From 2c3c1048746a4622d8c89a29670120dc8fab93c4 Mon Sep 17 00:00:00 2001 From: Daniel Baumann Date: Sun, 7 Apr 2024 20:49:45 +0200 Subject: Adding upstream version 6.1.76. Signed-off-by: Daniel Baumann --- Documentation/hwmon/intel-m10-bmc-hwmon.rst | 78 +++++++++++++++++++++++++++++ 1 file changed, 78 insertions(+) create mode 100644 Documentation/hwmon/intel-m10-bmc-hwmon.rst (limited to 'Documentation/hwmon/intel-m10-bmc-hwmon.rst') diff --git a/Documentation/hwmon/intel-m10-bmc-hwmon.rst b/Documentation/hwmon/intel-m10-bmc-hwmon.rst new file mode 100644 index 000000000..3d148c6e3 --- /dev/null +++ b/Documentation/hwmon/intel-m10-bmc-hwmon.rst @@ -0,0 +1,78 @@ +.. SPDX-License-Identifier: GPL-2.0 + +Kernel driver intel-m10-bmc-hwmon +================================= + +Supported chips: + + * Intel MAX 10 BMC for Intel PAC N3000 + + Prefix: 'n3000bmc-hwmon' + +Author: Xu Yilun + + +Description +----------- + +This driver adds the temperature, voltage, current and power reading +support for the Intel MAX 10 Board Management Controller (BMC) chip. +The BMC chip is integrated in some Intel Programmable Acceleration +Cards (PAC). It connects to a set of sensor chips to monitor the +sensor data of different components on the board. The BMC firmware is +responsible for sensor data sampling and recording in shared +registers. The host driver reads the sensor data from these shared +registers and exposes them to users as hwmon interfaces. + +The BMC chip is implemented using the Intel MAX 10 CPLD. It could be +reprogramed to some variants in order to support different Intel +PACs. The driver is designed to be able to distinguish between the +variants, but now it only supports the BMC for Intel PAC N3000. + + +Sysfs attributes +---------------- + +The following attributes are supported: + +- Intel MAX 10 BMC for Intel PAC N3000: + +======================= ======================================================= +tempX_input Temperature of the component (specified by tempX_label) +tempX_max Temperature maximum setpoint of the component +tempX_crit Temperature critical setpoint of the component +tempX_max_hyst Hysteresis for temperature maximum of the component +tempX_crit_hyst Hysteresis for temperature critical of the component +temp1_label "Board Temperature" +temp2_label "FPGA Die Temperature" +temp3_label "QSFP0 Temperature" +temp4_label "QSFP1 Temperature" +temp5_label "Retimer A Temperature" +temp6_label "Retimer A SerDes Temperature" +temp7_label "Retimer B Temperature" +temp8_label "Retimer B SerDes Temperature" + +inX_input Measured voltage of the component (specified by + inX_label) +in0_label "QSFP0 Supply Voltage" +in1_label "QSFP1 Supply Voltage" +in2_label "FPGA Core Voltage" +in3_label "12V Backplane Voltage" +in4_label "1.2V Voltage" +in5_label "12V AUX Voltage" +in6_label "1.8V Voltage" +in7_label "3.3V Voltage" + +currX_input Measured current of the component (specified by + currX_label) +curr1_label "FPGA Core Current" +curr2_label "12V Backplane Current" +curr3_label "12V AUX Current" + +powerX_input Measured power of the component (specified by + powerX_label) +power1_label "Board Power" + +======================= ======================================================= + +All the attributes are read-only. -- cgit v1.2.3