summaryrefslogtreecommitdiffstats
path: root/Documentation/driver-api/thermal/cpu-cooling-api.rst
diff options
context:
space:
mode:
authorDaniel Baumann <daniel.baumann@progress-linux.org>2024-04-07 18:49:45 +0000
committerDaniel Baumann <daniel.baumann@progress-linux.org>2024-04-07 18:49:45 +0000
commit2c3c1048746a4622d8c89a29670120dc8fab93c4 (patch)
tree848558de17fb3008cdf4d861b01ac7781903ce39 /Documentation/driver-api/thermal/cpu-cooling-api.rst
parentInitial commit. (diff)
downloadlinux-2c3c1048746a4622d8c89a29670120dc8fab93c4.tar.xz
linux-2c3c1048746a4622d8c89a29670120dc8fab93c4.zip
Adding upstream version 6.1.76.upstream/6.1.76
Signed-off-by: Daniel Baumann <daniel.baumann@progress-linux.org>
Diffstat (limited to 'Documentation/driver-api/thermal/cpu-cooling-api.rst')
-rw-r--r--Documentation/driver-api/thermal/cpu-cooling-api.rst107
1 files changed, 107 insertions, 0 deletions
diff --git a/Documentation/driver-api/thermal/cpu-cooling-api.rst b/Documentation/driver-api/thermal/cpu-cooling-api.rst
new file mode 100644
index 000000000..645d914c4
--- /dev/null
+++ b/Documentation/driver-api/thermal/cpu-cooling-api.rst
@@ -0,0 +1,107 @@
+=======================
+CPU cooling APIs How To
+=======================
+
+Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>
+
+Updated: 6 Jan 2015
+
+Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
+
+0. Introduction
+===============
+
+The generic cpu cooling(freq clipping) provides registration/unregistration APIs
+to the caller. The binding of the cooling devices to the trip point is left for
+the user. The registration APIs returns the cooling device pointer.
+
+1. cpu cooling APIs
+===================
+
+1.1 cpufreq registration/unregistration APIs
+--------------------------------------------
+
+ ::
+
+ struct thermal_cooling_device
+ *cpufreq_cooling_register(struct cpumask *clip_cpus)
+
+ This interface function registers the cpufreq cooling device with the name
+ "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
+ cooling devices.
+
+ clip_cpus:
+ cpumask of cpus where the frequency constraints will happen.
+
+ ::
+
+ struct thermal_cooling_device
+ *of_cpufreq_cooling_register(struct cpufreq_policy *policy)
+
+ This interface function registers the cpufreq cooling device with
+ the name "thermal-cpufreq-%x" linking it with a device tree node, in
+ order to bind it via the thermal DT code. This api can support multiple
+ instances of cpufreq cooling devices.
+
+ policy:
+ CPUFreq policy.
+
+
+ ::
+
+ void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+
+ This interface function unregisters the "thermal-cpufreq-%x" cooling device.
+
+ cdev: Cooling device pointer which has to be unregistered.
+
+2. Power models
+===============
+
+The power API registration functions provide a simple power model for
+CPUs. The current power is calculated as dynamic power (static power isn't
+supported currently). This power model requires that the operating-points of
+the CPUs are registered using the kernel's opp library and the
+`cpufreq_frequency_table` is assigned to the `struct device` of the
+cpu. If you are using CONFIG_CPUFREQ_DT then the
+`cpufreq_frequency_table` should already be assigned to the cpu
+device.
+
+The dynamic power consumption of a processor depends on many factors.
+For a given processor implementation the primary factors are:
+
+- The time the processor spends running, consuming dynamic power, as
+ compared to the time in idle states where dynamic consumption is
+ negligible. Herein we refer to this as 'utilisation'.
+- The voltage and frequency levels as a result of DVFS. The DVFS
+ level is a dominant factor governing power consumption.
+- In running time the 'execution' behaviour (instruction types, memory
+ access patterns and so forth) causes, in most cases, a second order
+ variation. In pathological cases this variation can be significant,
+ but typically it is of a much lesser impact than the factors above.
+
+A high level dynamic power consumption model may then be represented as::
+
+ Pdyn = f(run) * Voltage^2 * Frequency * Utilisation
+
+f(run) here represents the described execution behaviour and its
+result has a units of Watts/Hz/Volt^2 (this often expressed in
+mW/MHz/uVolt^2)
+
+The detailed behaviour for f(run) could be modelled on-line. However,
+in practice, such an on-line model has dependencies on a number of
+implementation specific processor support and characterisation
+factors. Therefore, in initial implementation that contribution is
+represented as a constant coefficient. This is a simplification
+consistent with the relative contribution to overall power variation.
+
+In this simplified representation our model becomes::
+
+ Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation
+
+Where `capacitance` is a constant that represents an indicative
+running time dynamic power coefficient in fundamental units of
+mW/MHz/uVolt^2. Typical values for mobile CPUs might lie in range
+from 100 to 500. For reference, the approximate values for the SoC in
+ARM's Juno Development Platform are 530 for the Cortex-A57 cluster and
+140 for the Cortex-A53 cluster.