;
+ };
+
+ ap_thermal: thermal@6f8084 {
+ compatible = "marvell,armada-ap806-thermal";
+ reg = <0x6f808C 0x4>,
+ <0x6f8084 0x8>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
new file mode 100644
index 000000000..1ab5070c7
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
@@ -0,0 +1,48 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/brcm,avs-ro-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Broadcom AVS ring oscillator thermal
+
+maintainers:
+ - Stefan Wahren <wahrenst@gmx.net>
+
+description: |+
+ The thermal node should be the child of a syscon node with the
+ required property:
+
+ - compatible: Should be one of the following:
+ "brcm,bcm2711-avs-monitor", "syscon", "simple-mfd"
+
+ Refer to the the bindings described in
+ Documentation/devicetree/bindings/mfd/syscon.yaml
+
+properties:
+ compatible:
+ const: brcm,bcm2711-thermal
+
+ # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
+ "#thermal-sensor-cells":
+ const: 0
+
+required:
+ - compatible
+ - '#thermal-sensor-cells'
+
+additionalProperties: false
+
+examples:
+ - |
+ avs-monitor@7d5d2000 {
+ compatible = "brcm,bcm2711-avs-monitor",
+ "syscon", "simple-mfd";
+ reg = <0x7d5d2000 0xf00>;
+
+ thermal: thermal {
+ compatible = "brcm,bcm2711-thermal";
+ #thermal-sensor-cells = <0>;
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.txt b/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.txt
new file mode 100644
index 000000000..74a9ef09d
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.txt
@@ -0,0 +1,23 @@
+* Broadcom STB thermal management
+
+Thermal management core, provided by the AVS TMON hardware block.
+
+Required properties:
+- compatible: must be one of:
+ "brcm,avs-tmon-bcm7216"
+ "brcm,avs-tmon-bcm7445"
+ "brcm,avs-tmon"
+- reg: address range for the AVS TMON registers
+- interrupts: temperature monitor interrupt, for high/low threshold triggers,
+ required except for "brcm,avs-tmon-bcm7216"
+- interrupt-names: should be "tmon"
+
+Example:
+
+ thermal@f04d1500 {
+ compatible = "brcm,avs-tmon-bcm7445", "brcm,avs-tmon";
+ reg = <0xf04d1500 0x28>;
+ interrupts = <0x6>;
+ interrupt-names = "tmon";
+ interrupt-parent = <&avs_host_l2_intc>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
new file mode 100644
index 000000000..a3e9ec5dc
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
@@ -0,0 +1,41 @@
+Binding for Thermal Sensor driver for BCM2835 SoCs.
+
+Required parameters:
+-------------------
+
+compatible: should be one of: "brcm,bcm2835-thermal",
+ "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal"
+reg: Address range of the thermal registers.
+clocks: Phandle of the clock used by the thermal sensor.
+#thermal-sensor-cells: should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
+
+Example:
+
+thermal-zones {
+ cpu_thermal: cpu-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&thermal>;
+
+ trips {
+ cpu-crit {
+ temperature = <80000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+
+ coefficients = <(-538) 407000>;
+
+ cooling-maps {
+ };
+ };
+};
+
+thermal: thermal@7e212000 {
+ compatible = "brcm,bcm2835-thermal";
+ reg = <0x7e212000 0x8>;
+ clocks = <&clocks BCM2835_CLOCK_TSENS>;
+ #thermal-sensor-cells = <0>;
+};
diff --git a/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt
new file mode 100644
index 000000000..68e047170
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt
@@ -0,0 +1,37 @@
+* Broadcom Northstar Thermal
+
+This binding describes thermal sensor that is part of Northstar's DMU (Device
+Management Unit).
+
+Required properties:
+- compatible : Must be "brcm,ns-thermal"
+- reg : iomem address range of PVTMON registers
+- #thermal-sensor-cells : Should be <0>
+
+Example:
+
+thermal: thermal@1800c2c0 {
+ compatible = "brcm,ns-thermal";
+ reg = <0x1800c2c0 0x10>;
+ #thermal-sensor-cells = <0>;
+};
+
+thermal-zones {
+ cpu_thermal: cpu-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <1000>;
+ coefficients = <(-556) 418000>;
+ thermal-sensors = <&thermal>;
+
+ trips {
+ cpu-crit {
+ temperature = <125000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ };
+ };
+};
diff --git a/Documentation/devicetree/bindings/thermal/brcm,sr-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,sr-thermal.txt
new file mode 100644
index 000000000..3ab330219
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/brcm,sr-thermal.txt
@@ -0,0 +1,105 @@
+* Broadcom Stingray Thermal
+
+This binding describes thermal sensors that is part of Stingray SoCs.
+
+Required properties:
+- compatible : Must be "brcm,sr-thermal"
+- reg : Memory where tmon data will be available.
+- brcm,tmon-mask: A one cell bit mask of valid TMON sources.
+ Each bit represents single TMON source.
+- #thermal-sensor-cells : Thermal sensor phandler
+- polling-delay: Max number of milliseconds to wait between polls.
+- thermal-sensors: A list of thermal sensor phandles and specifier.
+ specifier value is tmon ID and it should be
+ in correspond with brcm,tmon-mask.
+- temperature: trip temperature threshold in millicelsius.
+
+Example:
+ tmons {
+ compatible = "simple-bus";
+ #address-cells = <1>;
+ #size-cells = <1>;
+ ranges = <0x0 0x0 0x8f100000 0x100>;
+
+ tmon: tmon@0 {
+ compatible = "brcm,sr-thermal";
+ reg = <0x0 0x40>;
+ brcm,tmon-mask = <0x3f>;
+ #thermal-sensor-cells = <1>;
+ };
+ };
+
+ thermal-zones {
+ ihost0_thermal: ihost0-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <1000>;
+ thermal-sensors = <&tmon 0>;
+ trips {
+ cpu-crit {
+ temperature = <105000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+ };
+ ihost1_thermal: ihost1-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <1000>;
+ thermal-sensors = <&tmon 1>;
+ trips {
+ cpu-crit {
+ temperature = <105000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+ };
+ ihost2_thermal: ihost2-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <1000>;
+ thermal-sensors = <&tmon 2>;
+ trips {
+ cpu-crit {
+ temperature = <105000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+ };
+ ihost3_thermal: ihost3-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <1000>;
+ thermal-sensors = <&tmon 3>;
+ trips {
+ cpu-crit {
+ temperature = <105000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+ };
+ crmu_thermal: crmu-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <1000>;
+ thermal-sensors = <&tmon 4>;
+ trips {
+ cpu-crit {
+ temperature = <105000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+ };
+ nitro_thermal: nitro-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <1000>;
+ thermal-sensors = <&tmon 5>;
+ trips {
+ cpu-crit {
+ temperature = <105000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/da9062-thermal.txt b/Documentation/devicetree/bindings/thermal/da9062-thermal.txt
new file mode 100644
index 000000000..e241bb5a5
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/da9062-thermal.txt
@@ -0,0 +1,36 @@
+* Dialog DA9062/61 TJUNC Thermal Module
+
+This module is part of the DA9061/DA9062. For more details about entire
+DA9062 and DA9061 chips see Documentation/devicetree/bindings/mfd/da9062.txt
+
+Junction temperature thermal module uses an interrupt signal to identify
+high THERMAL_TRIP_HOT temperatures for the PMIC device.
+
+Required properties:
+
+- compatible: should be one of the following valid compatible string lines:
+ "dlg,da9061-thermal", "dlg,da9062-thermal"
+ "dlg,da9062-thermal"
+
+Optional properties:
+
+- polling-delay-passive : Specify the polling period, measured in
+ milliseconds, between thermal zone device update checks.
+
+Example: DA9062
+
+ pmic0: da9062@58 {
+ thermal {
+ compatible = "dlg,da9062-thermal";
+ polling-delay-passive = <3000>;
+ };
+ };
+
+Example: DA9061 using a fall-back compatible for the DA9062 onkey driver
+
+ pmic0: da9061@58 {
+ thermal {
+ compatible = "dlg,da9061-thermal", "dlg,da9062-thermal";
+ polling-delay-passive = <3000>;
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/db8500-thermal.txt b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt
new file mode 100644
index 000000000..2e1c06fad
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt
@@ -0,0 +1,44 @@
+* ST-Ericsson DB8500 Thermal
+
+** Thermal node properties:
+
+- compatible : "stericsson,db8500-thermal";
+- reg : address range of the thermal sensor registers;
+- interrupts : interrupts generated from PRCMU;
+- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH";
+- num-trips : number of total trip points, this is required, set it 0 if none,
+ if greater than 0, the following properties must be defined;
+- tripN-temp : temperature of trip point N, should be in ascending order;
+- tripN-type : type of trip point N, should be one of "active" "passive" "hot"
+ "critical";
+- tripN-cdev-num : number of the cooling devices which can be bound to trip
+ point N, this is required if trip point N is defined, set it 0 if none,
+ otherwise the following cooling device names must be defined;
+- tripN-cdev-nameM : name of the No. M cooling device of trip point N;
+
+Usually the num-trips and tripN-*** are separated in board related dts files.
+
+Example:
+thermal@801573c0 {
+ compatible = "stericsson,db8500-thermal";
+ reg = <0x801573c0 0x40>;
+ interrupts = <21 0x4>, <22 0x4>;
+ interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";
+
+ num-trips = <3>;
+
+ trip0-temp = <75000>;
+ trip0-type = "active";
+ trip0-cdev-num = <1>;
+ trip0-cdev-name0 = "thermal-cpufreq-0";
+
+ trip1-temp = <80000>;
+ trip1-type = "active";
+ trip1-cdev-num = <2>;
+ trip1-cdev-name0 = "thermal-cpufreq-0";
+ trip1-cdev-name1 = "thermal-fan";
+
+ trip2-temp = <85000>;
+ trip2-type = "critical";
+ trip2-cdev-num = <0>;
+}
diff --git a/Documentation/devicetree/bindings/thermal/dove-thermal.txt b/Documentation/devicetree/bindings/thermal/dove-thermal.txt
new file mode 100644
index 000000000..6f474677d
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/dove-thermal.txt
@@ -0,0 +1,18 @@
+* Dove Thermal
+
+This driver is for Dove SoCs which contain a thermal sensor.
+
+Required properties:
+- compatible : "marvell,dove-thermal"
+- reg : Address range of the thermal registers
+
+The reg properties should contain two ranges. The first is for the
+three Thermal Manager registers, while the second range contains the
+Thermal Diode Control Registers.
+
+Example:
+
+ thermal@10078 {
+ compatible = "marvell,dove-thermal";
+ reg = <0xd001c 0x0c>, <0xd005c 0x08>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/exynos-thermal.txt b/Documentation/devicetree/bindings/thermal/exynos-thermal.txt
new file mode 100644
index 000000000..33004ce7e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/exynos-thermal.txt
@@ -0,0 +1,106 @@
+* Exynos Thermal Management Unit (TMU)
+
+** Required properties:
+
+- compatible : One of the following:
+ "samsung,exynos3250-tmu"
+ "samsung,exynos4412-tmu"
+ "samsung,exynos4210-tmu"
+ "samsung,exynos5250-tmu"
+ "samsung,exynos5260-tmu"
+ "samsung,exynos5420-tmu" for TMU channel 0, 1 on Exynos5420
+ "samsung,exynos5420-tmu-ext-triminfo" for TMU channels 2, 3 and 4
+ Exynos5420 (Must pass triminfo base and triminfo clock)
+ "samsung,exynos5433-tmu"
+ "samsung,exynos7-tmu"
+- reg : Address range of the thermal registers. For soc's which has multiple
+ instances of TMU and some registers are shared across all TMU's like
+ interrupt related then 2 set of register has to supplied. First set
+ belongs to register set of TMU instance and second set belongs to
+ registers shared with the TMU instance.
+
+ NOTE: On Exynos5420, the TRIMINFO register is misplaced for TMU
+ channels 2, 3 and 4
+ Use "samsung,exynos5420-tmu-ext-triminfo" in cases, there is a misplaced
+ register, also provide clock to access that base.
+
+ TRIMINFO at 0x1006c000 contains data for TMU channel 3
+ TRIMINFO at 0x100a0000 contains data for TMU channel 4
+ TRIMINFO at 0x10068000 contains data for TMU channel 2
+
+- interrupts : Should contain interrupt for thermal system
+- clocks : The main clocks for TMU device
+ -- 1. operational clock for TMU channel
+ -- 2. optional clock to access the shared registers of TMU channel
+ -- 3. optional special clock for functional operation
+- clock-names : Thermal system clock name
+ -- "tmu_apbif" operational clock for current TMU channel
+ -- "tmu_triminfo_apbif" clock to access the shared triminfo register
+ for current TMU channel
+ -- "tmu_sclk" clock for functional operation of the current TMU
+ channel
+
+The Exynos TMU supports generating interrupts when reaching given
+temperature thresholds. Number of supported thermal trip points depends
+on the SoC (only first trip points defined in DT will be configured):
+ - most of SoC: 4
+ - samsung,exynos5433-tmu: 8
+ - samsung,exynos7-tmu: 8
+
+** Optional properties:
+
+- vtmu-supply: This entry is optional and provides the regulator node supplying
+ voltage to TMU. If needed this entry can be placed inside
+ board/platform specific dts file.
+
+Example 1):
+
+ tmu@100c0000 {
+ compatible = "samsung,exynos4412-tmu";
+ interrupt-parent = <&combiner>;
+ reg = <0x100C0000 0x100>;
+ interrupts = <2 4>;
+ clocks = <&clock 383>;
+ clock-names = "tmu_apbif";
+ vtmu-supply = <&tmu_regulator_node>;
+ #thermal-sensor-cells = <0>;
+ };
+
+Example 2): (In case of Exynos5420 "with misplaced TRIMINFO register")
+ tmu_cpu2: tmu@10068000 {
+ compatible = "samsung,exynos5420-tmu-ext-triminfo";
+ reg = <0x10068000 0x100>, <0x1006c000 0x4>;
+ interrupts = <0 184 0>;
+ clocks = <&clock 318>, <&clock 318>;
+ clock-names = "tmu_apbif", "tmu_triminfo_apbif";
+ #thermal-sensor-cells = <0>;
+ };
+
+ tmu_cpu3: tmu@1006c000 {
+ compatible = "samsung,exynos5420-tmu-ext-triminfo";
+ reg = <0x1006c000 0x100>, <0x100a0000 0x4>;
+ interrupts = <0 185 0>;
+ clocks = <&clock 318>, <&clock 319>;
+ clock-names = "tmu_apbif", "tmu_triminfo_apbif";
+ #thermal-sensor-cells = <0>;
+ };
+
+ tmu_gpu: tmu@100a0000 {
+ compatible = "samsung,exynos5420-tmu-ext-triminfo";
+ reg = <0x100a0000 0x100>, <0x10068000 0x4>;
+ interrupts = <0 215 0>;
+ clocks = <&clock 319>, <&clock 318>;
+ clock-names = "tmu_apbif", "tmu_triminfo_apbif";
+ #thermal-sensor-cells = <0>;
+ };
+
+Note: For multi-instance tmu each instance should have an alias correctly
+numbered in "aliases" node.
+
+Example:
+
+aliases {
+ tmuctrl0 = &tmuctrl_0;
+ tmuctrl1 = &tmuctrl_1;
+ tmuctrl2 = &tmuctrl_2;
+};
diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
new file mode 100644
index 000000000..4b19d80e6
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
@@ -0,0 +1,32 @@
+* Temperature Sensor on hisilicon SoCs
+
+** Required properties :
+
+- compatible: "hisilicon,tsensor".
+- reg: physical base address of thermal sensor and length of memory mapped
+ region.
+- interrupt: The interrupt number to the cpu. Defines the interrupt used
+ by /SOCTHERM/tsensor.
+- clock-names: Input clock name, should be 'thermal_clk'.
+- clocks: phandles for clock specified in "clock-names" property.
+- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
+
+Example :
+
+for Hi6220:
+ tsensor: tsensor@0,f7030700 {
+ compatible = "hisilicon,tsensor";
+ reg = <0x0 0xf7030700 0x0 0x1000>;
+ interrupts = <0 7 0x4>;
+ clocks = <&sys_ctrl HI6220_TSENSOR_CLK>;
+ clock-names = "thermal_clk";
+ #thermal-sensor-cells = <1>;
+ }
+
+for Hi3660:
+ tsensor: tsensor@fff30000 {
+ compatible = "hisilicon,hi3660-tsensor";
+ reg = <0x0 0xfff30000 0x0 0x1000>;
+ interrupts = <GIC_SPI 145 IRQ_TYPE_LEVEL_HIGH>;
+ #thermal-sensor-cells = <1>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/imx-thermal.yaml b/Documentation/devicetree/bindings/thermal/imx-thermal.yaml
new file mode 100644
index 000000000..16b57f57d
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/imx-thermal.yaml
@@ -0,0 +1,102 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/imx-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: NXP i.MX Thermal Binding
+
+maintainers:
+ - Shawn Guo <shawnguo@kernel.org>
+ - Anson Huang <Anson.Huang@nxp.com>
+
+properties:
+ compatible:
+ enum:
+ - fsl,imx6q-tempmon
+ - fsl,imx6sx-tempmon
+ - fsl,imx7d-tempmon
+
+ interrupts:
+ description: |
+ The interrupt output of the controller, i.MX6Q has IRQ_HIGH which
+ will be triggered when temperature is higher than high threshold,
+ i.MX6SX and i.MX7S/D have two more IRQs than i.MX6Q, one is IRQ_LOW
+ and the other is IRQ_PANIC, when temperature is lower than low
+ threshold, IRQ_LOW will be triggered, when temperature is higher
+ than panic threshold, IRQ_PANIC will be triggered, and system can
+ be configured to auto reboot by SRC module for IRQ_PANIC. IRQ_HIGH,
+ IRQ_LOW and IRQ_PANIC share same interrupt output of controller.
+ maxItems: 1
+
+ nvmem-cells:
+ items:
+ - description: Phandle to the calibration data provided by ocotp
+ - description: Phandle to the temperature grade provided by ocotp
+
+ nvmem-cell-names:
+ items:
+ - const: calib
+ - const: temp_grade
+
+ fsl,tempmon:
+ $ref: '/schemas/types.yaml#/definitions/phandle'
+ description: Phandle to anatop system controller node.
+
+ fsl,tempmon-data:
+ $ref: '/schemas/types.yaml#/definitions/phandle'
+ description: |
+ Deprecated property, phandle pointer to fuse controller that contains
+ TEMPMON calibration data, e.g. OCOTP on imx6q. The details about
+ calibration data can be found in SoC Reference Manual.
+ deprecated: true
+
+ clocks:
+ maxItems: 1
+
+required:
+ - compatible
+ - interrupts
+ - fsl,tempmon
+ - nvmem-cells
+ - nvmem-cell-names
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/clock/imx6sx-clock.h>
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+
+ efuse@21bc000 {
+ #address-cells = <1>;
+ #size-cells = <1>;
+ compatible = "fsl,imx6sx-ocotp", "syscon";
+ reg = <0x021bc000 0x4000>;
+ clocks = <&clks IMX6SX_CLK_OCOTP>;
+
+ tempmon_calib: calib@38 {
+ reg = <0x38 4>;
+ };
+
+ tempmon_temp_grade: temp-grade@20 {
+ reg = <0x20 4>;
+ };
+ };
+
+ anatop@20c8000 {
+ compatible = "fsl,imx6q-anatop", "syscon", "simple-mfd";
+ reg = <0x020c8000 0x1000>;
+ interrupts = <0 49 IRQ_TYPE_LEVEL_HIGH>,
+ <0 54 IRQ_TYPE_LEVEL_HIGH>,
+ <0 127 IRQ_TYPE_LEVEL_HIGH>;
+
+ tempmon {
+ compatible = "fsl,imx6sx-tempmon";
+ interrupts = <GIC_SPI 49 IRQ_TYPE_LEVEL_HIGH>;
+ fsl,tempmon = <&anatop>;
+ nvmem-cells = <&tempmon_calib>, <&tempmon_temp_grade>;
+ nvmem-cell-names = "calib", "temp_grade";
+ clocks = <&clks IMX6SX_CLK_PLL3_USB_OTG>;
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml b/Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml
new file mode 100644
index 000000000..89c54e08e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml
@@ -0,0 +1,62 @@
+# SPDX-License-Identifier: GPL-2.0
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/imx8mm-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: NXP i.MX8M Mini Thermal Binding
+
+maintainers:
+ - Anson Huang <Anson.Huang@nxp.com>
+
+description: |
+ i.MX8MM has TMU IP to allow temperature measurement, there are
+ currently two distinct major versions of the IP that is supported
+ by a single driver. The IP versions are named v1 and v2, v1 is
+ for i.MX8MM which has ONLY 1 sensor, v2 is for i.MX8MP which has
+ 2 sensors.
+
+properties:
+ compatible:
+ oneOf:
+ - enum:
+ - fsl,imx8mm-tmu
+ - fsl,imx8mp-tmu
+ - items:
+ - const: fsl,imx8mn-tmu
+ - const: fsl,imx8mm-tmu
+
+ reg:
+ maxItems: 1
+
+ clocks:
+ maxItems: 1
+
+ "#thermal-sensor-cells":
+ description: |
+ Number of cells required to uniquely identify the thermal
+ sensors, 0 for ONLY one sensor and 1 for multiple sensors.
+ enum:
+ - 0
+ - 1
+
+required:
+ - compatible
+ - reg
+ - clocks
+ - '#thermal-sensor-cells'
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/clock/imx8mm-clock.h>
+
+ thermal-sensor@30260000 {
+ compatible = "fsl,imx8mm-tmu";
+ reg = <0x30260000 0x10000>;
+ clocks = <&clk IMX8MM_CLK_TMU_ROOT>;
+ #thermal-sensor-cells = <0>;
+ };
+
+...
diff --git a/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt b/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt
new file mode 100644
index 000000000..8c0f5eb86
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt
@@ -0,0 +1,15 @@
+* Kirkwood Thermal
+
+This version is for Kirkwood 88F8262 & 88F6283 SoCs. Other kirkwoods
+don't contain a thermal sensor.
+
+Required properties:
+- compatible : "marvell,kirkwood-thermal"
+- reg : Address range of the thermal registers
+
+Example:
+
+ thermal@10078 {
+ compatible = "marvell,kirkwood-thermal";
+ reg = <0x10078 0x4>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
new file mode 100644
index 000000000..82ed5d487
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
@@ -0,0 +1,70 @@
+Thermal driver for MAX77620 Power management IC from Maxim Semiconductor.
+
+Maxim Semiconductor MAX77620 supports alarm interrupts when its
+die temperature crosses 120C and 140C. These threshold temperatures
+are not configurable. Device does not provide the real temperature
+of die other than just indicating whether temperature is above or
+below threshold level.
+
+Required properties:
+-------------------
+#thermal-sensor-cells: For more details, please refer to
+ <devicetree/bindings/thermal/thermal-sensor.yaml>
+ The value must be 0.
+
+For more details, please refer generic thermal DT binding document
+<devicetree/bindings/thermal/thermal*.yaml>.
+
+Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding
+document for the MAX77620.
+
+Example:
+--------
+#include <dt-bindings/mfd/max77620.h>
+#include <dt-bindings/thermal/thermal.h>
+...
+
+i2c@7000d000 {
+ spmic: max77620@3c {
+ compatible = "maxim,max77620";
+ :::::
+ #thermal-sensor-cells = <0>;
+ :::
+ };
+};
+
+cool_dev: cool-dev {
+ compatible = "cooling-dev";
+ #cooling-cells = <2>;
+};
+
+thermal-zones {
+ PMIC-Die {
+ polling-delay = <0>;
+ polling-delay-passive = <0>;
+ thermal-sensors = <&spmic>;
+
+ trips {
+ pmic_die_warn_temp_thresh: hot-die {
+ temperature = <120000>;
+ type = "hot";
+ hysteresis = <0>;
+ };
+
+ pmic_die_cirt_temp_thresh: cirtical-die {
+ temperature = <140000>;
+ type = "critical";
+ hysteresis = <0>;
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&pmic_die_warn_temp_thresh>;
+ cooling-device = <&cool_dev THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>;
+ contribution = <100>;
+ };
+ };
+ };
+};
diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
new file mode 100644
index 000000000..1e249c42f
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
@@ -0,0 +1,48 @@
+* Mediatek Thermal
+
+This describes the device tree binding for the Mediatek thermal controller
+which measures the on-SoC temperatures. This device does not have its own ADC,
+instead it directly controls the AUXADC via AHB bus accesses. For this reason
+this device needs phandles to the AUXADC. Also it controls a mux in the
+apmixedsys register space via AHB bus accesses, so a phandle to the APMIXEDSYS
+is also needed.
+
+Required properties:
+- compatible:
+ - "mediatek,mt8173-thermal" : For MT8173 family of SoCs
+ - "mediatek,mt2701-thermal" : For MT2701 family of SoCs
+ - "mediatek,mt2712-thermal" : For MT2712 family of SoCs
+ - "mediatek,mt7622-thermal" : For MT7622 SoC
+ - "mediatek,mt8183-thermal" : For MT8183 family of SoCs
+- reg: Address range of the thermal controller
+- interrupts: IRQ for the thermal controller
+- clocks, clock-names: Clocks needed for the thermal controller. required
+ clocks are:
+ "therm": Main clock needed for register access
+ "auxadc": The AUXADC clock
+- resets: Reference to the reset controller controlling the thermal controller.
+- mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses
+- mediatek,apmixedsys: A phandle to the APMIXEDSYS controller.
+- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
+
+Optional properties:
+- nvmem-cells: A phandle to the calibration data provided by a nvmem device. If
+ unspecified default values shall be used.
+- nvmem-cell-names: Should be "calibration-data"
+
+Example:
+
+ thermal: thermal@1100b000 {
+ #thermal-sensor-cells = <1>;
+ compatible = "mediatek,mt8173-thermal";
+ reg = <0 0x1100b000 0 0x1000>;
+ interrupts = <0 70 IRQ_TYPE_LEVEL_LOW>;
+ clocks = <&pericfg CLK_PERI_THERM>, <&pericfg CLK_PERI_AUXADC>;
+ clock-names = "therm", "auxadc";
+ resets = <&pericfg MT8173_PERI_THERM_SW_RST>;
+ reset-names = "therm";
+ mediatek,auxadc = <&auxadc>;
+ mediatek,apmixedsys = <&apmixedsys>;
+ nvmem-cells = <&thermal_calibration_data>;
+ nvmem-cell-names = "calibration-data";
+ };
diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
new file mode 100644
index 000000000..db880e7ed
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
@@ -0,0 +1,238 @@
+Tegra124 SOCTHERM thermal management system
+
+The SOCTHERM IP block contains thermal sensors, support for polled
+or interrupt-based thermal monitoring, CPU and GPU throttling based
+on temperature trip points, and handling external overcurrent
+notifications. It is also used to manage emergency shutdown in an
+overheating situation.
+
+Required properties :
+- compatible : For Tegra124, must contain "nvidia,tegra124-soctherm".
+ For Tegra132, must contain "nvidia,tegra132-soctherm".
+ For Tegra210, must contain "nvidia,tegra210-soctherm".
+- reg : Should contain at least 2 entries for each entry in reg-names:
+ - SOCTHERM register set
+ - Tegra CAR register set: Required for Tegra124 and Tegra210.
+ - CCROC register set: Required for Tegra132.
+- reg-names : Should contain at least 2 entries:
+ - soctherm-reg
+ - car-reg
+ - ccroc-reg
+- interrupts : Defines the interrupt used by SOCTHERM
+- clocks : Must contain an entry for each entry in clock-names.
+ See ../clocks/clock-bindings.txt for details.
+- clock-names : Must include the following entries:
+ - tsensor
+ - soctherm
+- resets : Must contain an entry for each entry in reset-names.
+ See ../reset/reset.txt for details.
+- reset-names : Must include the following entries:
+ - soctherm
+- #thermal-sensor-cells : Should be 1. For a description of this property, see
+ Documentation/devicetree/bindings/thermal/thermal-sensor.yaml.
+ See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values
+ when referring to thermal sensors.
+- throttle-cfgs: A sub-node which is a container of configuration for each
+ hardware throttle events. These events can be set as cooling devices.
+ * throttle events: Sub-nodes must be named as "light" or "heavy".
+ Properties:
+ - nvidia,priority: Each throttles has its own throttle settings, so the
+ SW need to set priorities for various throttle, the HW arbiter can select
+ the final throttle settings.
+ Bigger value indicates higher priority, In general, higher priority
+ translates to lower target frequency. SW needs to ensure that critical
+ thermal alarms are given higher priority, and ensure that there is
+ no race if priority of two vectors is set to the same value.
+ The range of this value is 1~100.
+ - nvidia,cpu-throt-percent: This property is for Tegra124 and Tegra210.
+ It is the throttling depth of pulse skippers, it's the percentage
+ throttling.
+ - nvidia,cpu-throt-level: This property is only for Tegra132, it is the
+ level of pulse skippers, which used to throttle clock frequencies. It
+ indicates cpu clock throttling depth, and the depth can be programmed.
+ Must set as following values:
+ TEGRA_SOCTHERM_THROT_LEVEL_LOW, TEGRA_SOCTHERM_THROT_LEVEL_MED
+ TEGRA_SOCTHERM_THROT_LEVEL_HIGH, TEGRA_SOCTHERM_THROT_LEVEL_NONE
+ - nvidia,gpu-throt-level: This property is for Tegra124 and Tegra210.
+ It is the level of pulse skippers, which used to throttle clock
+ frequencies. It indicates gpu clock throttling depth and can be
+ programmed to any of the following values which represent a throttling
+ percentage:
+ TEGRA_SOCTHERM_THROT_LEVEL_NONE (0%)
+ TEGRA_SOCTHERM_THROT_LEVEL_LOW (50%),
+ TEGRA_SOCTHERM_THROT_LEVEL_MED (75%),
+ TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%).
+ - #cooling-cells: Should be 1. This cooling device only support on/off state.
+ For a description of this property see:
+ Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
+
+ Optional properties: The following properties are T210 specific and
+ valid only for OCx throttle events.
+ - nvidia,count-threshold: Specifies the number of OC events that are
+ required for triggering an interrupt. Interrupts are not triggered if
+ the property is missing. A value of 0 will interrupt on every OC alarm.
+ - nvidia,polarity-active-low: Configures the polarity of the OC alaram
+ signal. If present, this means assert low, otherwise assert high.
+ - nvidia,alarm-filter: Number of clocks to filter event. When the filter
+ expires (which means the OC event has not occurred for a long time),
+ the counter is cleared and filter is rearmed. Default value is 0.
+ - nvidia,throttle-period-us: Specifies the number of uSec for which
+ throttling is engaged after the OC event is deasserted. Default value
+ is 0.
+
+Optional properties:
+- nvidia,thermtrips : When present, this property specifies the temperature at
+ which the soctherm hardware will assert the thermal trigger signal to the
+ Power Management IC, which can be configured to reset or shutdown the device.
+ It is an array of pairs where each pair represents a tsensor id followed by a
+ temperature in milli Celcius. In the absence of this property the critical
+ trip point will be used for thermtrip temperature.
+
+Note:
+- the "critical" type trip points will be used to set the temperature at which
+the SOC_THERM hardware will assert a thermal trigger if the "nvidia,thermtrips"
+property is missing. When the thermtrips property is present, the breach of a
+critical trip point is reported back to the thermal framework to implement
+software shutdown.
+
+- the "hot" type trip points will be set to SOC_THERM hardware as the throttle
+temperature. Once the the temperature of this thermal zone is higher
+than it, it will trigger the HW throttle event.
+
+Example :
+
+ soctherm@700e2000 {
+ compatible = "nvidia,tegra124-soctherm";
+ reg = <0x0 0x700e2000 0x0 0x600 /* SOC_THERM reg_base */
+ 0x0 0x60006000 0x0 0x400 /* CAR reg_base */
+ reg-names = "soctherm-reg", "car-reg";
+ interrupts = <GIC_SPI 48 IRQ_TYPE_LEVEL_HIGH>;
+ clocks = <&tegra_car TEGRA124_CLK_TSENSOR>,
+ <&tegra_car TEGRA124_CLK_SOC_THERM>;
+ clock-names = "tsensor", "soctherm";
+ resets = <&tegra_car 78>;
+ reset-names = "soctherm";
+
+ #thermal-sensor-cells = <1>;
+
+ nvidia,thermtrips = <TEGRA124_SOCTHERM_SENSOR_CPU 102500
+ TEGRA124_SOCTHERM_SENSOR_GPU 103000>;
+
+ throttle-cfgs {
+ /*
+ * When the "heavy" cooling device triggered,
+ * the HW will skip cpu clock's pulse in 85% depth,
+ * skip gpu clock's pulse in 85% level
+ */
+ throttle_heavy: heavy {
+ nvidia,priority = <100>;
+ nvidia,cpu-throt-percent = <85>;
+ nvidia,gpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_HIGH>;
+
+ #cooling-cells = <1>;
+ };
+
+ /*
+ * When the "light" cooling device triggered,
+ * the HW will skip cpu clock's pulse in 50% depth,
+ * skip gpu clock's pulse in 50% level
+ */
+ throttle_light: light {
+ nvidia,priority = <80>;
+ nvidia,cpu-throt-percent = <50>;
+ nvidia,gpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_LOW>;
+
+ #cooling-cells = <1>;
+ };
+
+ /*
+ * If these two devices are triggered in same time, the HW throttle
+ * arbiter will select the highest priority as the final throttle
+ * settings to skip cpu pulse.
+ */
+
+ throttle_oc1: oc1 {
+ nvidia,priority = <50>;
+ nvidia,polarity-active-low;
+ nvidia,count-threshold = <100>;
+ nvidia,alarm-filter = <5100000>;
+ nvidia,throttle-period-us = <0>;
+ nvidia,cpu-throt-percent = <75>;
+ nvidia,gpu-throt-level =
+ <TEGRA_SOCTHERM_THROT_LEVEL_MED>;
+ };
+ };
+ };
+
+Example: referring to Tegra132's "reg", "reg-names" and "throttle-cfgs" :
+
+ soctherm@700e2000 {
+ compatible = "nvidia,tegra132-soctherm";
+ reg = <0x0 0x700e2000 0x0 0x600 /* SOC_THERM reg_base */
+ 0x0 0x70040000 0x0 0x200>; /* CCROC reg_base */;
+ reg-names = "soctherm-reg", "ccroc-reg";
+
+ throttle-cfgs {
+ /*
+ * When the "heavy" cooling device triggered,
+ * the HW will skip cpu clock's pulse in HIGH level
+ */
+ throttle_heavy: heavy {
+ nvidia,priority = <100>;
+ nvidia,cpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_HIGH>;
+
+ #cooling-cells = <1>;
+ };
+
+ /*
+ * When the "light" cooling device triggered,
+ * the HW will skip cpu clock's pulse in MED level
+ */
+ throttle_light: light {
+ nvidia,priority = <80>;
+ nvidia,cpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_MED>;
+
+ #cooling-cells = <1>;
+ };
+
+ /*
+ * If these two devices are triggered in same time, the HW throttle
+ * arbiter will select the highest priority as the final throttle
+ * settings to skip cpu pulse.
+ */
+
+ };
+ };
+
+Example: referring to thermal sensors :
+
+ thermal-zones {
+ cpu {
+ polling-delay-passive = <1000>;
+ polling-delay = <1000>;
+
+ thermal-sensors =
+ <&soctherm TEGRA124_SOCTHERM_SENSOR_CPU>;
+
+ trips {
+ cpu_shutdown_trip: shutdown-trip {
+ temperature = <102500>;
+ hysteresis = <1000>;
+ type = "critical";
+ };
+
+ cpu_throttle_trip: throttle-trip {
+ temperature = <100000>;
+ hysteresis = <1000>;
+ type = "hot";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu_throttle_trip>;
+ cooling-device = <&throttle_heavy 1 1>;
+ };
+ };
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
new file mode 100644
index 000000000..fc87f6aa1
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
@@ -0,0 +1,33 @@
+NVIDIA Tegra186 BPMP thermal sensor
+
+In Tegra186, the BPMP (Boot and Power Management Processor) implements an
+interface that is used to read system temperatures, including CPU cluster
+and GPU temperatures. This binding describes the thermal sensor that is
+exposed by BPMP.
+
+The BPMP thermal node must be located directly inside the main BPMP node. See
+../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding.
+
+This node represents a thermal sensor. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details of the
+core thermal binding.
+
+Required properties:
+- compatible:
+ Array of strings.
+ One of:
+ - "nvidia,tegra186-bpmp-thermal"
+ - "nvidia,tegra194-bpmp-thermal"
+- #thermal-sensor-cells: Cell for sensor index.
+ Single-cell integer.
+ Must be <1>.
+
+Example:
+
+bpmp {
+ ...
+
+ bpmp_thermal: thermal {
+ compatible = "nvidia,tegra186-bpmp-thermal";
+ #thermal-sensor-cells = <1>;
+ };
+};
diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
new file mode 100644
index 000000000..2d5b2ad03
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
@@ -0,0 +1,51 @@
+Qualcomm QPNP PMIC Temperature Alarm
+
+QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips
+that utilize the Qualcomm SPMI implementation. These peripherals provide an
+interrupt signal and status register to identify high PMIC die temperature.
+
+Required properties:
+- compatible: Should contain "qcom,spmi-temp-alarm".
+- reg: Specifies the SPMI address.
+- interrupts: PMIC temperature alarm interrupt.
+- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
+
+Optional properties:
+- io-channels: Should contain IIO channel specifier for the ADC channel,
+ which report chip die temperature.
+- io-channel-names: Should contain "thermal".
+
+Example:
+
+ pm8941_temp: thermal-alarm@2400 {
+ compatible = "qcom,spmi-temp-alarm";
+ reg = <0x2400>;
+ interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>;
+ #thermal-sensor-cells = <0>;
+
+ io-channels = <&pm8941_vadc VADC_DIE_TEMP>;
+ io-channel-names = "thermal";
+ };
+
+ thermal-zones {
+ pm8941 {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&pm8941_temp>;
+
+ trips {
+ stage1 {
+ temperature = <105000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+ stage2 {
+ temperature = <125000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+ };
+ };
+
diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
new file mode 100644
index 000000000..95462e071
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -0,0 +1,179 @@
+# SPDX-License-Identifier: (GPL-2.0 OR MIT)
+# Copyright 2019 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/qcom-tsens.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: QCOM SoC Temperature Sensor (TSENS)
+
+maintainers:
+ - Amit Kucheria <amitk@kernel.org>
+
+description: |
+ QCOM SoCs have TSENS IP to allow temperature measurement. There are currently
+ three distinct major versions of the IP that is supported by a single driver.
+ The IP versions are named v0.1, v1 and v2 in the driver, where v0.1 captures
+ everything before v1 when there was no versioning information.
+
+properties:
+ compatible:
+ oneOf:
+ - description: v0.1 of TSENS
+ items:
+ - enum:
+ - qcom,msm8916-tsens
+ - qcom,msm8939-tsens
+ - qcom,msm8974-tsens
+ - const: qcom,tsens-v0_1
+
+ - description: v1 of TSENS
+ items:
+ - enum:
+ - qcom,msm8976-tsens
+ - qcom,qcs404-tsens
+ - const: qcom,tsens-v1
+
+ - description: v2 of TSENS
+ items:
+ - enum:
+ - qcom,msm8996-tsens
+ - qcom,msm8998-tsens
+ - qcom,sc7180-tsens
+ - qcom,sdm845-tsens
+ - qcom,sm8150-tsens
+ - qcom,sm8250-tsens
+ - const: qcom,tsens-v2
+
+ reg:
+ items:
+ - description: TM registers
+ - description: SROT registers
+
+ interrupts:
+ minItems: 1
+ items:
+ - description: Combined interrupt if upper or lower threshold crossed
+ - description: Interrupt if critical threshold crossed
+
+ interrupt-names:
+ minItems: 1
+ items:
+ - const: uplow
+ - const: critical
+
+ nvmem-cells:
+ minItems: 1
+ maxItems: 2
+ description:
+ Reference to an nvmem node for the calibration data
+
+ nvmem-cell-names:
+ minItems: 1
+ maxItems: 2
+ items:
+ - const: calib
+ - const: calib_sel
+
+ "#qcom,sensors":
+ description:
+ Number of sensors enabled on this platform
+ $ref: /schemas/types.yaml#/definitions/uint32
+ minimum: 1
+ maximum: 16
+
+ "#thermal-sensor-cells":
+ const: 1
+ description:
+ Number of cells required to uniquely identify the thermal sensors. Since
+ we have multiple sensors this is set to 1
+
+allOf:
+ - if:
+ properties:
+ compatible:
+ contains:
+ enum:
+ - qcom,msm8916-tsens
+ - qcom,msm8974-tsens
+ - qcom,msm8976-tsens
+ - qcom,qcs404-tsens
+ - qcom,tsens-v0_1
+ - qcom,tsens-v1
+ then:
+ properties:
+ interrupts:
+ maxItems: 1
+ interrupt-names:
+ maxItems: 1
+
+ else:
+ properties:
+ interrupts:
+ minItems: 2
+ interrupt-names:
+ minItems: 2
+
+required:
+ - compatible
+ - reg
+ - "#qcom,sensors"
+ - interrupts
+ - interrupt-names
+ - "#thermal-sensor-cells"
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ // Example 1 (legacy: for pre v1 IP):
+ tsens1: thermal-sensor@900000 {
+ compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";
+ reg = <0x4a9000 0x1000>, /* TM */
+ <0x4a8000 0x1000>; /* SROT */
+
+ nvmem-cells = <&tsens_caldata>, <&tsens_calsel>;
+ nvmem-cell-names = "calib", "calib_sel";
+
+ interrupts = <GIC_SPI 184 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow";
+
+ #qcom,sensors = <5>;
+ #thermal-sensor-cells = <1>;
+ };
+
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ // Example 2 (for any platform containing v1 of the TSENS IP):
+ tsens2: thermal-sensor@4a9000 {
+ compatible = "qcom,qcs404-tsens", "qcom,tsens-v1";
+ reg = <0x004a9000 0x1000>, /* TM */
+ <0x004a8000 0x1000>; /* SROT */
+
+ nvmem-cells = <&tsens_caldata>;
+ nvmem-cell-names = "calib";
+
+ interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow";
+
+ #qcom,sensors = <10>;
+ #thermal-sensor-cells = <1>;
+ };
+
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ // Example 3 (for any platform containing v2 of the TSENS IP):
+ tsens3: thermal-sensor@c263000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0xc263000 0x1ff>,
+ <0xc222000 0x1ff>;
+
+ interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+
+ #qcom,sensors = <13>;
+ #thermal-sensor-cells = <1>;
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/qoriq-thermal.yaml b/Documentation/devicetree/bindings/thermal/qoriq-thermal.yaml
new file mode 100644
index 000000000..f09e8723c
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qoriq-thermal.yaml
@@ -0,0 +1,114 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/qoriq-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal Monitoring Unit (TMU) on Freescale QorIQ SoCs
+
+maintainers:
+ - Anson Huang <Anson.Huang@nxp.com>
+
+properties:
+ compatible:
+ description: |
+ The version of the device is determined by the TMU IP Block Revision
+ Register (IPBRR0) at offset 0x0BF8.
+ Table of correspondences between IPBRR0 values and example chips:
+ Value Device
+ ---------- -----
+ 0x01900102 T1040
+ enum:
+ - fsl,qoriq-tmu
+ - fsl,imx8mq-tmu
+
+ reg:
+ maxItems: 1
+
+ interrupts:
+ maxItems: 1
+
+ fsl,tmu-range:
+ $ref: '/schemas/types.yaml#/definitions/uint32-array'
+ description: |
+ The values to be programmed into TTRnCR, as specified by the SoC
+ reference manual. The first cell is TTR0CR, the second is TTR1CR, etc.
+ maxItems: 4
+
+ fsl,tmu-calibration:
+ $ref: '/schemas/types.yaml#/definitions/uint32-matrix'
+ description: |
+ A list of cell pairs containing temperature calibration data, as
+ specified by the SoC reference manual. The first cell of each pair
+ is the value to be written to TTCFGR, and the second is the value
+ to be written to TSCFGR.
+ items:
+ items:
+ - description: value for TTCFGR
+ - description: value for TSCFGR
+ minItems: 1
+ maxItems: 64
+
+ little-endian:
+ description: |
+ boolean, if present, the TMU registers are little endian. If absent,
+ the default is big endian.
+ type: boolean
+
+ clocks:
+ maxItems: 1
+
+ "#thermal-sensor-cells":
+ const: 1
+
+required:
+ - compatible
+ - reg
+ - interrupts
+ - fsl,tmu-range
+ - fsl,tmu-calibration
+ - '#thermal-sensor-cells'
+
+additionalProperties: false
+
+examples:
+ - |
+ tmu@f0000 {
+ compatible = "fsl,qoriq-tmu";
+ reg = <0xf0000 0x1000>;
+ interrupts = <18 2 0 0>;
+ fsl,tmu-range = <0x000a0000 0x00090026 0x0008004a 0x0001006a>;
+ fsl,tmu-calibration = <0x00000000 0x00000025>,
+ <0x00000001 0x00000028>,
+ <0x00000002 0x0000002d>,
+ <0x00000003 0x00000031>,
+ <0x00000004 0x00000036>,
+ <0x00000005 0x0000003a>,
+ <0x00000006 0x00000040>,
+ <0x00000007 0x00000044>,
+ <0x00000008 0x0000004a>,
+ <0x00000009 0x0000004f>,
+ <0x0000000a 0x00000054>,
+ <0x00010000 0x0000000d>,
+ <0x00010001 0x00000013>,
+ <0x00010002 0x00000019>,
+ <0x00010003 0x0000001f>,
+ <0x00010004 0x00000025>,
+ <0x00010005 0x0000002d>,
+ <0x00010006 0x00000033>,
+ <0x00010007 0x00000043>,
+ <0x00010008 0x0000004b>,
+ <0x00010009 0x00000053>,
+ <0x00020000 0x00000010>,
+ <0x00020001 0x00000017>,
+ <0x00020002 0x0000001f>,
+ <0x00020003 0x00000029>,
+ <0x00020004 0x00000031>,
+ <0x00020005 0x0000003c>,
+ <0x00020006 0x00000042>,
+ <0x00020007 0x0000004d>,
+ <0x00020008 0x00000056>,
+ <0x00030000 0x00000012>,
+ <0x00030001 0x0000001d>;
+ #thermal-sensor-cells = <1>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml
new file mode 100644
index 000000000..f386f2a7c
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml
@@ -0,0 +1,100 @@
+# SPDX-License-Identifier: GPL-2.0-only
+# Copyright (C) 2020 Renesas Electronics Corp.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/rcar-gen3-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Renesas R-Car Gen3 Thermal Sensor
+
+description:
+ On R-Car Gen3 SoCs, the thermal sensor controllers (TSC) control the thermal
+ sensors (THS) which are the analog circuits for measuring temperature (Tj)
+ inside the LSI.
+
+maintainers:
+ - Niklas Söderlund <niklas.soderlund@ragnatech.se>
+
+properties:
+ compatible:
+ enum:
+ - renesas,r8a774a1-thermal # RZ/G2M
+ - renesas,r8a774b1-thermal # RZ/G2N
+ - renesas,r8a774e1-thermal # RZ/G2H
+ - renesas,r8a7795-thermal # R-Car H3
+ - renesas,r8a7796-thermal # R-Car M3-W
+ - renesas,r8a77961-thermal # R-Car M3-W+
+ - renesas,r8a77965-thermal # R-Car M3-N
+ - renesas,r8a77980-thermal # R-Car V3H
+ reg:
+ minItems: 2
+ maxItems: 3
+ items:
+ - description: TSC1 registers
+ - description: TSC2 registers
+ - description: TSC3 registers
+
+ interrupts:
+ items:
+ - description: TEMP1 interrupt
+ - description: TEMP2 interrupt
+ - description: TEMP3 interrupt
+
+ clocks:
+ maxItems: 1
+
+ power-domains:
+ maxItems: 1
+
+ resets:
+ maxItems: 1
+
+ "#thermal-sensor-cells":
+ const: 1
+
+required:
+ - compatible
+ - reg
+ - interrupts
+ - clocks
+ - power-domains
+ - resets
+ - "#thermal-sensor-cells"
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/clock/r8a7795-cpg-mssr.h>
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/power/r8a7795-sysc.h>
+
+ tsc: thermal@e6198000 {
+ compatible = "renesas,r8a7795-thermal";
+ reg = <0xe6198000 0x100>,
+ <0xe61a0000 0x100>,
+ <0xe61a8000 0x100>;
+ interrupts = <GIC_SPI 67 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 68 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>;
+ clocks = <&cpg CPG_MOD 522>;
+ power-domains = <&sysc R8A7795_PD_ALWAYS_ON>;
+ resets = <&cpg 522>;
+ #thermal-sensor-cells = <1>;
+ };
+
+ thermal-zones {
+ sensor_thermal: sensor-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+ thermal-sensors = <&tsc 0>;
+
+ trips {
+ sensor1_crit: sensor1-crit {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/rcar-thermal.yaml b/Documentation/devicetree/bindings/thermal/rcar-thermal.yaml
new file mode 100644
index 000000000..7e9557ac0
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/rcar-thermal.yaml
@@ -0,0 +1,145 @@
+# SPDX-License-Identifier: GPL-2.0-only
+# Copyright (C) 2020 Renesas Electronics Corp.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/rcar-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Renesas R-Car Thermal
+
+maintainers:
+ - Niklas Söderlund <niklas.soderlund@ragnatech.se>
+
+properties:
+ compatible:
+ oneOf:
+ - items:
+ - enum:
+ - renesas,thermal-r8a73a4 # R-Mobile APE6
+ - renesas,thermal-r8a7779 # R-Car H1
+ - const: renesas,rcar-thermal # Generic without thermal-zone
+ - items:
+ - enum:
+ - renesas,thermal-r8a7742 # RZ/G1H
+ - renesas,thermal-r8a7743 # RZ/G1M
+ - renesas,thermal-r8a7744 # RZ/G1N
+ - const: renesas,rcar-gen2-thermal # Generic thermal-zone
+ - items:
+ - enum:
+ - renesas,thermal-r8a7790 # R-Car H2
+ - renesas,thermal-r8a7791 # R-Car M2-W
+ - renesas,thermal-r8a7792 # R-Car V2H
+ - renesas,thermal-r8a7793 # R-Car M2-N
+ - const: renesas,rcar-gen2-thermal # Generic thermal-zone
+ - const: renesas,rcar-thermal # Generic without thermal-zone
+ - items:
+ - enum:
+ - renesas,thermal-r8a774c0 # RZ/G2E
+ - renesas,thermal-r8a77970 # R-Car V3M
+ - renesas,thermal-r8a77990 # R-Car E3
+ - renesas,thermal-r8a77995 # R-Car D3
+ reg:
+ description:
+ Address ranges of the thermal registers. If more then one range is given
+ the first one must be the common registers followed by each sensor
+ according the the datasheet.
+ minItems: 1
+ maxItems: 4
+
+ interrupts:
+ minItems: 1
+ maxItems: 3
+
+ clocks:
+ maxItems: 1
+
+ power-domains:
+ maxItems: 1
+
+ resets:
+ maxItems: 1
+
+ "#thermal-sensor-cells":
+ const: 0
+
+if:
+ properties:
+ compatible:
+ contains:
+ enum:
+ - renesas,thermal-r8a73a4 # R-Mobile APE6
+ - renesas,thermal-r8a7779 # R-Car H1
+then:
+ required:
+ - compatible
+ - reg
+else:
+ required:
+ - compatible
+ - reg
+ - interrupts
+ - clocks
+ - power-domains
+ - resets
+
+additionalProperties: false
+
+examples:
+ # Example (non interrupt support)
+ - |
+ thermal@ffc48000 {
+ compatible = "renesas,thermal-r8a7779", "renesas,rcar-thermal";
+ reg = <0xffc48000 0x38>;
+ };
+
+ # Example (interrupt support)
+ - |
+ #include <dt-bindings/clock/r8a73a4-clock.h>
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/interrupt-controller/irq.h>
+
+ thermal@e61f0000 {
+ compatible = "renesas,thermal-r8a73a4", "renesas,rcar-thermal";
+ reg = <0xe61f0000 0x14>, <0xe61f0100 0x38>,
+ <0xe61f0200 0x38>, <0xe61f0300 0x38>;
+ interrupts = <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>;
+ clocks = <&mstp5_clks R8A73A4_CLK_THERMAL>;
+ power-domains = <&pd_c5>;
+ };
+
+ # Example (with thermal-zone)
+ - |
+ #include <dt-bindings/clock/r8a7790-cpg-mssr.h>
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/power/r8a7790-sysc.h>
+
+ thermal: thermal@e61f0000 {
+ compatible = "renesas,thermal-r8a7790",
+ "renesas,rcar-gen2-thermal",
+ "renesas,rcar-thermal";
+ reg = <0xe61f0000 0x10>, <0xe61f0100 0x38>;
+ interrupts = <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>;
+ clocks = <&cpg CPG_MOD 522>;
+ power-domains = <&sysc R8A7790_PD_ALWAYS_ON>;
+ resets = <&cpg 522>;
+ #thermal-sensor-cells = <0>;
+ };
+
+ thermal-zones {
+ cpu_thermal: cpu-thermal {
+ polling-delay-passive = <1000>;
+ polling-delay = <5000>;
+
+ thermal-sensors = <&thermal>;
+
+ trips {
+ cpu-crit {
+ temperature = <115000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+ cooling-maps {
+ };
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
new file mode 100644
index 000000000..7f94669e9
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
@@ -0,0 +1,85 @@
+* Temperature Sensor ADC (TSADC) on rockchip SoCs
+
+Required properties:
+- compatible : should be "rockchip,<name>-tsadc"
+ "rockchip,px30-tsadc": found on PX30 SoCs
+ "rockchip,rv1108-tsadc": found on RV1108 SoCs
+ "rockchip,rk3228-tsadc": found on RK3228 SoCs
+ "rockchip,rk3288-tsadc": found on RK3288 SoCs
+ "rockchip,rk3328-tsadc": found on RK3328 SoCs
+ "rockchip,rk3368-tsadc": found on RK3368 SoCs
+ "rockchip,rk3399-tsadc": found on RK3399 SoCs
+- reg : physical base address of the controller and length of memory mapped
+ region.
+- interrupts : The interrupt number to the cpu. The interrupt specifier format
+ depends on the interrupt controller.
+- clocks : Must contain an entry for each entry in clock-names.
+- clock-names : Shall be "tsadc" for the converter-clock, and "apb_pclk" for
+ the peripheral clock.
+- resets : Must contain an entry for each entry in reset-names.
+ See ../reset/reset.txt for details.
+- reset-names : Must include the name "tsadc-apb".
+- pinctrl-names : The pin control state names;
+- pinctrl-0 : The "init" pinctrl state, it will be set before device probe.
+- pinctrl-1 : The "default" pinctrl state, it will be set after reset the
+ TSADC controller.
+- pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend.
+- #thermal-sensor-cells : Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
+
+Optional properties:
+- rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value.
+- rockchip,hw-tshut-mode : The hardware-controlled shutdown mode 0:CRU 1:GPIO.
+- rockchip,hw-tshut-polarity : The hardware-controlled active polarity 0:LOW
+ 1:HIGH.
+- rockchip,grf : The phandle of the syscon node for the general register file.
+
+Exiample:
+tsadc: tsadc@ff280000 {
+ compatible = "rockchip,rk3288-tsadc";
+ reg = <0xff280000 0x100>;
+ interrupts = <GIC_SPI 37 IRQ_TYPE_LEVEL_HIGH>;
+ clocks = <&cru SCLK_TSADC>, <&cru PCLK_TSADC>;
+ clock-names = "tsadc", "apb_pclk";
+ resets = <&cru SRST_TSADC>;
+ reset-names = "tsadc-apb";
+ pinctrl-names = "init", "default", "sleep";
+ pinctrl-0 = <&otp_gpio>;
+ pinctrl-1 = <&otp_out>;
+ pinctrl-2 = <&otp_gpio>;
+ #thermal-sensor-cells = <1>;
+ rockchip,hw-tshut-temp = <95000>;
+ rockchip,hw-tshut-mode = <0>;
+ rockchip,hw-tshut-polarity = <0>;
+};
+
+Example: referring to thermal sensors:
+thermal-zones {
+ cpu_thermal: cpu_thermal {
+ polling-delay-passive = <1000>; /* milliseconds */
+ polling-delay = <5000>; /* milliseconds */
+
+ /* sensor ID */
+ thermal-sensors = <&tsadc 1>;
+
+ trips {
+ cpu_alert0: cpu_alert {
+ temperature = <70000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "passive";
+ };
+ cpu_crit: cpu_crit {
+ temperature = <90000>; /* millicelsius */
+ hysteresis = <2000>; /* millicelsius */
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu_alert0>;
+ cooling-device =
+ <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
+ };
+};
diff --git a/Documentation/devicetree/bindings/thermal/socionext,uniphier-thermal.yaml b/Documentation/devicetree/bindings/thermal/socionext,uniphier-thermal.yaml
new file mode 100644
index 000000000..553c9dcda
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/socionext,uniphier-thermal.yaml
@@ -0,0 +1,58 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/socionext,uniphier-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Socionext UniPhier thermal monitor
+
+description: |
+ This describes the devicetree bindings for thermal monitor supported by
+ PVT(Process, Voltage and Temperature) monitoring unit implemented on
+ Socionext UniPhier SoCs.
+
+maintainers:
+ - Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
+
+properties:
+ compatible:
+ enum:
+ - socionext,uniphier-pxs2-thermal
+ - socionext,uniphier-ld20-thermal
+ - socionext,uniphier-pxs3-thermal
+
+ interrupts:
+ maxItems: 1
+
+ "#thermal-sensor-cells":
+ const: 0
+
+ socionext,tmod-calibration:
+ $ref: /schemas/types.yaml#/definitions/uint32-array
+ maxItems: 2
+ description:
+ A pair of calibrated values referred from PVT, in case that the values
+ aren't set on SoC, like a reference board.
+
+required:
+ - compatible
+ - interrupts
+ - "#thermal-sensor-cells"
+
+additionalProperties: false
+
+examples:
+ - |
+ // The UniPhier thermal should be a subnode of a "syscon" compatible node.
+
+ sysctrl@61840000 {
+ compatible = "socionext,uniphier-ld20-sysctrl",
+ "simple-mfd", "syscon";
+ reg = <0x61840000 0x10000>;
+
+ pvtctl: thermal {
+ compatible = "socionext,uniphier-ld20-thermal";
+ interrupts = <0 3 1>;
+ #thermal-sensor-cells = <0>;
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/spear-thermal.txt b/Documentation/devicetree/bindings/thermal/spear-thermal.txt
new file mode 100644
index 000000000..93e3b67c1
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/spear-thermal.txt
@@ -0,0 +1,14 @@
+* SPEAr Thermal
+
+Required properties:
+- compatible : "st,thermal-spear1340"
+- reg : Address range of the thermal registers
+- st,thermal-flags: flags used to enable thermal sensor
+
+Example:
+
+ thermal@fc000000 {
+ compatible = "st,thermal-spear1340";
+ reg = <0xfc000000 0x1000>;
+ st,thermal-flags = <0x7000>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/sprd-thermal.yaml b/Documentation/devicetree/bindings/thermal/sprd-thermal.yaml
new file mode 100644
index 000000000..6d65a3cf2
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/sprd-thermal.yaml
@@ -0,0 +1,111 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/sprd-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Spreadtrum thermal sensor controller bindings
+
+maintainers:
+ - Orson Zhai <orsonzhai@gmail.com>
+ - Baolin Wang <baolin.wang7@gmail.com>
+ - Chunyan Zhang <zhang.lyra@gmail.com>
+
+properties:
+ compatible:
+ const: sprd,ums512-thermal
+
+ reg:
+ maxItems: 1
+
+ clocks:
+ maxItems: 1
+
+ clock-names:
+ items:
+ - const: enable
+
+ nvmem-cells:
+ maxItems: 2
+ description:
+ Reference to nvmem nodes for the calibration data.
+
+ nvmem-cell-names:
+ items:
+ - const: thm_sign_cal
+ - const: thm_ratio_cal
+
+ "#thermal-sensor-cells":
+ const: 1
+
+ "#address-cells":
+ const: 1
+
+ "#size-cells":
+ const: 0
+
+patternProperties:
+ "^([a-z]*-)?sensor(-section)?@[0-9]+$":
+ type: object
+ description:
+ Represent one thermal sensor.
+
+ properties:
+ reg:
+ description: Specify the sensor id.
+ maxItems: 1
+
+ nvmem-cells:
+ maxItems: 1
+ description:
+ Reference to an nvmem node for the calibration data.
+
+ nvmem-cell-names:
+ const: sen_delta_cal
+
+ required:
+ - reg
+ - nvmem-cells
+ - nvmem-cell-names
+
+ additionalProperties: false
+
+required:
+ - compatible
+ - reg
+ - clocks
+ - clock-names
+ - nvmem-cells
+ - nvmem-cell-names
+ - "#thermal-sensor-cells"
+ - "#address-cells"
+ - "#size-cells"
+
+additionalProperties: false
+
+examples:
+ - |
+ ap_thm0: thermal@32200000 {
+ compatible = "sprd,ums512-thermal";
+ reg = <0x32200000 0x10000>;
+ clock-names = "enable";
+ clocks = <&aonapb_gate 32>;
+ #thermal-sensor-cells = <1>;
+ nvmem-cells = <&thm0_sign>, <&thm0_ratio>;
+ nvmem-cell-names = "thm_sign_cal", "thm_ratio_cal";
+ #address-cells = <1>;
+ #size-cells = <0>;
+
+ prometheus-sensor@0 {
+ reg = <0>;
+ nvmem-cells = <&thm0_sen0>;
+ nvmem-cell-names = "sen_delta_cal";
+ };
+
+ ank-sensor@1 {
+ reg = <1>;
+ nvmem-cells = <&thm0_sen1>;
+ nvmem-cell-names = "sen_delta_cal";
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/st,stm32-thermal.yaml b/Documentation/devicetree/bindings/thermal/st,stm32-thermal.yaml
new file mode 100644
index 000000000..c0f59c560
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/st,stm32-thermal.yaml
@@ -0,0 +1,79 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/st,stm32-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: STMicroelectronics STM32 digital thermal sensor (DTS) binding
+
+maintainers:
+ - David Hernandez Sanchez <david.hernandezsanchez@st.com>
+
+properties:
+ compatible:
+ const: st,stm32-thermal
+
+ reg:
+ maxItems: 1
+
+ interrupts:
+ maxItems: 1
+
+ clocks:
+ maxItems: 1
+
+ clock-names:
+ items:
+ - const: pclk
+
+ "#thermal-sensor-cells":
+ const: 0
+
+required:
+ - "#thermal-sensor-cells"
+ - compatible
+ - reg
+ - interrupts
+ - clocks
+ - clock-names
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/clock/stm32mp1-clks.h>
+ dts: thermal@50028000 {
+ compatible = "st,stm32-thermal";
+ reg = <0x50028000 0x100>;
+ clocks = <&rcc TMPSENS>;
+ clock-names = "pclk";
+ #thermal-sensor-cells = <0>;
+ interrupts = <GIC_SPI 147 IRQ_TYPE_LEVEL_HIGH>;
+ };
+
+ thermal-zones {
+ cpu_thermal: cpu-thermal {
+ polling-delay-passive = <0>;
+ polling-delay = <0>;
+
+ thermal-sensors = <&dts>;
+ trips {
+ cpu_alert1: cpu-alert1 {
+ temperature = <85000>;
+ hysteresis = <0>;
+ type = "passive";
+ };
+
+ cpu_crit: cpu-crit {
+ temperature = <120000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ };
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/st-thermal.txt b/Documentation/devicetree/bindings/thermal/st-thermal.txt
new file mode 100644
index 000000000..a2f939137
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/st-thermal.txt
@@ -0,0 +1,32 @@
+Binding for Thermal Sensor driver for STMicroelectronics STi series of SoCs.
+
+Required parameters:
+-------------------
+
+compatible : Should be "st,stih407-thermal"
+
+clock-names : Should be "thermal".
+ See: Documentation/devicetree/bindings/resource-names.txt
+clocks : Phandle of the clock used by the thermal sensor.
+ See: Documentation/devicetree/bindings/clock/clock-bindings.txt
+
+Optional parameters:
+-------------------
+
+reg : For non-sysconf based sensors, this should be the physical base
+ address and length of the sensor's registers.
+interrupts : Standard way to define interrupt number.
+ NB: For thermal sensor's for which no interrupt has been
+ defined, a polling delay of 1000ms will be used to read the
+ temperature from device.
+
+Example:
+
+ temp0@91a0000 {
+ compatible = "st,stih407-thermal";
+ reg = <0x91a0000 0x28>;
+ clock-names = "thermal";
+ clocks = <&CLK_SYSIN>;
+ interrupts = <GIC_SPI 205 IRQ_TYPE_EDGE_RISING>;
+ st,passive_cooling_temp = <110>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
new file mode 100644
index 000000000..2c918d742
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
@@ -0,0 +1,17 @@
+* Tango Thermal
+
+The SMP8758 SoC includes 3 instances of this temperature sensor
+(in the CPU, video decoder, and PCIe controller).
+
+Required properties:
+- #thermal-sensor-cells: Should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
+- compatible: "sigma,smp8758-thermal"
+- reg: Address range of the thermal registers
+
+Example:
+
+ cpu_temp: thermal@920100 {
+ #thermal-sensor-cells = <0>;
+ compatible = "sigma,smp8758-thermal";
+ reg = <0x920100 12>;
+ };
diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
new file mode 100644
index 000000000..f004779ba
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
@@ -0,0 +1,118 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal cooling device binding
+
+maintainers:
+ - Amit Kucheria <amitk@kernel.org>
+
+description: |
+ Thermal management is achieved in devicetree by describing the sensor hardware
+ and the software abstraction of cooling devices and thermal zones required to
+ take appropriate action to mitigate thermal overload.
+
+ The following node types are used to completely describe a thermal management
+ system in devicetree:
+ - thermal-sensor: device that measures temperature, has SoC-specific bindings
+ - cooling-device: device used to dissipate heat either passively or actively
+ - thermal-zones: a container of the following node types used to describe all
+ thermal data for the platform
+
+ This binding describes the cooling devices.
+
+ There are essentially two ways to provide control on power dissipation:
+ - Passive cooling: by means of regulating device performance. A typical
+ passive cooling mechanism is a CPU that has dynamic voltage and frequency
+ scaling (DVFS), and uses lower frequencies as cooling states.
+ - Active cooling: by means of activating devices in order to remove the
+ dissipated heat, e.g. regulating fan speeds.
+
+ Any cooling device has a range of cooling states (i.e. different levels of
+ heat dissipation). They also have a way to determine the state of cooling in
+ which the device is. For example, a fan's cooling states correspond to the
+ different fan speeds possible. Cooling states are referred to by single
+ unsigned integers, where larger numbers mean greater heat dissipation. The
+ precise set of cooling states associated with a device should be defined in
+ a particular device's binding.
+
+select: true
+
+properties:
+ "#cooling-cells":
+ description:
+ Must be 2, in order to specify minimum and maximum cooling state used in
+ the cooling-maps reference. The first cell is the minimum cooling state
+ and the second cell is the maximum cooling state requested.
+ const: 2
+
+additionalProperties: true
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/thermal/thermal.h>
+
+ // Example 1: Cpufreq cooling device on CPU0
+ cpus {
+ #address-cells = <2>;
+ #size-cells = <0>;
+
+ CPU0: cpu@0 {
+ device_type = "cpu";
+ compatible = "qcom,kryo385";
+ reg = <0x0 0x0>;
+ enable-method = "psci";
+ cpu-idle-states = <&LITTLE_CPU_SLEEP_0
+ &LITTLE_CPU_SLEEP_1
+ &CLUSTER_SLEEP_0>;
+ capacity-dmips-mhz = <607>;
+ dynamic-power-coefficient = <100>;
+ qcom,freq-domain = <&cpufreq_hw 0>;
+ #cooling-cells = <2>;
+ next-level-cache = <&L2_0>;
+ L2_0: l2-cache {
+ compatible = "cache";
+ next-level-cache = <&L3_0>;
+ L3_0: l3-cache {
+ compatible = "cache";
+ };
+ };
+ };
+
+ /* ... */
+
+ };
+
+ /* ... */
+
+ thermal-zones {
+ cpu0-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 1>;
+
+ trips {
+ cpu0_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu0_alert0>;
+ /* Corresponds to 1000MHz in OPP table */
+ cooling-device = <&CPU0 5 5>;
+ };
+ };
+ };
+
+ /* ... */
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
new file mode 100644
index 000000000..e136946a2
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
@@ -0,0 +1,95 @@
+General Purpose Analog To Digital Converter (ADC) based thermal sensor.
+
+On some of platforms, thermal sensor like thermistors are connected to
+one of ADC channel and sensor resistance is read via voltage across the
+sensor resistor. The voltage read across the sensor is mapped to
+temperature using voltage-temperature lookup table.
+
+Required properties:
+===================
+- compatible: Must be "generic-adc-thermal".
+- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description
+ of this property.
+Optional properties:
+===================
+- temperature-lookup-table: Two dimensional array of Integer; lookup table
+ to map the relation between ADC value and
+ temperature. When ADC is read, the value is
+ looked up on the table to get the equivalent
+ temperature.
+
+ The first value of the each row of array is the
+ temperature in milliCelsius and second value of
+ the each row of array is the ADC read value.
+
+ If not specified, driver assumes the ADC channel
+ gives milliCelsius directly.
+
+Example :
+#include <dt-bindings/thermal/thermal.h>
+
+i2c@7000c400 {
+ ads1015: ads1015@4a {
+ reg = <0x4a>;
+ compatible = "ads1015";
+ sampling-frequency = <3300>;
+ #io-channel-cells = <1>;
+ };
+};
+
+tboard_thermistor: thermal-sensor {
+ compatible = "generic-adc-thermal";
+ #thermal-sensor-cells = <0>;
+ io-channels = <&ads1015 1>;
+ io-channel-names = "sensor-channel";
+ temperature-lookup-table = < (-40000) 2578
+ (-39000) 2577
+ (-38000) 2576
+ (-37000) 2575
+ (-36000) 2574
+ (-35000) 2573
+ (-34000) 2572
+ (-33000) 2571
+ (-32000) 2569
+ (-31000) 2568
+ (-30000) 2567
+ ::::::::::
+ 118000 254
+ 119000 247
+ 120000 240
+ 121000 233
+ 122000 226
+ 123000 220
+ 124000 214
+ 125000 208>;
+};
+
+dummy_cool_dev: dummy-cool-dev {
+ compatible = "dummy-cooling-dev";
+ #cooling-cells = <2>; /* min followed by max */
+};
+
+thermal-zones {
+ Tboard {
+ polling-delay = <15000>; /* milliseconds */
+ polling-delay-passive = <0>; /* milliseconds */
+ thermal-sensors = <&tboard_thermistor>;
+
+ trips {
+ therm_est_trip: therm_est_trip {
+ temperature = <40000>;
+ type = "active";
+ hysteresis = <1000>;
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&therm_est_trip>;
+ cooling-device = <&dummy_cool_dev THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ contribution = <100>;
+ };
+
+ };
+ };
+};
diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
new file mode 100644
index 000000000..6278ccf16
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
@@ -0,0 +1,146 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal idle cooling device binding
+
+maintainers:
+ - Daniel Lezcano <daniel.lezcano@linaro.org>
+
+description: |
+ The thermal idle cooling device allows the system to passively
+ mitigate the temperature on the device by injecting idle cycles,
+ forcing it to cool down.
+
+ This binding describes the thermal idle node.
+
+properties:
+ $nodename:
+ const: thermal-idle
+ description: |
+ A thermal-idle node describes the idle cooling device properties to
+ cool down efficiently the attached thermal zone.
+
+ '#cooling-cells':
+ const: 2
+ description: |
+ Must be 2, in order to specify minimum and maximum cooling state used in
+ the cooling-maps reference. The first cell is the minimum cooling state
+ and the second cell is the maximum cooling state requested.
+
+ duration-us:
+ description: |
+ The idle duration in microsecond the device should cool down.
+
+ exit-latency-us:
+ description: |
+ The exit latency constraint in microsecond for the injected idle state
+ for the device. It is the latency constraint to apply when selecting an
+ idle state from among all the present ones.
+
+required:
+ - '#cooling-cells'
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/thermal/thermal.h>
+
+ // Example: Combining idle cooling device on big CPUs with cpufreq cooling device
+ cpus {
+ #address-cells = <2>;
+ #size-cells = <0>;
+
+ /* ... */
+
+ cpu_b0: cpu@100 {
+ device_type = "cpu";
+ compatible = "arm,cortex-a72";
+ reg = <0x0 0x100>;
+ enable-method = "psci";
+ capacity-dmips-mhz = <1024>;
+ dynamic-power-coefficient = <436>;
+ #cooling-cells = <2>; /* min followed by max */
+ cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
+ };
+
+ cpu_b1: cpu@101 {
+ device_type = "cpu";
+ compatible = "arm,cortex-a72";
+ reg = <0x0 0x101>;
+ enable-method = "psci";
+ capacity-dmips-mhz = <1024>;
+ dynamic-power-coefficient = <436>;
+ #cooling-cells = <2>; /* min followed by max */
+ cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
+ };
+
+ /* ... */
+
+ };
+
+ /* ... */
+
+ thermal_zones {
+ cpu_thermal: cpu {
+ polling-delay-passive = <100>;
+ polling-delay = <1000>;
+
+ /* ... */
+
+ trips {
+ cpu_alert0: cpu_alert0 {
+ temperature = <65000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_alert1: cpu_alert1 {
+ temperature = <70000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_alert2: cpu_alert2 {
+ temperature = <75000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_crit: cpu_crit {
+ temperature = <95000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu_alert1>;
+ cooling-device = <&{/cpus/cpu@100/thermal-idle} 0 15 >,
+ <&{/cpus/cpu@101/thermal-idle} 0 15>;
+ };
+
+ map1 {
+ trip = <&cpu_alert2>;
+ cooling-device =
+ <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+ <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
new file mode 100644
index 000000000..9f747921e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
@@ -0,0 +1,74 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal sensor binding
+
+maintainers:
+ - Amit Kucheria <amitk@kernel.org>
+
+description: |
+ Thermal management is achieved in devicetree by describing the sensor hardware
+ and the software abstraction of thermal zones required to take appropriate
+ action to mitigate thermal overloads.
+
+ The following node types are used to completely describe a thermal management
+ system in devicetree:
+ - thermal-sensor: device that measures temperature, has SoC-specific bindings
+ - cooling-device: device used to dissipate heat either passively or actively
+ - thermal-zones: a container of the following node types used to describe all
+ thermal data for the platform
+
+ This binding describes the thermal-sensor.
+
+ Thermal sensor devices provide temperature sensing capabilities on thermal
+ zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor
+ devices may control one or more internal sensors.
+
+properties:
+ "#thermal-sensor-cells":
+ description:
+ Used to uniquely identify a thermal sensor instance within an IC. Will be
+ 0 on sensor nodes with only a single sensor and at least 1 on nodes
+ containing several internal sensors.
+ enum: [0, 1]
+
+additionalProperties: true
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+
+ // Example 1: SDM845 TSENS
+ soc: soc {
+ #address-cells = <2>;
+ #size-cells = <2>;
+
+ /* ... */
+
+ tsens0: thermal-sensor@c263000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c263000 0 0x1ff>, /* TM */
+ <0 0x0c222000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <13>;
+ interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+ #thermal-sensor-cells = <1>;
+ };
+
+ tsens1: thermal-sensor@c265000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c265000 0 0x1ff>, /* TM */
+ <0 0x0c223000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <8>;
+ interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+ #thermal-sensor-cells = <1>;
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
new file mode 100644
index 000000000..1b3954aa7
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
@@ -0,0 +1,342 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml#
+$schema: http://devicetree.org/meta-schemas/base.yaml#
+
+title: Thermal zone binding
+
+maintainers:
+ - Amit Kucheria <amitk@kernel.org>
+
+description: |
+ Thermal management is achieved in devicetree by describing the sensor hardware
+ and the software abstraction of cooling devices and thermal zones required to
+ take appropriate action to mitigate thermal overloads.
+
+ The following node types are used to completely describe a thermal management
+ system in devicetree:
+ - thermal-sensor: device that measures temperature, has SoC-specific bindings
+ - cooling-device: device used to dissipate heat either passively or actively
+ - thermal-zones: a container of the following node types used to describe all
+ thermal data for the platform
+
+ This binding describes the thermal-zones.
+
+ The polling-delay properties of a thermal-zone are bound to the maximum dT/dt
+ (temperature derivative over time) in two situations for a thermal zone:
+ 1. when passive cooling is activated (polling-delay-passive)
+ 2. when the zone just needs to be monitored (polling-delay) or when
+ active cooling is activated.
+
+ The maximum dT/dt is highly bound to hardware power consumption and
+ dissipation capability. The delays should be chosen to account for said
+ max dT/dt, such that a device does not cross several trip boundaries
+ unexpectedly between polls. Choosing the right polling delays shall avoid
+ having the device in temperature ranges that may damage the silicon structures
+ and reduce silicon lifetime.
+
+properties:
+ $nodename:
+ const: thermal-zones
+ description:
+ A /thermal-zones node is required in order to use the thermal framework to
+ manage input from the various thermal zones in the system in order to
+ mitigate thermal overload conditions. It does not represent a real device
+ in the system, but acts as a container to link a thermal sensor device,
+ platform-data regarding temperature thresholds and the mitigation actions
+ to take when the temperature crosses those thresholds.
+
+patternProperties:
+ "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$":
+ type: object
+ description:
+ Each thermal zone node contains information about how frequently it
+ must be checked, the sensor responsible for reporting temperature for
+ this zone, one sub-node containing the various trip points for this
+ zone and one sub-node containing all the zone cooling-maps.
+
+ properties:
+ polling-delay:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ The maximum number of milliseconds to wait between polls when
+ checking this thermal zone. Setting this to 0 disables the polling
+ timers setup by the thermal framework and assumes that the thermal
+ sensors in this zone support interrupts.
+
+ polling-delay-passive:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ The maximum number of milliseconds to wait between polls when
+ checking this thermal zone while doing passive cooling. Setting
+ this to 0 disables the polling timers setup by the thermal
+ framework and assumes that the thermal sensors in this zone
+ support interrupts.
+
+ thermal-sensors:
+ $ref: /schemas/types.yaml#/definitions/phandle-array
+ maxItems: 1
+ description:
+ The thermal sensor phandle and sensor specifier used to monitor this
+ thermal zone.
+
+ coefficients:
+ $ref: /schemas/types.yaml#/definitions/uint32-array
+ description:
+ An array of integers containing the coefficients of a linear equation
+ that binds all the sensors listed in this thermal zone.
+
+ The linear equation used is as follows,
+ z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn
+ where c0, c1, .., cn are the coefficients.
+
+ Coefficients default to 1 in case this property is not specified. The
+ coefficients are ordered and are matched with sensors by means of the
+ sensor ID. Additional coefficients are interpreted as constant offset.
+
+ sustainable-power:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ An estimate of the sustainable power (in mW) that this thermal zone
+ can dissipate at the desired control temperature. For reference, the
+ sustainable power of a 4-inch phone is typically 2000mW, while on a
+ 10-inch tablet is around 4500mW.
+
+ trips:
+ type: object
+ description:
+ This node describes a set of points in the temperature domain at
+ which the thermal framework needs to take action. The actions to
+ be taken are defined in another node called cooling-maps.
+
+ patternProperties:
+ "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$":
+ type: object
+
+ properties:
+ temperature:
+ $ref: /schemas/types.yaml#/definitions/int32
+ minimum: -273000
+ maximum: 200000
+ description:
+ An integer expressing the trip temperature in millicelsius.
+
+ hysteresis:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ An unsigned integer expressing the hysteresis delta with
+ respect to the trip temperature property above, also in
+ millicelsius. Any cooling action initiated by the framework is
+ maintained until the temperature falls below
+ (trip temperature - hysteresis). This potentially prevents a
+ situation where the trip gets constantly triggered soon after
+ cooling action is removed.
+
+ type:
+ $ref: /schemas/types.yaml#/definitions/string
+ enum:
+ - active # enable active cooling e.g. fans
+ - passive # enable passive cooling e.g. throttling cpu
+ - hot # send notification to driver
+ - critical # send notification to driver, trigger shutdown
+ description: |
+ There are four valid trip types: active, passive, hot,
+ critical.
+
+ The critical trip type is used to set the maximum
+ temperature threshold above which the HW becomes
+ unstable and underlying firmware might even trigger a
+ reboot. Hitting the critical threshold triggers a system
+ shutdown.
+
+ The hot trip type can be used to send a notification to
+ the thermal driver (if a .notify callback is registered).
+ The action to be taken is left to the driver.
+
+ The passive trip type can be used to slow down HW e.g. run
+ the CPU, GPU, bus at a lower frequency.
+
+ The active trip type can be used to control other HW to
+ help in cooling e.g. fans can be sped up or slowed down
+
+ required:
+ - temperature
+ - hysteresis
+ - type
+ additionalProperties: false
+
+ additionalProperties: false
+
+ cooling-maps:
+ type: object
+ description:
+ This node describes the action to be taken when a thermal zone
+ crosses one of the temperature thresholds described in the trips
+ node. The action takes the form of a mapping relation between a
+ trip and the target cooling device state.
+
+ patternProperties:
+ "^map[-a-zA-Z0-9]*$":
+ type: object
+
+ properties:
+ trip:
+ $ref: /schemas/types.yaml#/definitions/phandle
+ description:
+ A phandle of a trip point node within this thermal zone.
+
+ cooling-device:
+ $ref: /schemas/types.yaml#/definitions/phandle-array
+ description:
+ A list of cooling device phandles along with the minimum
+ and maximum cooling state specifiers for each cooling
+ device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
+ cooling-device phandle limit specifier lets the framework
+ use the minimum and maximum cooling state for that cooling
+ device automatically.
+
+ contribution:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ The cooling contribution to the thermal zone of the referred
+ cooling device at the referred trip point. The contribution is
+ a ratio of the sum of all cooling contributions within a
+ thermal zone.
+
+ required:
+ - trip
+ - cooling-device
+ additionalProperties: false
+
+ required:
+ - polling-delay
+ - polling-delay-passive
+ - thermal-sensors
+ - trips
+ additionalProperties: false
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/thermal/thermal.h>
+
+ // Example 1: SDM845 TSENS
+ soc {
+ #address-cells = <2>;
+ #size-cells = <2>;
+
+ /* ... */
+
+ tsens0: thermal-sensor@c263000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c263000 0 0x1ff>, /* TM */
+ <0 0x0c222000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <13>;
+ interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+ #thermal-sensor-cells = <1>;
+ };
+
+ tsens1: thermal-sensor@c265000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c265000 0 0x1ff>, /* TM */
+ <0 0x0c223000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <8>;
+ interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+ #thermal-sensor-cells = <1>;
+ };
+ };
+
+ /* ... */
+
+ thermal-zones {
+ cpu0-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 1>;
+
+ trips {
+ cpu0_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu0_alert1: trip-point1 {
+ temperature = <95000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu0_crit: cpu_crit {
+ temperature = <110000>;
+ hysteresis = <1000>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu0_alert0>;
+ /* Corresponds to 1400MHz in OPP table */
+ cooling-device = <&CPU0 3 3>, <&CPU1 3 3>,
+ <&CPU2 3 3>, <&CPU3 3 3>;
+ };
+
+ map1 {
+ trip = <&cpu0_alert1>;
+ /* Corresponds to 1000MHz in OPP table */
+ cooling-device = <&CPU0 5 5>, <&CPU1 5 5>,
+ <&CPU2 5 5>, <&CPU3 5 5>;
+ };
+ };
+ };
+
+ /* ... */
+
+ cluster0-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 5>;
+
+ trips {
+ cluster0_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "hot";
+ };
+ cluster0_crit: cluster0_crit {
+ temperature = <110000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+ };
+
+ /* ... */
+
+ gpu-top-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 11>;
+
+ trips {
+ gpu1_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "hot";
+ };
+ };
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
new file mode 100644
index 000000000..ea14de80e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
@@ -0,0 +1,56 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Texas Instruments AM654 VTM (DTS) binding
+
+maintainers:
+ - Keerthy <j-keerthy@ti.com>
+
+properties:
+ compatible:
+ const: ti,am654-vtm
+
+ reg:
+ maxItems: 1
+
+ power-domains:
+ maxItems: 1
+
+ "#thermal-sensor-cells":
+ const: 1
+
+required:
+ - compatible
+ - reg
+ - power-domains
+ - "#thermal-sensor-cells"
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/soc/ti,sci_pm_domain.h>
+ vtm: thermal@42050000 {
+ compatible = "ti,am654-vtm";
+ reg = <0x42050000 0x25c>;
+ power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>;
+ #thermal-sensor-cells = <1>;
+ };
+
+ mpu0_thermal: mpu0_thermal {
+ polling-delay-passive = <250>; /* milliseconds */
+ polling-delay = <500>; /* milliseconds */
+ thermal-sensors = <&vtm0 0>;
+
+ trips {
+ mpu0_crit: mpu0_crit {
+ temperature = <125000>; /* milliCelsius */
+ hysteresis = <2000>; /* milliCelsius */
+ type = "critical";
+ };
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
new file mode 100644
index 000000000..6299dd8de
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
@@ -0,0 +1,88 @@
+* Texas Instrument OMAP SCM bandgap bindings
+
+In the System Control Module, OMAP supplies a voltage reference
+and a temperature sensor feature that are gathered in the band
+gap voltage and temperature sensor (VBGAPTS) module. The band
+gap provides current and voltage reference for its internal
+circuits and other analog IP blocks. The analog-to-digital
+converter (ADC) produces an output value that is proportional
+to the silicon temperature.
+
+Required properties:
+- compatible : Should be:
+ - "ti,omap34xx-bandgap" : for OMAP34xx bandgap
+ - "ti,omap36xx-bandgap" : for OMAP36xx bandgap
+ - "ti,omap4430-bandgap" : for OMAP4430 bandgap
+ - "ti,omap4460-bandgap" : for OMAP4460 bandgap
+ - "ti,omap4470-bandgap" : for OMAP4470 bandgap
+ - "ti,omap5430-bandgap" : for OMAP5430 bandgap
+- interrupts : this entry should indicate which interrupt line
+the talert signal is routed to;
+Specific:
+- gpios : this entry should be used to inform which GPIO
+line the tshut signal is routed to. The informed GPIO will
+be treated as an IRQ;
+- regs : this entry must also be specified and it is specific
+to each bandgap version, because the mapping may change from
+soc to soc, apart of depending on available features.
+
+Example:
+OMAP34xx:
+bandgap {
+ reg = <0x48002524 0x4>;
+ compatible = "ti,omap34xx-bandgap";
+};
+
+OMAP36xx:
+bandgap {
+ reg = <0x48002524 0x4>;
+ compatible = "ti,omap36xx-bandgap";
+};
+
+OMAP4430:
+bandgap {
+ reg = <0x4a002260 0x4 0x4a00232C 0x4>;
+ compatible = "ti,omap4430-bandgap";
+};
+
+OMAP4460:
+bandgap {
+ reg = <0x4a002260 0x4
+ 0x4a00232C 0x4
+ 0x4a002378 0x18>;
+ compatible = "ti,omap4460-bandgap";
+ interrupts = <0 126 4>; /* talert */
+ gpios = <&gpio3 22 0>; /* tshut */
+};
+
+OMAP4470:
+bandgap {
+ reg = <0x4a002260 0x4
+ 0x4a00232C 0x4
+ 0x4a002378 0x18>;
+ compatible = "ti,omap4470-bandgap";
+ interrupts = <0 126 4>; /* talert */
+ gpios = <&gpio3 22 0>; /* tshut */
+};
+
+OMAP5430:
+bandgap {
+ reg = <0x4a0021e0 0xc
+ 0x4a00232c 0xc
+ 0x4a002380 0x2c
+ 0x4a0023C0 0x3c>;
+ compatible = "ti,omap5430-bandgap";
+ interrupts = <0 126 4>; /* talert */
+};
+
+DRA752:
+bandgap {
+ reg = <0x4a0021e0 0xc
+ 0x4a00232c 0xc
+ 0x4a002380 0x2c
+ 0x4a0023C0 0x3c
+ 0x4a002564 0x8
+ 0x4a002574 0x50>;
+ compatible = "ti,dra752-bandgap";
+ interrupts = <0 126 4>; /* talert */
+};
diff --git a/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt b/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt
new file mode 100644
index 000000000..3dc1c6bf0
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/zx2967-thermal.txt
@@ -0,0 +1,116 @@
+* ZTE zx2967 family Thermal
+
+Required Properties:
+- compatible: should be one of the following.
+ * zte,zx296718-thermal
+- reg: physical base address of the controller and length of memory mapped
+ region.
+- clocks : Pairs of phandle and specifier referencing the controller's clocks.
+- clock-names: "topcrm" for the topcrm clock.
+ "apb" for the apb clock.
+- #thermal-sensor-cells: must be 0.
+
+Please note: slope coefficient defined in thermal-zones section need to be
+multiplied by 1000.
+
+Example for tempsensor:
+
+ tempsensor: tempsensor@148a000 {
+ compatible = "zte,zx296718-thermal";
+ reg = <0x0148a000 0x20>;
+ clocks = <&topcrm TEMPSENSOR_GATE>, <&audiocrm AUDIO_TS_PCLK>;
+ clock-names = "topcrm", "apb";
+ #thermal-sensor-cells = <0>;
+ };
+
+Example for cooling device:
+
+ cooling_dev: cooling_dev {
+ cluster0_cooling_dev: cluster0-cooling-dev {
+ #cooling-cells = <2>;
+ cpumask = <0xf>;
+ capacitance = <1500>;
+ };
+
+ cluster1_cooling_dev: cluster1-cooling-dev {
+ #cooling-cells = <2>;
+ cpumask = <0x30>;
+ capacitance = <2000>;
+ };
+ };
+
+Example for thermal zones:
+
+ thermal-zones {
+ zx296718_thermal: zx296718_thermal {
+ polling-delay-passive = <500>;
+ polling-delay = <1000>;
+ sustainable-power = <6500>;
+
+ thermal-sensors = <&tempsensor 0>;
+ /*
+ * slope need to be multiplied by 1000.
+ */
+ coefficients = <1951 (-922)>;
+
+ trips {
+ trip0: switch_on_temperature {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ trip1: desired_temperature {
+ temperature = <100000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ crit: critical_temperature {
+ temperature = <110000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&trip0>;
+ cooling-device = <&gpu 2 5>;
+ };
+
+ map1 {
+ trip = <&trip0>;
+ cooling-device = <&cluster0_cooling_dev 1 2>;
+ };
+
+ map2 {
+ trip = <&trip1>;
+ cooling-device = <&cluster0_cooling_dev 1 2>;
+ };
+
+ map3 {
+ trip = <&crit>;
+ cooling-device = <&cluster0_cooling_dev 1 2>;
+ };
+
+ map4 {
+ trip = <&trip0>;
+ cooling-device = <&cluster1_cooling_dev 1 2>;
+ contribution = <9000>;
+ };
+
+ map5 {
+ trip = <&trip1>;
+ cooling-device = <&cluster1_cooling_dev 1 2>;
+ contribution = <4096>;
+ };
+
+ map6 {
+ trip = <&crit>;
+ cooling-device = <&cluster1_cooling_dev 1 2>;
+ contribution = <4096>;
+ };
+ };
+ };
+ };