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diff --git a/Documentation/driver-api/thermal/sysfs-api.rst b/Documentation/driver-api/thermal/sysfs-api.rst new file mode 100644 index 000000000..2e0f79a9e --- /dev/null +++ b/Documentation/driver-api/thermal/sysfs-api.rst @@ -0,0 +1,535 @@ +=================================== +Generic Thermal Sysfs driver How To +=================================== + +Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com> + +Updated: 2 January 2008 + +Copyright (c) 2008 Intel Corporation + + +0. Introduction +=============== + +The generic thermal sysfs provides a set of interfaces for thermal zone +devices (sensors) and thermal cooling devices (fan, processor...) to register +with the thermal management solution and to be a part of it. + +This how-to focuses on enabling new thermal zone and cooling devices to +participate in thermal management. +This solution is platform independent and any type of thermal zone devices +and cooling devices should be able to make use of the infrastructure. + +The main task of the thermal sysfs driver is to expose thermal zone attributes +as well as cooling device attributes to the user space. +An intelligent thermal management application can make decisions based on +inputs from thermal zone attributes (the current temperature and trip point +temperature) and throttle appropriate devices. + +- `[0-*]` denotes any positive number starting from 0 +- `[1-*]` denotes any positive number starting from 1 + +1. thermal sysfs driver interface functions +=========================================== + +1.1 thermal zone device interface +--------------------------------- + + :: + + struct thermal_zone_device + *thermal_zone_device_register(char *type, + int trips, int mask, void *devdata, + struct thermal_zone_device_ops *ops, + const struct thermal_zone_params *tzp, + int passive_delay, int polling_delay)) + + This interface function adds a new thermal zone device (sensor) to + /sys/class/thermal folder as `thermal_zone[0-*]`. It tries to bind all the + thermal cooling devices registered at the same time. + + type: + the thermal zone type. + trips: + the total number of trip points this thermal zone supports. + mask: + Bit string: If 'n'th bit is set, then trip point 'n' is writable. + devdata: + device private data + ops: + thermal zone device call-backs. + + .bind: + bind the thermal zone device with a thermal cooling device. + .unbind: + unbind the thermal zone device with a thermal cooling device. + .get_temp: + get the current temperature of the thermal zone. + .set_trips: + set the trip points window. Whenever the current temperature + is updated, the trip points immediately below and above the + current temperature are found. + .get_mode: + get the current mode (enabled/disabled) of the thermal zone. + + - "enabled" means the kernel thermal management is + enabled. + - "disabled" will prevent kernel thermal driver action + upon trip points so that user applications can take + charge of thermal management. + .set_mode: + set the mode (enabled/disabled) of the thermal zone. + .get_trip_type: + get the type of certain trip point. + .get_trip_temp: + get the temperature above which the certain trip point + will be fired. + .set_emul_temp: + set the emulation temperature which helps in debugging + different threshold temperature points. + tzp: + thermal zone platform parameters. + passive_delay: + number of milliseconds to wait between polls when + performing passive cooling. + polling_delay: + number of milliseconds to wait between polls when checking + whether trip points have been crossed (0 for interrupt driven systems). + + :: + + void thermal_zone_device_unregister(struct thermal_zone_device *tz) + + This interface function removes the thermal zone device. + It deletes the corresponding entry from /sys/class/thermal folder and + unbinds all the thermal cooling devices it uses. + + :: + + struct thermal_zone_device + *thermal_zone_of_sensor_register(struct device *dev, int sensor_id, + void *data, + const struct thermal_zone_of_device_ops *ops) + + This interface adds a new sensor to a DT thermal zone. + This function will search the list of thermal zones described in + device tree and look for the zone that refer to the sensor device + pointed by dev->of_node as temperature providers. For the zone + pointing to the sensor node, the sensor will be added to the DT + thermal zone device. + + The parameters for this interface are: + + dev: + Device node of sensor containing valid node pointer in + dev->of_node. + sensor_id: + a sensor identifier, in case the sensor IP has more + than one sensors + data: + a private pointer (owned by the caller) that will be + passed back, when a temperature reading is needed. + ops: + `struct thermal_zone_of_device_ops *`. + + ============== ======================================= + get_temp a pointer to a function that reads the + sensor temperature. This is mandatory + callback provided by sensor driver. + set_trips a pointer to a function that sets a + temperature window. When this window is + left the driver must inform the thermal + core via thermal_zone_device_update. + get_trend a pointer to a function that reads the + sensor temperature trend. + set_emul_temp a pointer to a function that sets + sensor emulated temperature. + ============== ======================================= + + The thermal zone temperature is provided by the get_temp() function + pointer of thermal_zone_of_device_ops. When called, it will + have the private pointer @data back. + + It returns error pointer if fails otherwise valid thermal zone device + handle. Caller should check the return handle with IS_ERR() for finding + whether success or not. + + :: + + void thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tzd) + + This interface unregisters a sensor from a DT thermal zone which was + successfully added by interface thermal_zone_of_sensor_register(). + This function removes the sensor callbacks and private data from the + thermal zone device registered with thermal_zone_of_sensor_register() + interface. It will also silent the zone by remove the .get_temp() and + get_trend() thermal zone device callbacks. + + :: + + struct thermal_zone_device + *devm_thermal_zone_of_sensor_register(struct device *dev, + int sensor_id, + void *data, + const struct thermal_zone_of_device_ops *ops) + + This interface is resource managed version of + thermal_zone_of_sensor_register(). + + All details of thermal_zone_of_sensor_register() described in + section 1.1.3 is applicable here. + + The benefit of using this interface to register sensor is that it + is not require to explicitly call thermal_zone_of_sensor_unregister() + in error path or during driver unbinding as this is done by driver + resource manager. + + :: + + void devm_thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tzd) + + This interface is resource managed version of + thermal_zone_of_sensor_unregister(). + All details of thermal_zone_of_sensor_unregister() described in + section 1.1.4 is applicable here. + Normally this function will not need to be called and the resource + management code will ensure that the resource is freed. + + :: + + int thermal_zone_get_slope(struct thermal_zone_device *tz) + + This interface is used to read the slope attribute value + for the thermal zone device, which might be useful for platform + drivers for temperature calculations. + + :: + + int thermal_zone_get_offset(struct thermal_zone_device *tz) + + This interface is used to read the offset attribute value + for the thermal zone device, which might be useful for platform + drivers for temperature calculations. + +1.2 thermal cooling device interface +------------------------------------ + + + :: + + struct thermal_cooling_device + *thermal_cooling_device_register(char *name, + void *devdata, struct thermal_cooling_device_ops *) + + This interface function adds a new thermal cooling device (fan/processor/...) + to /sys/class/thermal/ folder as `cooling_device[0-*]`. It tries to bind itself + to all the thermal zone devices registered at the same time. + + name: + the cooling device name. + devdata: + device private data. + ops: + thermal cooling devices call-backs. + + .get_max_state: + get the Maximum throttle state of the cooling device. + .get_cur_state: + get the Currently requested throttle state of the + cooling device. + .set_cur_state: + set the Current throttle state of the cooling device. + + :: + + void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) + + This interface function removes the thermal cooling device. + It deletes the corresponding entry from /sys/class/thermal folder and + unbinds itself from all the thermal zone devices using it. + +1.3 interface for binding a thermal zone device with a thermal cooling device +----------------------------------------------------------------------------- + + :: + + int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, + int trip, struct thermal_cooling_device *cdev, + unsigned long upper, unsigned long lower, unsigned int weight); + + This interface function binds a thermal cooling device to a particular trip + point of a thermal zone device. + + This function is usually called in the thermal zone device .bind callback. + + tz: + the thermal zone device + cdev: + thermal cooling device + trip: + indicates which trip point in this thermal zone the cooling device + is associated with. + upper: + the Maximum cooling state for this trip point. + THERMAL_NO_LIMIT means no upper limit, + and the cooling device can be in max_state. + lower: + the Minimum cooling state can be used for this trip point. + THERMAL_NO_LIMIT means no lower limit, + and the cooling device can be in cooling state 0. + weight: + the influence of this cooling device in this thermal + zone. See 1.4.1 below for more information. + + :: + + int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, + int trip, struct thermal_cooling_device *cdev); + + This interface function unbinds a thermal cooling device from a particular + trip point of a thermal zone device. This function is usually called in + the thermal zone device .unbind callback. + + tz: + the thermal zone device + cdev: + thermal cooling device + trip: + indicates which trip point in this thermal zone the cooling device + is associated with. + +1.4 Thermal Zone Parameters +--------------------------- + + :: + + struct thermal_bind_params + + This structure defines the following parameters that are used to bind + a zone with a cooling device for a particular trip point. + + .cdev: + The cooling device pointer + .weight: + The 'influence' of a particular cooling device on this + zone. This is relative to the rest of the cooling + devices. For example, if all cooling devices have a + weight of 1, then they all contribute the same. You can + use percentages if you want, but it's not mandatory. A + weight of 0 means that this cooling device doesn't + contribute to the cooling of this zone unless all cooling + devices have a weight of 0. If all weights are 0, then + they all contribute the same. + .trip_mask: + This is a bit mask that gives the binding relation between + this thermal zone and cdev, for a particular trip point. + If nth bit is set, then the cdev and thermal zone are bound + for trip point n. + .binding_limits: + This is an array of cooling state limits. Must have + exactly 2 * thermal_zone.number_of_trip_points. It is an + array consisting of tuples <lower-state upper-state> of + state limits. Each trip will be associated with one state + limit tuple when binding. A NULL pointer means + <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips. + These limits are used when binding a cdev to a trip point. + .match: + This call back returns success(0) if the 'tz and cdev' need to + be bound, as per platform data. + + :: + + struct thermal_zone_params + + This structure defines the platform level parameters for a thermal zone. + This data, for each thermal zone should come from the platform layer. + This is an optional feature where some platforms can choose not to + provide this data. + + .governor_name: + Name of the thermal governor used for this zone + .no_hwmon: + a boolean to indicate if the thermal to hwmon sysfs interface + is required. when no_hwmon == false, a hwmon sysfs interface + will be created. when no_hwmon == true, nothing will be done. + In case the thermal_zone_params is NULL, the hwmon interface + will be created (for backward compatibility). + .num_tbps: + Number of thermal_bind_params entries for this zone + .tbp: + thermal_bind_params entries + +2. sysfs attributes structure +============================= + +== ================ +RO read only value +WO write only value +RW read/write value +== ================ + +Thermal sysfs attributes will be represented under /sys/class/thermal. +Hwmon sysfs I/F extension is also available under /sys/class/hwmon +if hwmon is compiled in or built as a module. + +Thermal zone device sys I/F, created once it's registered:: + + /sys/class/thermal/thermal_zone[0-*]: + |---type: Type of the thermal zone + |---temp: Current temperature + |---mode: Working mode of the thermal zone + |---policy: Thermal governor used for this zone + |---available_policies: Available thermal governors for this zone + |---trip_point_[0-*]_temp: Trip point temperature + |---trip_point_[0-*]_type: Trip point type + |---trip_point_[0-*]_hyst: Hysteresis value for this trip point + |---emul_temp: Emulated temperature set node + |---sustainable_power: Sustainable dissipatable power + |---k_po: Proportional term during temperature overshoot + |---k_pu: Proportional term during temperature undershoot + |---k_i: PID's integral term in the power allocator gov + |---k_d: PID's derivative term in the power allocator + |---integral_cutoff: Offset above which errors are accumulated + |---slope: Slope constant applied as linear extrapolation + |---offset: Offset constant applied as linear extrapolation + +Thermal cooling device sys I/F, created once it's registered:: + + /sys/class/thermal/cooling_device[0-*]: + |---type: Type of the cooling device(processor/fan/...) + |---max_state: Maximum cooling state of the cooling device + |---cur_state: Current cooling state of the cooling device + |---stats: Directory containing cooling device's statistics + |---stats/reset: Writing any value resets the statistics + |---stats/time_in_state_ms: Time (msec) spent in various cooling states + |---stats/total_trans: Total number of times cooling state is changed + |---stats/trans_table: Cooling state transition table + + +Then next two dynamic attributes are created/removed in pairs. They represent +the relationship between a thermal zone and its associated cooling device. +They are created/removed for each successful execution of +thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. + +:: + + /sys/class/thermal/thermal_zone[0-*]: + |---cdev[0-*]: [0-*]th cooling device in current thermal zone + |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with + |---cdev[0-*]_weight: Influence of the cooling device in + this thermal zone + +Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, +the generic thermal driver also creates a hwmon sysfs I/F for each _type_ +of thermal zone device. E.g. the generic thermal driver registers one hwmon +class device and build the associated hwmon sysfs I/F for all the registered +ACPI thermal zones. + +Please read Documentation/ABI/testing/sysfs-class-thermal for thermal +zone and cooling device attribute details. + +:: + + /sys/class/hwmon/hwmon[0-*]: + |---name: The type of the thermal zone devices + |---temp[1-*]_input: The current temperature of thermal zone [1-*] + |---temp[1-*]_critical: The critical trip point of thermal zone [1-*] + +Please read Documentation/hwmon/sysfs-interface.rst for additional information. + +3. A simple implementation +========================== + +ACPI thermal zone may support multiple trip points like critical, hot, +passive, active. If an ACPI thermal zone supports critical, passive, +active[0] and active[1] at the same time, it may register itself as a +thermal_zone_device (thermal_zone1) with 4 trip points in all. +It has one processor and one fan, which are both registered as +thermal_cooling_device. Both are considered to have the same +effectiveness in cooling the thermal zone. + +If the processor is listed in _PSL method, and the fan is listed in _AL0 +method, the sys I/F structure will be built like this:: + + /sys/class/thermal: + |thermal_zone1: + |---type: acpitz + |---temp: 37000 + |---mode: enabled + |---policy: step_wise + |---available_policies: step_wise fair_share + |---trip_point_0_temp: 100000 + |---trip_point_0_type: critical + |---trip_point_1_temp: 80000 + |---trip_point_1_type: passive + |---trip_point_2_temp: 70000 + |---trip_point_2_type: active0 + |---trip_point_3_temp: 60000 + |---trip_point_3_type: active1 + |---cdev0: --->/sys/class/thermal/cooling_device0 + |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ + |---cdev0_weight: 1024 + |---cdev1: --->/sys/class/thermal/cooling_device3 + |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ + |---cdev1_weight: 1024 + + |cooling_device0: + |---type: Processor + |---max_state: 8 + |---cur_state: 0 + + |cooling_device3: + |---type: Fan + |---max_state: 2 + |---cur_state: 0 + + /sys/class/hwmon: + |hwmon0: + |---name: acpitz + |---temp1_input: 37000 + |---temp1_crit: 100000 + +4. Export Symbol APIs +===================== + +4.1. get_tz_trend +----------------- + +This function returns the trend of a thermal zone, i.e the rate of change +of temperature of the thermal zone. Ideally, the thermal sensor drivers +are supposed to implement the callback. If they don't, the thermal +framework calculated the trend by comparing the previous and the current +temperature values. + +4.2. get_thermal_instance +------------------------- + +This function returns the thermal_instance corresponding to a given +{thermal_zone, cooling_device, trip_point} combination. Returns NULL +if such an instance does not exist. + +4.3. thermal_cdev_update +------------------------ + +This function serves as an arbitrator to set the state of a cooling +device. It sets the cooling device to the deepest cooling state if +possible. + +5. thermal_emergency_poweroff +============================= + +On an event of critical trip temperature crossing the thermal framework +shuts down the system by calling hw_protection_shutdown(). The +hw_protection_shutdown() first attempts to perform an orderly shutdown +but accepts a delay after which it proceeds doing a forced power-off +or as last resort an emergency_restart. + +The delay should be carefully profiled so as to give adequate time for +orderly poweroff. + +If the delay is set to 0 emergency poweroff will not be supported. So a +carefully profiled non-zero positive value is a must for emergency +poweroff to be triggered. |