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| author | Daniel Baumann <daniel.baumann@progress-linux.org> | 2024-04-07 18:49:45 +0000 |
|---|---|---|
| committer | Daniel Baumann <daniel.baumann@progress-linux.org> | 2024-04-07 18:49:45 +0000 |
| commit | 2c3c1048746a4622d8c89a29670120dc8fab93c4 (patch) | |
| tree | 848558de17fb3008cdf4d861b01ac7781903ce39 /Documentation/devicetree/bindings/thermal | |
| parent | Initial commit. (diff) | |
| download | linux-2c3c1048746a4622d8c89a29670120dc8fab93c4.tar.xz linux-2c3c1048746a4622d8c89a29670120dc8fab93c4.zip | |
Adding upstream version 6.1.76.upstream/6.1.76upstream
Signed-off-by: Daniel Baumann <daniel.baumann@progress-linux.org>
Diffstat (limited to 'Documentation/devicetree/bindings/thermal')
46 files changed, 4285 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml new file mode 100644 index 000000000..fbd421228 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml @@ -0,0 +1,162 @@ +# SPDX-License-Identifier: GPL-2.0 +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/allwinner,sun8i-a83t-ths.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Allwinner SUN8I Thermal Controller + +maintainers: + - Vasily Khoruzhick <anarsoul@gmail.com> + - Yangtao Li <tiny.windzz@gmail.com> + +properties: + compatible: + enum: + - allwinner,sun8i-a83t-ths + - allwinner,sun8i-h3-ths + - allwinner,sun8i-r40-ths + - allwinner,sun50i-a64-ths + - allwinner,sun50i-a100-ths + - allwinner,sun50i-h5-ths + - allwinner,sun50i-h6-ths + + clocks: + minItems: 1 + items: + - description: Bus Clock + - description: Module Clock + + clock-names: + minItems: 1 + items: + - const: bus + - const: mod + + reg: + maxItems: 1 + + interrupts: + maxItems: 1 + + resets: + maxItems: 1 + + nvmem-cells: + maxItems: 1 + description: Calibration data for thermal sensors + + nvmem-cell-names: + const: calibration + + # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details + "#thermal-sensor-cells": + enum: + - 0 + - 1 + +allOf: + - if: + properties: + compatible: + contains: + enum: + - allwinner,sun50i-a100-ths + - allwinner,sun50i-h6-ths + + then: + properties: + clocks: + maxItems: 1 + + clock-names: + maxItems: 1 + + else: + properties: + clocks: + minItems: 2 + + clock-names: + minItems: 2 + + - if: + properties: + compatible: + contains: + const: allwinner,sun8i-h3-ths + + then: + properties: + "#thermal-sensor-cells": + const: 0 + + else: + properties: + "#thermal-sensor-cells": + const: 1 + + - if: + properties: + compatible: + contains: + enum: + - allwinner,sun8i-h3-ths + - allwinner,sun8i-r40-ths + - allwinner,sun50i-a64-ths + - allwinner,sun50i-a100-ths + - allwinner,sun50i-h5-ths + - allwinner,sun50i-h6-ths + + then: + required: + - clocks + - clock-names + - resets + +required: + - compatible + - reg + - interrupts + - '#thermal-sensor-cells' + +additionalProperties: false + +examples: + - | + thermal-sensor@1f04000 { + compatible = "allwinner,sun8i-a83t-ths"; + reg = <0x01f04000 0x100>; + interrupts = <0 31 0>; + nvmem-cells = <&ths_calibration>; + nvmem-cell-names = "calibration"; + #thermal-sensor-cells = <1>; + }; + + - | + thermal-sensor@1c25000 { + compatible = "allwinner,sun8i-h3-ths"; + reg = <0x01c25000 0x400>; + clocks = <&ccu 0>, <&ccu 1>; + clock-names = "bus", "mod"; + resets = <&ccu 2>; + interrupts = <0 31 0>; + nvmem-cells = <&ths_calibration>; + nvmem-cell-names = "calibration"; + #thermal-sensor-cells = <0>; + }; + + - | + thermal-sensor@5070400 { + compatible = "allwinner,sun50i-h6-ths"; + reg = <0x05070400 0x100>; + clocks = <&ccu 0>; + clock-names = "bus"; + resets = <&ccu 2>; + interrupts = <0 15 0>; + nvmem-cells = <&ths_calibration>; + nvmem-cell-names = "calibration"; + #thermal-sensor-cells = <1>; + }; + +... diff --git a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt new file mode 100644 index 000000000..12fc4ef04 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt @@ -0,0 +1,33 @@ +Amazon's Annapurna Labs Thermal Sensor + +Simple thermal device that allows temperature reading by a single MMIO +transaction. + +Required properties: +- compatible: "amazon,al-thermal". +- reg: The physical base address and length of the sensor's registers. +- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. + +Example: + thermal: thermal { + compatible = "amazon,al-thermal"; + reg = <0x0 0x05002860 0x0 0x1>; + #thermal-sensor-cells = <0x1>; + }; + + thermal-zones { + thermal-z0 { + polling-delay-passive = <250>; + polling-delay = <1000>; + thermal-sensors = <&thermal 0>; + trips { + critical { + temperature = <105000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + + }; + }; + diff --git a/Documentation/devicetree/bindings/thermal/amlogic,thermal.yaml b/Documentation/devicetree/bindings/thermal/amlogic,thermal.yaml new file mode 100644 index 000000000..999c6b365 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/amlogic,thermal.yaml @@ -0,0 +1,58 @@ +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/amlogic,thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Amlogic Thermal + +maintainers: + - Guillaume La Roque <glaroque@baylibre.com> + +description: Binding for Amlogic Thermal + +properties: + compatible: + items: + - enum: + - amlogic,g12a-cpu-thermal + - amlogic,g12a-ddr-thermal + - const: amlogic,g12a-thermal + + reg: + maxItems: 1 + + interrupts: + maxItems: 1 + + clocks: + maxItems: 1 + + amlogic,ao-secure: + description: phandle to the ao-secure syscon + $ref: '/schemas/types.yaml#/definitions/phandle' + + '#thermal-sensor-cells': + const: 0 + +required: + - compatible + - reg + - interrupts + - clocks + - amlogic,ao-secure + +additionalProperties: false + +examples: + - | + cpu_temp: temperature-sensor@ff634800 { + compatible = "amlogic,g12a-cpu-thermal", + "amlogic,g12a-thermal"; + reg = <0xff634800 0x50>; + interrupts = <0x0 0x24 0x0>; + clocks = <&clk 164>; + #thermal-sensor-cells = <0>; + amlogic,ao-secure = <&sec_AO>; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/armada-thermal.txt b/Documentation/devicetree/bindings/thermal/armada-thermal.txt new file mode 100644 index 000000000..b0bee7e42 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/armada-thermal.txt @@ -0,0 +1,41 @@ +* Marvell Armada 370/375/380/XP thermal management + +Required properties: + +- compatible: Should be set to one of the following: + * marvell,armada370-thermal + * marvell,armada375-thermal + * marvell,armada380-thermal + * marvell,armadaxp-thermal + * marvell,armada-ap806-thermal + * marvell,armada-cp110-thermal + +Note: these bindings are deprecated for AP806/CP110 and should instead +follow the rules described in: +Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt +Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt + +- reg: Device's register space. + Two entries are expected, see the examples below. The first one points + to the status register (4B). The second one points to the control + registers (8B). + Note: The compatibles marvell,armada370-thermal, + marvell,armada380-thermal, and marvell,armadaxp-thermal must point to + "control MSB/control 1", with size of 4 (deprecated binding), or point + to "control LSB/control 0" with size of 8 (current binding). All other + compatibles must point to "control LSB/control 0" with size of 8. + +Examples: + + /* Legacy bindings */ + thermal@d0018300 { + compatible = "marvell,armada370-thermal"; + reg = <0xd0018300 0x4 + 0xd0018304 0x4>; + }; + + ap_thermal: thermal@6f8084 { + compatible = "marvell,armada-ap806-thermal"; + reg = <0x6f808C 0x4>, + <0x6f8084 0x8>; + }; diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml new file mode 100644 index 000000000..89a2c32c0 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml @@ -0,0 +1,48 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/brcm,avs-ro-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Broadcom AVS ring oscillator thermal + +maintainers: + - Stefan Wahren <wahrenst@gmx.net> + +description: |+ + The thermal node should be the child of a syscon node with the + required property: + + - compatible: Should be one of the following: + "brcm,bcm2711-avs-monitor", "syscon", "simple-mfd" + + Refer to the bindings described in + Documentation/devicetree/bindings/mfd/syscon.yaml + +properties: + compatible: + const: brcm,bcm2711-thermal + + # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details + "#thermal-sensor-cells": + const: 0 + +required: + - compatible + - '#thermal-sensor-cells' + +additionalProperties: false + +examples: + - | + avs-monitor@7d5d2000 { + compatible = "brcm,bcm2711-avs-monitor", + "syscon", "simple-mfd"; + reg = <0x7d5d2000 0xf00>; + + thermal: thermal { + compatible = "brcm,bcm2711-thermal"; + #thermal-sensor-cells = <0>; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.yaml new file mode 100644 index 000000000..267a0f423 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,avs-tmon.yaml @@ -0,0 +1,56 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/brcm,avs-tmon.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Broadcom STB thermal management + +description: Thermal management core, provided by the AVS TMON hardware block. + +maintainers: + - Florian Fainelli <f.fainelli@gmail.com> + +allOf: + - $ref: thermal-sensor.yaml# + +properties: + compatible: + items: + - enum: + - brcm,avs-tmon-bcm7216 + - brcm,avs-tmon-bcm7445 + - const: brcm,avs-tmon + + reg: + maxItems: 1 + description: > + Address range for the AVS TMON registers + + interrupts: + maxItems: 1 + + interrupt-names: + items: + - const: tmon + + "#thermal-sensor-cells": + const: 0 + +additionalProperties: false + +required: + - compatible + - reg + - "#thermal-sensor-cells" + +examples: + - | + thermal@f04d1500 { + compatible = "brcm,avs-tmon-bcm7445", "brcm,avs-tmon"; + reg = <0xf04d1500 0x28>; + interrupts = <0x6>; + interrupt-names = "tmon"; + interrupt-parent = <&avs_host_l2_intc>; + #thermal-sensor-cells = <0>; + }; diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt new file mode 100644 index 000000000..a3e9ec5dc --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt @@ -0,0 +1,41 @@ +Binding for Thermal Sensor driver for BCM2835 SoCs. + +Required parameters: +------------------- + +compatible: should be one of: "brcm,bcm2835-thermal", + "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal" +reg: Address range of the thermal registers. +clocks: Phandle of the clock used by the thermal sensor. +#thermal-sensor-cells: should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml) + +Example: + +thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + + thermal-sensors = <&thermal>; + + trips { + cpu-crit { + temperature = <80000>; + hysteresis = <0>; + type = "critical"; + }; + }; + + coefficients = <(-538) 407000>; + + cooling-maps { + }; + }; +}; + +thermal: thermal@7e212000 { + compatible = "brcm,bcm2835-thermal"; + reg = <0x7e212000 0x8>; + clocks = <&clocks BCM2835_CLOCK_TSENS>; + #thermal-sensor-cells = <0>; +}; diff --git a/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.yaml new file mode 100644 index 000000000..fdeb333e0 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.yaml @@ -0,0 +1,60 @@ +# SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/brcm,ns-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Broadcom Northstar Thermal + +maintainers: + - Rafał Miłecki <rafal@milecki.pl> + +description: + Thermal sensor that is part of Northstar's DMU (Device Management Unit). + +allOf: + - $ref: thermal-sensor.yaml# + +properties: + compatible: + const: brcm,ns-thermal + + reg: + description: PVTMON registers range + maxItems: 1 + + "#thermal-sensor-cells": + const: 0 + +unevaluatedProperties: false + +required: + - reg + +examples: + - | + thermal: thermal@1800c2c0 { + compatible = "brcm,ns-thermal"; + reg = <0x1800c2c0 0x10>; + #thermal-sensor-cells = <0>; + }; + + thermal-zones { + cpu-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + coefficients = <(-556) 418000>; + thermal-sensors = <&thermal>; + + trips { + cpu-crit { + temperature = <125000>; + hysteresis = <0>; + type = "critical"; + }; + }; + + cooling-maps { + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/brcm,sr-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,sr-thermal.txt new file mode 100644 index 000000000..3ab330219 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,sr-thermal.txt @@ -0,0 +1,105 @@ +* Broadcom Stingray Thermal + +This binding describes thermal sensors that is part of Stingray SoCs. + +Required properties: +- compatible : Must be "brcm,sr-thermal" +- reg : Memory where tmon data will be available. +- brcm,tmon-mask: A one cell bit mask of valid TMON sources. + Each bit represents single TMON source. +- #thermal-sensor-cells : Thermal sensor phandler +- polling-delay: Max number of milliseconds to wait between polls. +- thermal-sensors: A list of thermal sensor phandles and specifier. + specifier value is tmon ID and it should be + in correspond with brcm,tmon-mask. +- temperature: trip temperature threshold in millicelsius. + +Example: + tmons { + compatible = "simple-bus"; + #address-cells = <1>; + #size-cells = <1>; + ranges = <0x0 0x0 0x8f100000 0x100>; + + tmon: tmon@0 { + compatible = "brcm,sr-thermal"; + reg = <0x0 0x40>; + brcm,tmon-mask = <0x3f>; + #thermal-sensor-cells = <1>; + }; + }; + + thermal-zones { + ihost0_thermal: ihost0-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + thermal-sensors = <&tmon 0>; + trips { + cpu-crit { + temperature = <105000>; + hysteresis = <0>; + type = "critical"; + }; + }; + }; + ihost1_thermal: ihost1-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + thermal-sensors = <&tmon 1>; + trips { + cpu-crit { + temperature = <105000>; + hysteresis = <0>; + type = "critical"; + }; + }; + }; + ihost2_thermal: ihost2-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + thermal-sensors = <&tmon 2>; + trips { + cpu-crit { + temperature = <105000>; + hysteresis = <0>; + type = "critical"; + }; + }; + }; + ihost3_thermal: ihost3-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + thermal-sensors = <&tmon 3>; + trips { + cpu-crit { + temperature = <105000>; + hysteresis = <0>; + type = "critical"; + }; + }; + }; + crmu_thermal: crmu-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + thermal-sensors = <&tmon 4>; + trips { + cpu-crit { + temperature = <105000>; + hysteresis = <0>; + type = "critical"; + }; + }; + }; + nitro_thermal: nitro-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + thermal-sensors = <&tmon 5>; + trips { + cpu-crit { + temperature = <105000>; + hysteresis = <0>; + type = "critical"; + }; + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/da9062-thermal.txt b/Documentation/devicetree/bindings/thermal/da9062-thermal.txt new file mode 100644 index 000000000..e241bb5a5 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/da9062-thermal.txt @@ -0,0 +1,36 @@ +* Dialog DA9062/61 TJUNC Thermal Module + +This module is part of the DA9061/DA9062. For more details about entire +DA9062 and DA9061 chips see Documentation/devicetree/bindings/mfd/da9062.txt + +Junction temperature thermal module uses an interrupt signal to identify +high THERMAL_TRIP_HOT temperatures for the PMIC device. + +Required properties: + +- compatible: should be one of the following valid compatible string lines: + "dlg,da9061-thermal", "dlg,da9062-thermal" + "dlg,da9062-thermal" + +Optional properties: + +- polling-delay-passive : Specify the polling period, measured in + milliseconds, between thermal zone device update checks. + +Example: DA9062 + + pmic0: da9062@58 { + thermal { + compatible = "dlg,da9062-thermal"; + polling-delay-passive = <3000>; + }; + }; + +Example: DA9061 using a fall-back compatible for the DA9062 onkey driver + + pmic0: da9061@58 { + thermal { + compatible = "dlg,da9061-thermal", "dlg,da9062-thermal"; + polling-delay-passive = <3000>; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/db8500-thermal.txt b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt new file mode 100644 index 000000000..2e1c06fad --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/db8500-thermal.txt @@ -0,0 +1,44 @@ +* ST-Ericsson DB8500 Thermal + +** Thermal node properties: + +- compatible : "stericsson,db8500-thermal"; +- reg : address range of the thermal sensor registers; +- interrupts : interrupts generated from PRCMU; +- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH"; +- num-trips : number of total trip points, this is required, set it 0 if none, + if greater than 0, the following properties must be defined; +- tripN-temp : temperature of trip point N, should be in ascending order; +- tripN-type : type of trip point N, should be one of "active" "passive" "hot" + "critical"; +- tripN-cdev-num : number of the cooling devices which can be bound to trip + point N, this is required if trip point N is defined, set it 0 if none, + otherwise the following cooling device names must be defined; +- tripN-cdev-nameM : name of the No. M cooling device of trip point N; + +Usually the num-trips and tripN-*** are separated in board related dts files. + +Example: +thermal@801573c0 { + compatible = "stericsson,db8500-thermal"; + reg = <0x801573c0 0x40>; + interrupts = <21 0x4>, <22 0x4>; + interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH"; + + num-trips = <3>; + + trip0-temp = <75000>; + trip0-type = "active"; + trip0-cdev-num = <1>; + trip0-cdev-name0 = "thermal-cpufreq-0"; + + trip1-temp = <80000>; + trip1-type = "active"; + trip1-cdev-num = <2>; + trip1-cdev-name0 = "thermal-cpufreq-0"; + trip1-cdev-name1 = "thermal-fan"; + + trip2-temp = <85000>; + trip2-type = "critical"; + trip2-cdev-num = <0>; +} diff --git a/Documentation/devicetree/bindings/thermal/dove-thermal.txt b/Documentation/devicetree/bindings/thermal/dove-thermal.txt new file mode 100644 index 000000000..6f474677d --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/dove-thermal.txt @@ -0,0 +1,18 @@ +* Dove Thermal + +This driver is for Dove SoCs which contain a thermal sensor. + +Required properties: +- compatible : "marvell,dove-thermal" +- reg : Address range of the thermal registers + +The reg properties should contain two ranges. The first is for the +three Thermal Manager registers, while the second range contains the +Thermal Diode Control Registers. + +Example: + + thermal@10078 { + compatible = "marvell,dove-thermal"; + reg = <0xd001c 0x0c>, <0xd005c 0x08>; + }; diff --git a/Documentation/devicetree/bindings/thermal/fsl,scu-thermal.yaml b/Documentation/devicetree/bindings/thermal/fsl,scu-thermal.yaml new file mode 100644 index 000000000..f9e4b3c8d --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/fsl,scu-thermal.yaml @@ -0,0 +1,38 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/fsl,scu-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: i.MX SCU Client Device Node - Thermal bindings based on SCU Message Protocol + +maintainers: + - Dong Aisheng <aisheng.dong@nxp.com> + +description: i.MX SCU Client Device Node + Client nodes are maintained as children of the relevant IMX-SCU device node. + +allOf: + - $ref: thermal-sensor.yaml# + +properties: + compatible: + items: + - const: fsl,imx8qxp-sc-thermal + - const: fsl,imx-sc-thermal + + '#thermal-sensor-cells': + const: 1 + +required: + - compatible + - '#thermal-sensor-cells' + +additionalProperties: false + +examples: + - | + thermal-sensor { + compatible = "fsl,imx8qxp-sc-thermal", "fsl,imx-sc-thermal"; + #thermal-sensor-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt new file mode 100644 index 000000000..4b19d80e6 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt @@ -0,0 +1,32 @@ +* Temperature Sensor on hisilicon SoCs + +** Required properties : + +- compatible: "hisilicon,tsensor". +- reg: physical base address of thermal sensor and length of memory mapped + region. +- interrupt: The interrupt number to the cpu. Defines the interrupt used + by /SOCTHERM/tsensor. +- clock-names: Input clock name, should be 'thermal_clk'. +- clocks: phandles for clock specified in "clock-names" property. +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. + +Example : + +for Hi6220: + tsensor: tsensor@0,f7030700 { + compatible = "hisilicon,tsensor"; + reg = <0x0 0xf7030700 0x0 0x1000>; + interrupts = <0 7 0x4>; + clocks = <&sys_ctrl HI6220_TSENSOR_CLK>; + clock-names = "thermal_clk"; + #thermal-sensor-cells = <1>; + } + +for Hi3660: + tsensor: tsensor@fff30000 { + compatible = "hisilicon,hi3660-tsensor"; + reg = <0x0 0xfff30000 0x0 0x1000>; + interrupts = <GIC_SPI 145 IRQ_TYPE_LEVEL_HIGH>; + #thermal-sensor-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/imx-thermal.yaml b/Documentation/devicetree/bindings/thermal/imx-thermal.yaml new file mode 100644 index 000000000..16b57f57d --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/imx-thermal.yaml @@ -0,0 +1,102 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/imx-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: NXP i.MX Thermal Binding + +maintainers: + - Shawn Guo <shawnguo@kernel.org> + - Anson Huang <Anson.Huang@nxp.com> + +properties: + compatible: + enum: + - fsl,imx6q-tempmon + - fsl,imx6sx-tempmon + - fsl,imx7d-tempmon + + interrupts: + description: | + The interrupt output of the controller, i.MX6Q has IRQ_HIGH which + will be triggered when temperature is higher than high threshold, + i.MX6SX and i.MX7S/D have two more IRQs than i.MX6Q, one is IRQ_LOW + and the other is IRQ_PANIC, when temperature is lower than low + threshold, IRQ_LOW will be triggered, when temperature is higher + than panic threshold, IRQ_PANIC will be triggered, and system can + be configured to auto reboot by SRC module for IRQ_PANIC. IRQ_HIGH, + IRQ_LOW and IRQ_PANIC share same interrupt output of controller. + maxItems: 1 + + nvmem-cells: + items: + - description: Phandle to the calibration data provided by ocotp + - description: Phandle to the temperature grade provided by ocotp + + nvmem-cell-names: + items: + - const: calib + - const: temp_grade + + fsl,tempmon: + $ref: '/schemas/types.yaml#/definitions/phandle' + description: Phandle to anatop system controller node. + + fsl,tempmon-data: + $ref: '/schemas/types.yaml#/definitions/phandle' + description: | + Deprecated property, phandle pointer to fuse controller that contains + TEMPMON calibration data, e.g. OCOTP on imx6q. The details about + calibration data can be found in SoC Reference Manual. + deprecated: true + + clocks: + maxItems: 1 + +required: + - compatible + - interrupts + - fsl,tempmon + - nvmem-cells + - nvmem-cell-names + +additionalProperties: false + +examples: + - | + #include <dt-bindings/clock/imx6sx-clock.h> + #include <dt-bindings/interrupt-controller/arm-gic.h> + + efuse@21bc000 { + #address-cells = <1>; + #size-cells = <1>; + compatible = "fsl,imx6sx-ocotp", "syscon"; + reg = <0x021bc000 0x4000>; + clocks = <&clks IMX6SX_CLK_OCOTP>; + + tempmon_calib: calib@38 { + reg = <0x38 4>; + }; + + tempmon_temp_grade: temp-grade@20 { + reg = <0x20 4>; + }; + }; + + anatop@20c8000 { + compatible = "fsl,imx6q-anatop", "syscon", "simple-mfd"; + reg = <0x020c8000 0x1000>; + interrupts = <0 49 IRQ_TYPE_LEVEL_HIGH>, + <0 54 IRQ_TYPE_LEVEL_HIGH>, + <0 127 IRQ_TYPE_LEVEL_HIGH>; + + tempmon { + compatible = "fsl,imx6sx-tempmon"; + interrupts = <GIC_SPI 49 IRQ_TYPE_LEVEL_HIGH>; + fsl,tempmon = <&anatop>; + nvmem-cells = <&tempmon_calib>, <&tempmon_temp_grade>; + nvmem-cell-names = "calib", "temp_grade"; + clocks = <&clks IMX6SX_CLK_PLL3_USB_OTG>; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml b/Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml new file mode 100644 index 000000000..89c54e08e --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml @@ -0,0 +1,62 @@ +# SPDX-License-Identifier: GPL-2.0 +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/imx8mm-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: NXP i.MX8M Mini Thermal Binding + +maintainers: + - Anson Huang <Anson.Huang@nxp.com> + +description: | + i.MX8MM has TMU IP to allow temperature measurement, there are + currently two distinct major versions of the IP that is supported + by a single driver. The IP versions are named v1 and v2, v1 is + for i.MX8MM which has ONLY 1 sensor, v2 is for i.MX8MP which has + 2 sensors. + +properties: + compatible: + oneOf: + - enum: + - fsl,imx8mm-tmu + - fsl,imx8mp-tmu + - items: + - const: fsl,imx8mn-tmu + - const: fsl,imx8mm-tmu + + reg: + maxItems: 1 + + clocks: + maxItems: 1 + + "#thermal-sensor-cells": + description: | + Number of cells required to uniquely identify the thermal + sensors, 0 for ONLY one sensor and 1 for multiple sensors. + enum: + - 0 + - 1 + +required: + - compatible + - reg + - clocks + - '#thermal-sensor-cells' + +additionalProperties: false + +examples: + - | + #include <dt-bindings/clock/imx8mm-clock.h> + + thermal-sensor@30260000 { + compatible = "fsl,imx8mm-tmu"; + reg = <0x30260000 0x10000>; + clocks = <&clk IMX8MM_CLK_TMU_ROOT>; + #thermal-sensor-cells = <0>; + }; + +... diff --git a/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt b/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt new file mode 100644 index 000000000..8c0f5eb86 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/kirkwood-thermal.txt @@ -0,0 +1,15 @@ +* Kirkwood Thermal + +This version is for Kirkwood 88F8262 & 88F6283 SoCs. Other kirkwoods +don't contain a thermal sensor. + +Required properties: +- compatible : "marvell,kirkwood-thermal" +- reg : Address range of the thermal registers + +Example: + + thermal@10078 { + compatible = "marvell,kirkwood-thermal"; + reg = <0x10078 0x4>; + }; diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt new file mode 100644 index 000000000..82ed5d487 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt @@ -0,0 +1,70 @@ +Thermal driver for MAX77620 Power management IC from Maxim Semiconductor. + +Maxim Semiconductor MAX77620 supports alarm interrupts when its +die temperature crosses 120C and 140C. These threshold temperatures +are not configurable. Device does not provide the real temperature +of die other than just indicating whether temperature is above or +below threshold level. + +Required properties: +------------------- +#thermal-sensor-cells: For more details, please refer to + <devicetree/bindings/thermal/thermal-sensor.yaml> + The value must be 0. + +For more details, please refer generic thermal DT binding document +<devicetree/bindings/thermal/thermal*.yaml>. + +Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding +document for the MAX77620. + +Example: +-------- +#include <dt-bindings/mfd/max77620.h> +#include <dt-bindings/thermal/thermal.h> +... + +i2c@7000d000 { + spmic: max77620@3c { + compatible = "maxim,max77620"; + ::::: + #thermal-sensor-cells = <0>; + ::: + }; +}; + +cool_dev: cool-dev { + compatible = "cooling-dev"; + #cooling-cells = <2>; +}; + +thermal-zones { + PMIC-Die { + polling-delay = <0>; + polling-delay-passive = <0>; + thermal-sensors = <&spmic>; + + trips { + pmic_die_warn_temp_thresh: hot-die { + temperature = <120000>; + type = "hot"; + hysteresis = <0>; + }; + + pmic_die_cirt_temp_thresh: cirtical-die { + temperature = <140000>; + type = "critical"; + hysteresis = <0>; + }; + }; + + cooling-maps { + map0 { + trip = <&pmic_die_warn_temp_thresh>; + cooling-device = <&cool_dev THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + contribution = <100>; + }; + }; + }; +}; diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt new file mode 100644 index 000000000..5c7e7bdd0 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt @@ -0,0 +1,49 @@ +* Mediatek Thermal + +This describes the device tree binding for the Mediatek thermal controller +which measures the on-SoC temperatures. This device does not have its own ADC, +instead it directly controls the AUXADC via AHB bus accesses. For this reason +this device needs phandles to the AUXADC. Also it controls a mux in the +apmixedsys register space via AHB bus accesses, so a phandle to the APMIXEDSYS +is also needed. + +Required properties: +- compatible: + - "mediatek,mt8173-thermal" : For MT8173 family of SoCs + - "mediatek,mt2701-thermal" : For MT2701 family of SoCs + - "mediatek,mt2712-thermal" : For MT2712 family of SoCs + - "mediatek,mt7622-thermal" : For MT7622 SoC + - "mediatek,mt8183-thermal" : For MT8183 family of SoCs + - "mediatek,mt8516-thermal", "mediatek,mt2701-thermal : For MT8516 family of SoCs +- reg: Address range of the thermal controller +- interrupts: IRQ for the thermal controller +- clocks, clock-names: Clocks needed for the thermal controller. required + clocks are: + "therm": Main clock needed for register access + "auxadc": The AUXADC clock +- mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses +- mediatek,apmixedsys: A phandle to the APMIXEDSYS controller. +- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. + +Optional properties: +- resets: Reference to the reset controller controlling the thermal controller. +- nvmem-cells: A phandle to the calibration data provided by a nvmem device. If + unspecified default values shall be used. +- nvmem-cell-names: Should be "calibration-data" + +Example: + + thermal: thermal@1100b000 { + #thermal-sensor-cells = <1>; + compatible = "mediatek,mt8173-thermal"; + reg = <0 0x1100b000 0 0x1000>; + interrupts = <0 70 IRQ_TYPE_LEVEL_LOW>; + clocks = <&pericfg CLK_PERI_THERM>, <&pericfg CLK_PERI_AUXADC>; + clock-names = "therm", "auxadc"; + resets = <&pericfg MT8173_PERI_THERM_SW_RST>; + reset-names = "therm"; + mediatek,auxadc = <&auxadc>; + mediatek,apmixedsys = <&apmixedsys>; + nvmem-cells = <&thermal_calibration_data>; + nvmem-cell-names = "calibration-data"; + }; diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt new file mode 100644 index 000000000..aea4a2a17 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt @@ -0,0 +1,238 @@ +Tegra124 SOCTHERM thermal management system + +The SOCTHERM IP block contains thermal sensors, support for polled +or interrupt-based thermal monitoring, CPU and GPU throttling based +on temperature trip points, and handling external overcurrent +notifications. It is also used to manage emergency shutdown in an +overheating situation. + +Required properties : +- compatible : For Tegra124, must contain "nvidia,tegra124-soctherm". + For Tegra132, must contain "nvidia,tegra132-soctherm". + For Tegra210, must contain "nvidia,tegra210-soctherm". +- reg : Should contain at least 2 entries for each entry in reg-names: + - SOCTHERM register set + - Tegra CAR register set: Required for Tegra124 and Tegra210. + - CCROC register set: Required for Tegra132. +- reg-names : Should contain at least 2 entries: + - soctherm-reg + - car-reg + - ccroc-reg +- interrupts : Defines the interrupt used by SOCTHERM +- clocks : Must contain an entry for each entry in clock-names. + See ../clocks/clock-bindings.txt for details. +- clock-names : Must include the following entries: + - tsensor + - soctherm +- resets : Must contain an entry for each entry in reset-names. + See ../reset/reset.txt for details. +- reset-names : Must include the following entries: + - soctherm +- #thermal-sensor-cells : Should be 1. For a description of this property, see + Documentation/devicetree/bindings/thermal/thermal-sensor.yaml. + See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values + when referring to thermal sensors. +- throttle-cfgs: A sub-node which is a container of configuration for each + hardware throttle events. These events can be set as cooling devices. + * throttle events: Sub-nodes must be named as "light" or "heavy". + Properties: + - nvidia,priority: Each throttles has its own throttle settings, so the + SW need to set priorities for various throttle, the HW arbiter can select + the final throttle settings. + Bigger value indicates higher priority, In general, higher priority + translates to lower target frequency. SW needs to ensure that critical + thermal alarms are given higher priority, and ensure that there is + no race if priority of two vectors is set to the same value. + The range of this value is 1~100. + - nvidia,cpu-throt-percent: This property is for Tegra124 and Tegra210. + It is the throttling depth of pulse skippers, it's the percentage + throttling. + - nvidia,cpu-throt-level: This property is only for Tegra132, it is the + level of pulse skippers, which used to throttle clock frequencies. It + indicates cpu clock throttling depth, and the depth can be programmed. + Must set as following values: + TEGRA_SOCTHERM_THROT_LEVEL_LOW, TEGRA_SOCTHERM_THROT_LEVEL_MED + TEGRA_SOCTHERM_THROT_LEVEL_HIGH, TEGRA_SOCTHERM_THROT_LEVEL_NONE + - nvidia,gpu-throt-level: This property is for Tegra124 and Tegra210. + It is the level of pulse skippers, which used to throttle clock + frequencies. It indicates gpu clock throttling depth and can be + programmed to any of the following values which represent a throttling + percentage: + TEGRA_SOCTHERM_THROT_LEVEL_NONE (0%) + TEGRA_SOCTHERM_THROT_LEVEL_LOW (50%), + TEGRA_SOCTHERM_THROT_LEVEL_MED (75%), + TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%). + - #cooling-cells: Should be 1. This cooling device only support on/off state. + For a description of this property see: + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml + + Optional properties: The following properties are T210 specific and + valid only for OCx throttle events. + - nvidia,count-threshold: Specifies the number of OC events that are + required for triggering an interrupt. Interrupts are not triggered if + the property is missing. A value of 0 will interrupt on every OC alarm. + - nvidia,polarity-active-low: Configures the polarity of the OC alaram + signal. If present, this means assert low, otherwise assert high. + - nvidia,alarm-filter: Number of clocks to filter event. When the filter + expires (which means the OC event has not occurred for a long time), + the counter is cleared and filter is rearmed. Default value is 0. + - nvidia,throttle-period-us: Specifies the number of uSec for which + throttling is engaged after the OC event is deasserted. Default value + is 0. + +Optional properties: +- nvidia,thermtrips : When present, this property specifies the temperature at + which the soctherm hardware will assert the thermal trigger signal to the + Power Management IC, which can be configured to reset or shutdown the device. + It is an array of pairs where each pair represents a tsensor id followed by a + temperature in milli Celcius. In the absence of this property the critical + trip point will be used for thermtrip temperature. + +Note: +- the "critical" type trip points will be used to set the temperature at which +the SOC_THERM hardware will assert a thermal trigger if the "nvidia,thermtrips" +property is missing. When the thermtrips property is present, the breach of a +critical trip point is reported back to the thermal framework to implement +software shutdown. + +- the "hot" type trip points will be set to SOC_THERM hardware as the throttle +temperature. Once the temperature of this thermal zone is higher +than it, it will trigger the HW throttle event. + +Example : + + soctherm@700e2000 { + compatible = "nvidia,tegra124-soctherm"; + reg = <0x0 0x700e2000 0x0 0x600 /* SOC_THERM reg_base */ + 0x0 0x60006000 0x0 0x400 /* CAR reg_base */ + reg-names = "soctherm-reg", "car-reg"; + interrupts = <GIC_SPI 48 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&tegra_car TEGRA124_CLK_TSENSOR>, + <&tegra_car TEGRA124_CLK_SOC_THERM>; + clock-names = "tsensor", "soctherm"; + resets = <&tegra_car 78>; + reset-names = "soctherm"; + + #thermal-sensor-cells = <1>; + + nvidia,thermtrips = <TEGRA124_SOCTHERM_SENSOR_CPU 102500 + TEGRA124_SOCTHERM_SENSOR_GPU 103000>; + + throttle-cfgs { + /* + * When the "heavy" cooling device triggered, + * the HW will skip cpu clock's pulse in 85% depth, + * skip gpu clock's pulse in 85% level + */ + throttle_heavy: heavy { + nvidia,priority = <100>; + nvidia,cpu-throt-percent = <85>; + nvidia,gpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_HIGH>; + + #cooling-cells = <1>; + }; + + /* + * When the "light" cooling device triggered, + * the HW will skip cpu clock's pulse in 50% depth, + * skip gpu clock's pulse in 50% level + */ + throttle_light: light { + nvidia,priority = <80>; + nvidia,cpu-throt-percent = <50>; + nvidia,gpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_LOW>; + + #cooling-cells = <1>; + }; + + /* + * If these two devices are triggered in same time, the HW throttle + * arbiter will select the highest priority as the final throttle + * settings to skip cpu pulse. + */ + + throttle_oc1: oc1 { + nvidia,priority = <50>; + nvidia,polarity-active-low; + nvidia,count-threshold = <100>; + nvidia,alarm-filter = <5100000>; + nvidia,throttle-period-us = <0>; + nvidia,cpu-throt-percent = <75>; + nvidia,gpu-throt-level = + <TEGRA_SOCTHERM_THROT_LEVEL_MED>; + }; + }; + }; + +Example: referring to Tegra132's "reg", "reg-names" and "throttle-cfgs" : + + soctherm@700e2000 { + compatible = "nvidia,tegra132-soctherm"; + reg = <0x0 0x700e2000 0x0 0x600 /* SOC_THERM reg_base */ + 0x0 0x70040000 0x0 0x200>; /* CCROC reg_base */; + reg-names = "soctherm-reg", "ccroc-reg"; + + throttle-cfgs { + /* + * When the "heavy" cooling device triggered, + * the HW will skip cpu clock's pulse in HIGH level + */ + throttle_heavy: heavy { + nvidia,priority = <100>; + nvidia,cpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_HIGH>; + + #cooling-cells = <1>; + }; + + /* + * When the "light" cooling device triggered, + * the HW will skip cpu clock's pulse in MED level + */ + throttle_light: light { + nvidia,priority = <80>; + nvidia,cpu-throt-level = <TEGRA_SOCTHERM_THROT_LEVEL_MED>; + + #cooling-cells = <1>; + }; + + /* + * If these two devices are triggered in same time, the HW throttle + * arbiter will select the highest priority as the final throttle + * settings to skip cpu pulse. + */ + + }; + }; + +Example: referring to thermal sensors : + + thermal-zones { + cpu { + polling-delay-passive = <1000>; + polling-delay = <1000>; + + thermal-sensors = + <&soctherm TEGRA124_SOCTHERM_SENSOR_CPU>; + + trips { + cpu_shutdown_trip: shutdown-trip { + temperature = <102500>; + hysteresis = <1000>; + type = "critical"; + }; + + cpu_throttle_trip: throttle-trip { + temperature = <100000>; + hysteresis = <1000>; + type = "hot"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_throttle_trip>; + cooling-device = <&throttle_heavy 1 1>; + }; + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.yaml b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.yaml new file mode 100644 index 000000000..c91fd07e4 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.yaml @@ -0,0 +1,42 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/nvidia,tegra186-bpmp-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: NVIDIA Tegra186 (and later) BPMP thermal sensor + +maintainers: + - Thierry Reding <thierry.reding@gmail.com> + - Jon Hunter <jonathanh@nvidia.com> + +description: | + In Tegra186, the BPMP (Boot and Power Management Processor) implements + an interface that is used to read system temperatures, including CPU + cluster and GPU temperatures. This binding describes the thermal + sensor that is exposed by BPMP. + + The BPMP thermal node must be located directly inside the main BPMP + node. See ../firmware/nvidia,tegra186-bpmp.yaml for details of the + BPMP binding. + + This node represents a thermal sensor. See + + Documentation/devicetree/bindings/thermal/thermal-sensor.yaml + + for details of the core thermal binding. + +properties: + compatible: + enum: + - nvidia,tegra186-bpmp-thermal + - nvidia,tegra194-bpmp-thermal + + '#thermal-sensor-cells': + $ref: /schemas/types.yaml#/definitions/uint32 + description: Number of cells needed in the phandle specifier to + identify a given sensor. Must be 1 and the single cell specifies + the sensor index. + const: 1 + +additionalProperties: false diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra30-tsensor.yaml b/Documentation/devicetree/bindings/thermal/nvidia,tegra30-tsensor.yaml new file mode 100644 index 000000000..a35da257b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra30-tsensor.yaml @@ -0,0 +1,73 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/nvidia,tegra30-tsensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: NVIDIA Tegra30 Thermal Sensor + +maintainers: + - Dmitry Osipenko <digetx@gmail.com> + - Jon Hunter <jonathanh@nvidia.com> + - Thierry Reding <thierry.reding@gmail.com> + +description: | + TSENSOR provides thermal and voltage sensors which monitor temperature + and voltage of the chip. Sensors are placed across the die to gauge the + temperature of the whole chip. The TSENSOR module: + + Generates an interrupt to SW to lower temperature via DVFS on reaching + a certain thermal/voltage threshold. + + Generates a signal to the CAR to reduce CPU frequency by half on reaching + a certain thermal/voltage threshold. + + Generates a signal to the PMC when the temperature reaches dangerously high + levels to reset the chip and sets a flag in the PMC. + + TSENSOR has two channels which monitor two different spots of the SoC. + +properties: + compatible: + const: nvidia,tegra30-tsensor + + reg: + maxItems: 1 + + clocks: + maxItems: 1 + + resets: + maxItems: 1 + + interrupts: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + + assigned-clock-parents: true + assigned-clock-rates: true + assigned-clocks: true + +required: + - compatible + - reg + - clocks + - resets + - interrupts + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + thermal-sensor@70014000 { + compatible = "nvidia,tegra30-tsensor"; + reg = <0x70014000 0x500>; + interrupts = <0 102 4>; + clocks = <&clk 100>; + resets = <&rst 100>; + + #thermal-sensor-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/qcom,spmi-temp-alarm.yaml b/Documentation/devicetree/bindings/thermal/qcom,spmi-temp-alarm.yaml new file mode 100644 index 000000000..5f08b6e59 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom,spmi-temp-alarm.yaml @@ -0,0 +1,85 @@ +# SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/qcom,spmi-temp-alarm.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Qualcomm QPNP PMIC Temperature Alarm + +maintainers: + - Bjorn Andersson <bjorn.andersson@linaro.org> + +description: + QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips + that utilize the Qualcomm SPMI implementation. These peripherals provide an + interrupt signal and status register to identify high PMIC die temperature. + +allOf: + - $ref: thermal-sensor.yaml# + +properties: + compatible: + const: qcom,spmi-temp-alarm + + reg: + maxItems: 1 + + interrupts: + maxItems: 1 + + io-channels: + items: + - description: ADC channel, which reports chip die temperature + + io-channel-names: + items: + - const: thermal + + '#thermal-sensor-cells': + const: 0 + +required: + - compatible + - reg + - interrupts + - '#thermal-sensor-cells' + +additionalProperties: false + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + + pmic { + #address-cells = <1>; + #size-cells = <0>; + + pm8350_temp_alarm: temperature-sensor@a00 { + compatible = "qcom,spmi-temp-alarm"; + reg = <0xa00>; + interrupts = <0x1 0xa 0x0 IRQ_TYPE_EDGE_BOTH>; + #thermal-sensor-cells = <0>; + }; + }; + + thermal-zones { + pm8350_thermal: pm8350c-thermal { + polling-delay-passive = <100>; + polling-delay = <0>; + thermal-sensors = <&pm8350_temp_alarm>; + + trips { + pm8350_trip0: trip0 { + temperature = <95000>; + hysteresis = <0>; + type = "passive"; + }; + + pm8350_crit: pm8350c-crit { + temperature = <115000>; + hysteresis = <0>; + type = "critical"; + }; + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/qcom-lmh.yaml b/Documentation/devicetree/bindings/thermal/qcom-lmh.yaml new file mode 100644 index 000000000..e1587ddf7 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom-lmh.yaml @@ -0,0 +1,84 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +# Copyright 2021 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/qcom-lmh.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Qualcomm Limits Management Hardware(LMh) + +maintainers: + - Thara Gopinath <thara.gopinath@linaro.org> + +description: + Limits Management Hardware(LMh) is a hardware infrastructure on some + Qualcomm SoCs that can enforce temperature and current limits as + programmed by software for certain IPs like CPU. + +properties: + compatible: + enum: + - qcom,sc8180x-lmh + - qcom,sdm845-lmh + - qcom,sm8150-lmh + + reg: + items: + - description: core registers + + interrupts: + maxItems: 1 + + '#interrupt-cells': + const: 1 + + interrupt-controller: true + + cpus: + description: + phandle of the first cpu in the LMh cluster + $ref: /schemas/types.yaml#/definitions/phandle + + qcom,lmh-temp-arm-millicelsius: + description: + An integer expressing temperature threshold at which the LMh thermal + FSM is engaged. + + qcom,lmh-temp-low-millicelsius: + description: + An integer expressing temperature threshold at which the state machine + will attempt to remove frequency throttling. + + qcom,lmh-temp-high-millicelsius: + description: + An integer expressing temperature threshold at which the state machine + will attempt to throttle the frequency. + +required: + - compatible + - reg + - interrupts + - '#interrupt-cells' + - interrupt-controller + - cpus + - qcom,lmh-temp-arm-millicelsius + - qcom,lmh-temp-low-millicelsius + - qcom,lmh-temp-high-millicelsius + +additionalProperties: false + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + + lmh@17d70800 { + compatible = "qcom,sdm845-lmh"; + reg = <0x17d70800 0x400>; + interrupts = <GIC_SPI 33 IRQ_TYPE_LEVEL_HIGH>; + cpus = <&CPU4>; + qcom,lmh-temp-arm-millicelsius = <65000>; + qcom,lmh-temp-low-millicelsius = <94500>; + qcom,lmh-temp-high-millicelsius = <95000>; + interrupt-controller; + #interrupt-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm-hc.yaml b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm-hc.yaml new file mode 100644 index 000000000..8273ac55b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm-hc.yaml @@ -0,0 +1,149 @@ +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/qcom-spmi-adc-tm-hc.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Qualcomm's SPMI PMIC ADC HC Thermal Monitoring +maintainers: + - Dmitry Baryshkov <dmitry.baryshkov@linaro.org> + +properties: + compatible: + const: qcom,spmi-adc-tm-hc + + reg: + maxItems: 1 + + interrupts: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + description: + Number of cells required to uniquely identify the thermal sensors. Since + we have multiple sensors this is set to 1 + + "#address-cells": + const: 1 + + "#size-cells": + const: 0 + + qcom,avg-samples: + $ref: /schemas/types.yaml#/definitions/uint32 + description: Number of samples to be used for measurement. + enum: + - 1 + - 2 + - 4 + - 8 + - 16 + default: 1 + + qcom,decimation: + $ref: /schemas/types.yaml#/definitions/uint32 + description: This parameter is used to decrease ADC sampling rate. + Quicker measurements can be made by reducing decimation ratio. + enum: + - 256 + - 512 + - 1024 + default: 1024 + +patternProperties: + "^([-a-z0-9]*)@[0-7]$": + type: object + description: + Represent one thermal sensor. + + properties: + reg: + description: Specify the sensor channel. There are 8 channels in PMIC5's ADC TM + minimum: 0 + maximum: 7 + + io-channels: + description: + From common IIO binding. Used to pipe PMIC ADC channel to thermal monitor + + qcom,ratiometric: + $ref: /schemas/types.yaml#/definitions/flag + description: + Channel calibration type. + If this property is specified VADC will use the VDD reference + (1.875V) and GND for channel calibration. If property is not found, + channel will be calibrated with 0V and 1.25V reference channels, + also known as absolute calibration. + + qcom,hw-settle-time-us: + description: Time between AMUX getting configured and the ADC starting conversion. + enum: [0, 100, 200, 300, 400, 500, 600, 700, 1000, 2000, 4000, 6000, 8000, 10000] + + qcom,pre-scaling: + $ref: /schemas/types.yaml#/definitions/uint32-array + description: Used for scaling the channel input signal before the + signal is fed to VADC. The configuration for this node is to know the + pre-determined ratio and use it for post scaling. It is a pair of + integers, denoting the numerator and denominator of the fraction by + which input signal is multiplied. For example, <1 3> indicates the + signal is scaled down to 1/3 of its value before ADC measurement. If + property is not found default value depending on chip will be used. + items: + - const: 1 + - enum: [ 1, 3, 4, 6, 20, 8, 10 ] + + required: + - reg + - io-channels + + additionalProperties: + false + +required: + - compatible + - reg + - interrupts + - "#address-cells" + - "#size-cells" + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include <dt-bindings/iio/qcom,spmi-vadc.h> + #include <dt-bindings/interrupt-controller/irq.h> + spmi_bus { + #address-cells = <1>; + #size-cells = <0>; + pm8998_adc: adc@3100 { + reg = <0x3100>; + compatible = "qcom,spmi-adc-rev2"; + #address-cells = <1>; + #size-cells = <0>; + #io-channel-cells = <1>; + + /* Other propreties are omitted */ + adc-chan@4c { + reg = <ADC5_XO_THERM_100K_PU>; + }; + }; + + pm8998_adc_tm: adc-tm@3400 { + compatible = "qcom,spmi-adc-tm-hc"; + reg = <0x3400>; + interrupts = <0x2 0x34 0x0 IRQ_TYPE_EDGE_RISING>; + #thermal-sensor-cells = <1>; + #address-cells = <1>; + #size-cells = <0>; + + thermistor@1 { + reg = <1>; + io-channels = <&pm8998_adc ADC5_XO_THERM_100K_PU>; + qcom,ratiometric; + qcom,hw-settle-time-us = <200>; + }; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml new file mode 100644 index 000000000..feb390d50 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml @@ -0,0 +1,257 @@ +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/qcom-spmi-adc-tm5.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Qualcomm's SPMI PMIC ADC Thermal Monitoring +maintainers: + - Dmitry Baryshkov <dmitry.baryshkov@linaro.org> + +properties: + compatible: + enum: + - qcom,spmi-adc-tm5 + - qcom,spmi-adc-tm5-gen2 + + reg: + maxItems: 1 + + interrupts: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + description: + Number of cells required to uniquely identify the thermal sensors. Since + we have multiple sensors this is set to 1 + + "#address-cells": + const: 1 + + "#size-cells": + const: 0 + + qcom,avg-samples: + $ref: /schemas/types.yaml#/definitions/uint32 + description: Number of samples to be used for measurement. + Not applicable for Gen2 ADC_TM peripheral. + enum: + - 1 + - 2 + - 4 + - 8 + - 16 + default: 1 + + qcom,decimation: + $ref: /schemas/types.yaml#/definitions/uint32 + description: This parameter is used to decrease ADC sampling rate. + Quicker measurements can be made by reducing decimation ratio. + Not applicable for Gen2 ADC_TM peripheral. + enum: + - 250 + - 420 + - 840 + default: 840 + +patternProperties: + "^([-a-z0-9]*)@[0-7]$": + type: object + description: + Represent one thermal sensor. + + properties: + reg: + description: Specify the sensor channel. There are 8 channels in PMIC5's ADC TM + minimum: 0 + maximum: 7 + + io-channels: + description: + From common IIO binding. Used to pipe PMIC ADC channel to thermal monitor + + qcom,ratiometric: + $ref: /schemas/types.yaml#/definitions/flag + description: + Channel calibration type. + If this property is specified VADC will use the VDD reference + (1.875V) and GND for channel calibration. If property is not found, + channel will be calibrated with 0V and 1.25V reference channels, + also known as absolute calibration. + + qcom,hw-settle-time-us: + description: Time between AMUX getting configured and the ADC starting conversion. + enum: [15, 100, 200, 300, 400, 500, 600, 700, 1000, 2000, 4000, 8000, 16000, 32000, 64000, 128000] + + qcom,pre-scaling: + $ref: /schemas/types.yaml#/definitions/uint32-array + description: Used for scaling the channel input signal before the + signal is fed to VADC. The configuration for this node is to know the + pre-determined ratio and use it for post scaling. It is a pair of + integers, denoting the numerator and denominator of the fraction by + which input signal is multiplied. For example, <1 3> indicates the + signal is scaled down to 1/3 of its value before ADC measurement. If + property is not found default value depending on chip will be used. + items: + - const: 1 + - enum: [ 1, 3, 4, 6, 20, 8, 10 ] + + qcom,avg-samples: + $ref: /schemas/types.yaml#/definitions/uint32 + description: Number of samples to be used for measurement. + This property in child node is applicable only for Gen2 ADC_TM peripheral. + enum: + - 1 + - 2 + - 4 + - 8 + - 16 + default: 1 + + qcom,decimation: + $ref: /schemas/types.yaml#/definitions/uint32 + description: This parameter is used to decrease ADC sampling rate. + Quicker measurements can be made by reducing decimation ratio. + This property in child node is applicable only for Gen2 ADC_TM peripheral. + enum: + - 85 + - 340 + - 1360 + default: 1360 + + required: + - reg + - io-channels + + additionalProperties: + false + +allOf: + - if: + properties: + compatible: + contains: + const: qcom,spmi-adc-tm5 + + then: + patternProperties: + "^([-a-z0-9]*)@[0-7]$": + properties: + qcom,decimation: false + qcom,avg-samples: false + + - if: + properties: + compatible: + contains: + const: qcom,spmi-adc-tm5-gen2 + + then: + properties: + qcom,avg-samples: false + qcom,decimation: false + +required: + - compatible + - reg + - interrupts + - "#address-cells" + - "#size-cells" + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include <dt-bindings/iio/qcom,spmi-vadc.h> + #include <dt-bindings/interrupt-controller/irq.h> + spmi_bus { + #address-cells = <1>; + #size-cells = <0>; + pm8150b_adc: adc@3100 { + reg = <0x3100>; + compatible = "qcom,spmi-adc5"; + #address-cells = <1>; + #size-cells = <0>; + #io-channel-cells = <1>; + + /* Other properties are omitted */ + conn-therm@4f { + reg = <ADC5_AMUX_THM3_100K_PU>; + qcom,ratiometric; + qcom,hw-settle-time = <200>; + }; + }; + + pm8150b_adc_tm: adc-tm@3500 { + compatible = "qcom,spmi-adc-tm5"; + reg = <0x3500>; + interrupts = <0x2 0x35 0x0 IRQ_TYPE_EDGE_RISING>; + #thermal-sensor-cells = <1>; + #address-cells = <1>; + #size-cells = <0>; + + conn-therm@0 { + reg = <0>; + io-channels = <&pm8150b_adc ADC5_AMUX_THM3_100K_PU>; + qcom,ratiometric; + qcom,hw-settle-time-us = <200>; + }; + }; + }; + + - | + #include <dt-bindings/iio/qcom,spmi-adc7-pmk8350.h> + #include <dt-bindings/iio/qcom,spmi-adc7-pm8350.h> + #include <dt-bindings/interrupt-controller/irq.h> + spmi_bus { + #address-cells = <1>; + #size-cells = <0>; + pmk8350_vadc: adc@3100 { + reg = <0x3100>; + compatible = "qcom,spmi-adc7"; + #address-cells = <1>; + #size-cells = <0>; + #io-channel-cells = <1>; + + /* Other properties are omitted */ + xo-therm@44 { + reg = <PMK8350_ADC7_AMUX_THM1_100K_PU>; + qcom,ratiometric; + qcom,hw-settle-time = <200>; + }; + + conn-therm@47 { + reg = <PM8350_ADC7_AMUX_THM4_100K_PU>; + qcom,ratiometric; + qcom,hw-settle-time = <200>; + }; + }; + + pmk8350_adc_tm: adc-tm@3400 { + compatible = "qcom,spmi-adc-tm5-gen2"; + reg = <0x3400>; + interrupts = <0x0 0x34 0x0 IRQ_TYPE_EDGE_RISING>; + #thermal-sensor-cells = <1>; + #address-cells = <1>; + #size-cells = <0>; + + pmk8350-xo-therm@0 { + reg = <0>; + io-channels = <&pmk8350_vadc PMK8350_ADC7_AMUX_THM1_100K_PU>; + qcom,decimation = <340>; + qcom,ratiometric; + qcom,hw-settle-time-us = <200>; + }; + + conn-therm@1 { + reg = <1>; + io-channels = <&pmk8350_vadc PM8350_ADC7_AMUX_THM4_100K_PU>; + qcom,avg-samples = <2>; + qcom,ratiometric; + qcom,hw-settle-time-us = <200>; + }; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml new file mode 100644 index 000000000..038d81338 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml @@ -0,0 +1,229 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2019 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/qcom-tsens.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: QCOM SoC Temperature Sensor (TSENS) + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + QCOM SoCs have TSENS IP to allow temperature measurement. There are currently + three distinct major versions of the IP that is supported by a single driver. + The IP versions are named v0.1, v1 and v2 in the driver, where v0.1 captures + everything before v1 when there was no versioning information. + +properties: + compatible: + oneOf: + - description: msm8960 TSENS based + items: + - enum: + - qcom,ipq8064-tsens + - qcom,msm8960-tsens + + - description: v0.1 of TSENS + items: + - enum: + - qcom,mdm9607-tsens + - qcom,msm8916-tsens + - qcom,msm8939-tsens + - qcom,msm8974-tsens + - const: qcom,tsens-v0_1 + + - description: v1 of TSENS + items: + - enum: + - qcom,msm8976-tsens + - qcom,qcs404-tsens + - const: qcom,tsens-v1 + + - description: v2 of TSENS + items: + - enum: + - qcom,msm8953-tsens + - qcom,msm8996-tsens + - qcom,msm8998-tsens + - qcom,sc7180-tsens + - qcom,sc7280-tsens + - qcom,sc8180x-tsens + - qcom,sc8280xp-tsens + - qcom,sdm630-tsens + - qcom,sdm845-tsens + - qcom,sm6350-tsens + - qcom,sm8150-tsens + - qcom,sm8250-tsens + - qcom,sm8350-tsens + - const: qcom,tsens-v2 + + reg: + items: + - description: TM registers + - description: SROT registers + + interrupts: + minItems: 1 + items: + - description: Combined interrupt if upper or lower threshold crossed + - description: Interrupt if critical threshold crossed + + interrupt-names: + minItems: 1 + items: + - const: uplow + - const: critical + + nvmem-cells: + minItems: 1 + maxItems: 2 + description: + Reference to an nvmem node for the calibration data + + nvmem-cell-names: + minItems: 1 + items: + - const: calib + - enum: + - calib_backup + - calib_sel + + "#qcom,sensors": + description: + Number of sensors enabled on this platform + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 1 + maximum: 16 + + "#thermal-sensor-cells": + const: 1 + description: + Number of cells required to uniquely identify the thermal sensors. Since + we have multiple sensors this is set to 1 + +required: + - compatible + - interrupts + - interrupt-names + - "#thermal-sensor-cells" + - "#qcom,sensors" + +allOf: + - if: + properties: + compatible: + contains: + enum: + - qcom,ipq8064-tsens + - qcom,mdm9607-tsens + - qcom,msm8916-tsens + - qcom,msm8960-tsens + - qcom,msm8974-tsens + - qcom,msm8976-tsens + - qcom,qcs404-tsens + - qcom,tsens-v0_1 + - qcom,tsens-v1 + then: + properties: + interrupts: + maxItems: 1 + interrupt-names: + maxItems: 1 + + else: + properties: + interrupts: + minItems: 2 + interrupt-names: + minItems: 2 + + - if: + properties: + compatible: + contains: + enum: + - qcom,tsens-v0_1 + - qcom,tsens-v1 + - qcom,tsens-v2 + + then: + required: + - reg + +additionalProperties: false + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + // Example msm9860 based SoC (ipq8064): + gcc: clock-controller { + + /* ... */ + + tsens: thermal-sensor { + compatible = "qcom,ipq8064-tsens"; + + nvmem-cells = <&tsens_calib>, <&tsens_calib_backup>; + nvmem-cell-names = "calib", "calib_backup"; + interrupts = <GIC_SPI 178 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow"; + + #qcom,sensors = <11>; + #thermal-sensor-cells = <1>; + }; + }; + + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + // Example 1 (legacy: for pre v1 IP): + tsens1: thermal-sensor@900000 { + compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1"; + reg = <0x4a9000 0x1000>, /* TM */ + <0x4a8000 0x1000>; /* SROT */ + + nvmem-cells = <&tsens_caldata>, <&tsens_calsel>; + nvmem-cell-names = "calib", "calib_sel"; + + interrupts = <GIC_SPI 184 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow"; + + #qcom,sensors = <5>; + #thermal-sensor-cells = <1>; + }; + + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + // Example 2 (for any platform containing v1 of the TSENS IP): + tsens2: thermal-sensor@4a9000 { + compatible = "qcom,qcs404-tsens", "qcom,tsens-v1"; + reg = <0x004a9000 0x1000>, /* TM */ + <0x004a8000 0x1000>; /* SROT */ + + nvmem-cells = <&tsens_caldata>; + nvmem-cell-names = "calib"; + + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow"; + + #qcom,sensors = <10>; + #thermal-sensor-cells = <1>; + }; + + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + // Example 3 (for any platform containing v2 of the TSENS IP): + tsens3: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0xc263000 0x1ff>, + <0xc222000 0x1ff>; + + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + + #qcom,sensors = <13>; + #thermal-sensor-cells = <1>; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/qoriq-thermal.yaml b/Documentation/devicetree/bindings/thermal/qoriq-thermal.yaml new file mode 100644 index 000000000..f09e8723c --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qoriq-thermal.yaml @@ -0,0 +1,114 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/qoriq-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal Monitoring Unit (TMU) on Freescale QorIQ SoCs + +maintainers: + - Anson Huang <Anson.Huang@nxp.com> + +properties: + compatible: + description: | + The version of the device is determined by the TMU IP Block Revision + Register (IPBRR0) at offset 0x0BF8. + Table of correspondences between IPBRR0 values and example chips: + Value Device + ---------- ----- + 0x01900102 T1040 + enum: + - fsl,qoriq-tmu + - fsl,imx8mq-tmu + + reg: + maxItems: 1 + + interrupts: + maxItems: 1 + + fsl,tmu-range: + $ref: '/schemas/types.yaml#/definitions/uint32-array' + description: | + The values to be programmed into TTRnCR, as specified by the SoC + reference manual. The first cell is TTR0CR, the second is TTR1CR, etc. + maxItems: 4 + + fsl,tmu-calibration: + $ref: '/schemas/types.yaml#/definitions/uint32-matrix' + description: | + A list of cell pairs containing temperature calibration data, as + specified by the SoC reference manual. The first cell of each pair + is the value to be written to TTCFGR, and the second is the value + to be written to TSCFGR. + items: + items: + - description: value for TTCFGR + - description: value for TSCFGR + minItems: 1 + maxItems: 64 + + little-endian: + description: | + boolean, if present, the TMU registers are little endian. If absent, + the default is big endian. + type: boolean + + clocks: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + +required: + - compatible + - reg + - interrupts + - fsl,tmu-range + - fsl,tmu-calibration + - '#thermal-sensor-cells' + +additionalProperties: false + +examples: + - | + tmu@f0000 { + compatible = "fsl,qoriq-tmu"; + reg = <0xf0000 0x1000>; + interrupts = <18 2 0 0>; + fsl,tmu-range = <0x000a0000 0x00090026 0x0008004a 0x0001006a>; + fsl,tmu-calibration = <0x00000000 0x00000025>, + <0x00000001 0x00000028>, + <0x00000002 0x0000002d>, + <0x00000003 0x00000031>, + <0x00000004 0x00000036>, + <0x00000005 0x0000003a>, + <0x00000006 0x00000040>, + <0x00000007 0x00000044>, + <0x00000008 0x0000004a>, + <0x00000009 0x0000004f>, + <0x0000000a 0x00000054>, + <0x00010000 0x0000000d>, + <0x00010001 0x00000013>, + <0x00010002 0x00000019>, + <0x00010003 0x0000001f>, + <0x00010004 0x00000025>, + <0x00010005 0x0000002d>, + <0x00010006 0x00000033>, + <0x00010007 0x00000043>, + <0x00010008 0x0000004b>, + <0x00010009 0x00000053>, + <0x00020000 0x00000010>, + <0x00020001 0x00000017>, + <0x00020002 0x0000001f>, + <0x00020003 0x00000029>, + <0x00020004 0x00000031>, + <0x00020005 0x0000003c>, + <0x00020006 0x00000042>, + <0x00020007 0x0000004d>, + <0x00020008 0x00000056>, + <0x00030000 0x00000012>, + <0x00030001 0x0000001d>; + #thermal-sensor-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml new file mode 100644 index 000000000..0f05f5c88 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml @@ -0,0 +1,147 @@ +# SPDX-License-Identifier: GPL-2.0-only +# Copyright (C) 2020 Renesas Electronics Corp. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/rcar-gen3-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Renesas R-Car Gen3 Thermal Sensor + +description: + On most R-Car Gen3 and later SoCs, the thermal sensor controllers (TSC) + control the thermal sensors (THS) which are the analog circuits for + measuring temperature (Tj) inside the LSI. + +maintainers: + - Niklas Söderlund <niklas.soderlund@ragnatech.se> + +properties: + compatible: + enum: + - renesas,r8a774a1-thermal # RZ/G2M + - renesas,r8a774b1-thermal # RZ/G2N + - renesas,r8a774e1-thermal # RZ/G2H + - renesas,r8a7795-thermal # R-Car H3 + - renesas,r8a7796-thermal # R-Car M3-W + - renesas,r8a77961-thermal # R-Car M3-W+ + - renesas,r8a77965-thermal # R-Car M3-N + - renesas,r8a77980-thermal # R-Car V3H + - renesas,r8a779a0-thermal # R-Car V3U + - renesas,r8a779f0-thermal # R-Car S4-8 + + reg: true + + interrupts: + items: + - description: TEMP1 interrupt + - description: TEMP2 interrupt + - description: TEMP3 interrupt + + clocks: + maxItems: 1 + + power-domains: + maxItems: 1 + + resets: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + +required: + - compatible + - reg + - clocks + - power-domains + - resets + - "#thermal-sensor-cells" + +if: + properties: + compatible: + contains: + enum: + - renesas,r8a779a0-thermal +then: + properties: + reg: + items: + - description: TSC0 registers + - description: TSC1 registers + - description: TSC2 registers + - description: TSC3 registers + - description: TSC4 registers +else: + properties: + reg: + minItems: 2 + items: + - description: TSC1 registers + - description: TSC2 registers + - description: TSC3 registers + if: + not: + properties: + compatible: + contains: + enum: + - renesas,r8a779f0-thermal + then: + required: + - interrupts + +additionalProperties: false + +examples: + - | + #include <dt-bindings/clock/r8a7795-cpg-mssr.h> + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/power/r8a7795-sysc.h> + + tsc: thermal@e6198000 { + compatible = "renesas,r8a7795-thermal"; + reg = <0xe6198000 0x100>, + <0xe61a0000 0x100>, + <0xe61a8000 0x100>; + interrupts = <GIC_SPI 67 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 68 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&cpg CPG_MOD 522>; + power-domains = <&sysc R8A7795_PD_ALWAYS_ON>; + resets = <&cpg 522>; + #thermal-sensor-cells = <1>; + }; + + thermal-zones { + sensor_thermal: sensor-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + thermal-sensors = <&tsc 0>; + + trips { + sensor1_crit: sensor1-crit { + temperature = <90000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + - | + #include <dt-bindings/clock/r8a779a0-cpg-mssr.h> + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/power/r8a779a0-sysc.h> + + tsc_r8a779a0: thermal@e6190000 { + compatible = "renesas,r8a779a0-thermal"; + reg = <0xe6190000 0x200>, + <0xe6198000 0x200>, + <0xe61a0000 0x200>, + <0xe61a8000 0x200>, + <0xe61b0000 0x200>; + clocks = <&cpg CPG_MOD 919>; + power-domains = <&sysc R8A779A0_PD_ALWAYS_ON>; + resets = <&cpg 919>; + #thermal-sensor-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/rcar-thermal.yaml b/Documentation/devicetree/bindings/thermal/rcar-thermal.yaml new file mode 100644 index 000000000..119998d10 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/rcar-thermal.yaml @@ -0,0 +1,155 @@ +# SPDX-License-Identifier: GPL-2.0-only +# Copyright (C) 2020 Renesas Electronics Corp. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/rcar-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Renesas R-Car Thermal + +maintainers: + - Niklas Söderlund <niklas.soderlund@ragnatech.se> + +properties: + compatible: + oneOf: + - items: + - enum: + - renesas,thermal-r8a73a4 # R-Mobile APE6 + - renesas,thermal-r8a7779 # R-Car H1 + - const: renesas,rcar-thermal # Generic without thermal-zone + - items: + - enum: + - renesas,thermal-r8a7742 # RZ/G1H + - renesas,thermal-r8a7743 # RZ/G1M + - renesas,thermal-r8a7744 # RZ/G1N + - const: renesas,rcar-gen2-thermal # Generic thermal-zone + - items: + - enum: + - renesas,thermal-r8a7790 # R-Car H2 + - renesas,thermal-r8a7791 # R-Car M2-W + - renesas,thermal-r8a7792 # R-Car V2H + - renesas,thermal-r8a7793 # R-Car M2-N + - const: renesas,rcar-gen2-thermal # Generic thermal-zone + - const: renesas,rcar-thermal # Generic without thermal-zone + - items: + - enum: + - renesas,thermal-r8a774c0 # RZ/G2E + - renesas,thermal-r8a77970 # R-Car V3M + - renesas,thermal-r8a77990 # R-Car E3 + - renesas,thermal-r8a77995 # R-Car D3 + reg: + description: + Address ranges of the thermal registers. If more then one range is given + the first one must be the common registers followed by each sensor + according to the datasheet. + minItems: 1 + maxItems: 4 + + interrupts: + minItems: 1 + maxItems: 3 + + clocks: + maxItems: 1 + + power-domains: + maxItems: 1 + + resets: + maxItems: 1 + + "#thermal-sensor-cells": + const: 0 + +required: + - compatible + - reg + +allOf: + - if: + not: + properties: + compatible: + contains: + enum: + - renesas,thermal-r8a73a4 # R-Mobile APE6 + - renesas,thermal-r8a7779 # R-Car H1 + then: + required: + - resets + - '#thermal-sensor-cells' + + - if: + not: + properties: + compatible: + contains: + const: renesas,thermal-r8a7779 # R-Car H1 + then: + required: + - interrupts + - clocks + - power-domains + +additionalProperties: false + +examples: + # Example (non interrupt support) + - | + thermal@ffc48000 { + compatible = "renesas,thermal-r8a7779", "renesas,rcar-thermal"; + reg = <0xffc48000 0x38>; + }; + + # Example (interrupt support) + - | + #include <dt-bindings/clock/r8a73a4-clock.h> + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/interrupt-controller/irq.h> + + thermal@e61f0000 { + compatible = "renesas,thermal-r8a73a4", "renesas,rcar-thermal"; + reg = <0xe61f0000 0x14>, <0xe61f0100 0x38>, + <0xe61f0200 0x38>, <0xe61f0300 0x38>; + interrupts = <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&mstp5_clks R8A73A4_CLK_THERMAL>; + power-domains = <&pd_c5>; + }; + + # Example (with thermal-zone) + - | + #include <dt-bindings/clock/r8a7790-cpg-mssr.h> + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/power/r8a7790-sysc.h> + + thermal: thermal@e61f0000 { + compatible = "renesas,thermal-r8a7790", + "renesas,rcar-gen2-thermal", + "renesas,rcar-thermal"; + reg = <0xe61f0000 0x10>, <0xe61f0100 0x38>; + interrupts = <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&cpg CPG_MOD 522>; + power-domains = <&sysc R8A7790_PD_ALWAYS_ON>; + resets = <&cpg 522>; + #thermal-sensor-cells = <0>; + }; + + thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <1000>; + polling-delay = <5000>; + + thermal-sensors = <&thermal>; + + trips { + cpu-crit { + temperature = <115000>; + hysteresis = <0>; + type = "critical"; + }; + }; + cooling-maps { + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.yaml b/Documentation/devicetree/bindings/thermal/rockchip-thermal.yaml new file mode 100644 index 000000000..f6c1be226 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.yaml @@ -0,0 +1,99 @@ +# SPDX-License-Identifier: GPL-2.0-only +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/rockchip-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Temperature Sensor ADC (TSADC) on Rockchip SoCs + +maintainers: + - Heiko Stuebner <heiko@sntech.de> + +properties: + compatible: + enum: + - rockchip,px30-tsadc + - rockchip,rk3228-tsadc + - rockchip,rk3288-tsadc + - rockchip,rk3328-tsadc + - rockchip,rk3368-tsadc + - rockchip,rk3399-tsadc + - rockchip,rk3568-tsadc + - rockchip,rv1108-tsadc + + reg: + maxItems: 1 + + interrupts: + maxItems: 1 + + clocks: + minItems: 2 + maxItems: 2 + + clock-names: + items: + - const: tsadc + - const: apb_pclk + + resets: + minItems: 1 + maxItems: 3 + + reset-names: + minItems: 1 + items: + - const: tsadc-apb + - const: tsadc + - const: tsadc-phy + + "#thermal-sensor-cells": + const: 1 + + rockchip,grf: + description: The phandle of the syscon node for the general register file. + $ref: /schemas/types.yaml#/definitions/phandle + + rockchip,hw-tshut-temp: + description: The hardware-controlled shutdown temperature value. + $ref: /schemas/types.yaml#/definitions/uint32 + + rockchip,hw-tshut-mode: + description: The hardware-controlled shutdown mode 0:CRU 1:GPIO. + $ref: /schemas/types.yaml#/definitions/uint32 + enum: [0, 1] + + rockchip,hw-tshut-polarity: + description: The hardware-controlled active polarity 0:LOW 1:HIGH. + $ref: /schemas/types.yaml#/definitions/uint32 + enum: [0, 1] + +required: + - compatible + - reg + - interrupts + - clocks + - clock-names + - resets + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/clock/rk3288-cru.h> + + tsadc: tsadc@ff280000 { + compatible = "rockchip,rk3288-tsadc"; + reg = <0xff280000 0x100>; + interrupts = <GIC_SPI 37 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&cru SCLK_TSADC>, <&cru PCLK_TSADC>; + clock-names = "tsadc", "apb_pclk"; + resets = <&cru SRST_TSADC>; + reset-names = "tsadc-apb"; + #thermal-sensor-cells = <1>; + rockchip,hw-tshut-temp = <95000>; + rockchip,hw-tshut-mode = <0>; + rockchip,hw-tshut-polarity = <0>; + }; diff --git a/Documentation/devicetree/bindings/thermal/rzg2l-thermal.yaml b/Documentation/devicetree/bindings/thermal/rzg2l-thermal.yaml new file mode 100644 index 000000000..1d8373397 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/rzg2l-thermal.yaml @@ -0,0 +1,78 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/rzg2l-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Renesas RZ/G2L Thermal Sensor Unit + +description: + On RZ/G2L SoCs, the thermal sensor unit (TSU) measures the + temperature(Tj) inside the LSI. + +maintainers: + - Biju Das <biju.das.jz@bp.renesas.com> + +properties: + compatible: + items: + - enum: + - renesas,r9a07g043-tsu # RZ/G2UL + - renesas,r9a07g044-tsu # RZ/G2{L,LC} + - renesas,r9a07g054-tsu # RZ/V2L + - const: renesas,rzg2l-tsu + + reg: + maxItems: 1 + + clocks: + maxItems: 1 + + power-domains: + maxItems: 1 + + resets: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + +required: + - compatible + - reg + - clocks + - power-domains + - resets + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include <dt-bindings/clock/r9a07g044-cpg.h> + + tsu: thermal@10059400 { + compatible = "renesas,r9a07g044-tsu", + "renesas,rzg2l-tsu"; + reg = <0x10059400 0x400>; + clocks = <&cpg CPG_MOD R9A07G044_TSU_PCLK>; + resets = <&cpg R9A07G044_TSU_PRESETN>; + power-domains = <&cpg>; + #thermal-sensor-cells = <1>; + }; + + thermal-zones { + cpu-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + thermal-sensors = <&tsu 0>; + + trips { + sensor_crit: sensor-crit { + temperature = <125000>; + hysteresis = <1000>; + type = "critical"; + }; + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/samsung,exynos-thermal.yaml b/Documentation/devicetree/bindings/thermal/samsung,exynos-thermal.yaml new file mode 100644 index 000000000..1344df708 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/samsung,exynos-thermal.yaml @@ -0,0 +1,184 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/samsung,exynos-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Samsung Exynos SoC Thermal Management Unit (TMU) + +maintainers: + - Krzysztof Kozlowski <krzk@kernel.org> + +description: | + For multi-instance tmu each instance should have an alias correctly numbered + in "aliases" node. + +properties: + compatible: + enum: + - samsung,exynos3250-tmu + - samsung,exynos4412-tmu + - samsung,exynos4210-tmu + - samsung,exynos5250-tmu + - samsung,exynos5260-tmu + # For TMU channel 0, 1 on Exynos5420: + - samsung,exynos5420-tmu + # For TMU channels 2, 3 and 4 of Exynos5420: + - samsung,exynos5420-tmu-ext-triminfo + - samsung,exynos5433-tmu + - samsung,exynos7-tmu + + clocks: + minItems: 1 + maxItems: 3 + + clock-names: + minItems: 1 + maxItems: 3 + + interrupts: + description: | + The Exynos TMU supports generating interrupts when reaching given + temperature thresholds. Number of supported thermal trip points depends + on the SoC (only first trip points defined in DT will be configured):: + - most of SoC: 4 + - samsung,exynos5433-tmu: 8 + - samsung,exynos7-tmu: 8 + maxItems: 1 + + reg: + items: + - description: TMU instance registers. + - description: | + Shared TMU registers. + + Note:: On Exynos5420, the TRIMINFO register is misplaced for TMU + channels 2, 3 and 4 Use "samsung,exynos5420-tmu-ext-triminfo" in + cases, there is a misplaced register, also provide clock to access + that base. + TRIMINFO at 0x1006c000 contains data for TMU channel 3 + TRIMINFO at 0x100a0000 contains data for TMU channel 4 + TRIMINFO at 0x10068000 contains data for TMU channel 2 + minItems: 1 + + '#thermal-sensor-cells': true + + vtmu-supply: + description: The regulator node supplying voltage to TMU. + +required: + - compatible + - clocks + - clock-names + - interrupts + - reg + +allOf: + - $ref: /schemas/thermal/thermal-sensor.yaml + - if: + properties: + compatible: + contains: + const: samsung,exynos5420-tmu-ext-triminfo + then: + properties: + clocks: + items: + - description: + Operational clock for TMU channel. + - description: + Optional clock to access the shared registers (e.g. TRIMINFO) of TMU + channel. + clock-names: + items: + - const: tmu_apbif + - const: tmu_triminfo_apbif + reg: + minItems: 2 + maxItems: 2 + - if: + properties: + compatible: + contains: + enum: + - samsung,exynos5433-tmu + - samsung,exynos7-tmu + then: + properties: + clocks: + items: + - description: + Operational clock for TMU channel. + - description: + Optional special clock for functional operation of TMU channel. + clock-names: + items: + - const: tmu_apbif + - const: tmu_sclk + reg: + minItems: 1 + maxItems: 1 + + - if: + properties: + compatible: + contains: + enum: + - samsung,exynos3250-tmu + - samsung,exynos4412-tmu + - samsung,exynos4210-tmu + - samsung,exynos5250-tmu + - samsung,exynos5260-tmu + - samsung,exynos5420-tmu + then: + properties: + clocks: + minItems: 1 + maxItems: 1 + reg: + minItems: 1 + maxItems: 1 + +additionalProperties: false + +examples: + - | + #include <dt-bindings/clock/exynos4.h> + + tmu@100c0000 { + compatible = "samsung,exynos4412-tmu"; + reg = <0x100C0000 0x100>; + interrupt-parent = <&combiner>; + interrupts = <2 4>; + #thermal-sensor-cells = <0>; + clocks = <&clock CLK_TMU_APBIF>; + clock-names = "tmu_apbif"; + vtmu-supply = <&ldo10_reg>; + }; + + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + + tmu@10068000 { + compatible = "samsung,exynos5420-tmu-ext-triminfo"; + reg = <0x10068000 0x100>, <0x1006c000 0x4>; + interrupts = <GIC_SPI 184 IRQ_TYPE_LEVEL_HIGH>; + #thermal-sensor-cells = <0>; + clocks = <&clock 318>, <&clock 318>; /* CLK_TMU */ + clock-names = "tmu_apbif", "tmu_triminfo_apbif"; + vtmu-supply = <&ldo7_reg>; + }; + + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + + tmu@10060000 { + compatible = "samsung,exynos5433-tmu"; + reg = <0x10060000 0x200>; + interrupts = <GIC_SPI 95 IRQ_TYPE_LEVEL_HIGH>; + #thermal-sensor-cells = <0>; + clocks = <&cmu_peris 3>, /* CLK_PCLK_TMU0_APBIF */ + <&cmu_peris 35>; /* CLK_SCLK_TMU0 */ + clock-names = "tmu_apbif", "tmu_sclk"; + vtmu-supply = <&ldo3_reg>; + }; diff --git a/Documentation/devicetree/bindings/thermal/socionext,uniphier-thermal.yaml b/Documentation/devicetree/bindings/thermal/socionext,uniphier-thermal.yaml new file mode 100644 index 000000000..c5b25ce44 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/socionext,uniphier-thermal.yaml @@ -0,0 +1,59 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/socionext,uniphier-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Socionext UniPhier thermal monitor + +description: | + This describes the devicetree bindings for thermal monitor supported by + PVT(Process, Voltage and Temperature) monitoring unit implemented on + Socionext UniPhier SoCs. + +maintainers: + - Kunihiko Hayashi <hayashi.kunihiko@socionext.com> + +properties: + compatible: + enum: + - socionext,uniphier-pxs2-thermal + - socionext,uniphier-ld20-thermal + - socionext,uniphier-pxs3-thermal + - socionext,uniphier-nx1-thermal + + interrupts: + maxItems: 1 + + "#thermal-sensor-cells": + const: 0 + + socionext,tmod-calibration: + $ref: /schemas/types.yaml#/definitions/uint32-array + maxItems: 2 + description: + A pair of calibrated values referred from PVT, in case that the values + aren't set on SoC, like a reference board. + +required: + - compatible + - interrupts + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + // The UniPhier thermal should be a subnode of a "syscon" compatible node. + + sysctrl@61840000 { + compatible = "socionext,uniphier-ld20-sysctrl", + "simple-mfd", "syscon"; + reg = <0x61840000 0x10000>; + + pvtctl: thermal { + compatible = "socionext,uniphier-ld20-thermal"; + interrupts = <0 3 1>; + #thermal-sensor-cells = <0>; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/spear-thermal.txt b/Documentation/devicetree/bindings/thermal/spear-thermal.txt new file mode 100644 index 000000000..93e3b67c1 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/spear-thermal.txt @@ -0,0 +1,14 @@ +* SPEAr Thermal + +Required properties: +- compatible : "st,thermal-spear1340" +- reg : Address range of the thermal registers +- st,thermal-flags: flags used to enable thermal sensor + +Example: + + thermal@fc000000 { + compatible = "st,thermal-spear1340"; + reg = <0xfc000000 0x1000>; + st,thermal-flags = <0x7000>; + }; diff --git a/Documentation/devicetree/bindings/thermal/sprd-thermal.yaml b/Documentation/devicetree/bindings/thermal/sprd-thermal.yaml new file mode 100644 index 000000000..6d65a3cf2 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/sprd-thermal.yaml @@ -0,0 +1,111 @@ +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/sprd-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Spreadtrum thermal sensor controller bindings + +maintainers: + - Orson Zhai <orsonzhai@gmail.com> + - Baolin Wang <baolin.wang7@gmail.com> + - Chunyan Zhang <zhang.lyra@gmail.com> + +properties: + compatible: + const: sprd,ums512-thermal + + reg: + maxItems: 1 + + clocks: + maxItems: 1 + + clock-names: + items: + - const: enable + + nvmem-cells: + maxItems: 2 + description: + Reference to nvmem nodes for the calibration data. + + nvmem-cell-names: + items: + - const: thm_sign_cal + - const: thm_ratio_cal + + "#thermal-sensor-cells": + const: 1 + + "#address-cells": + const: 1 + + "#size-cells": + const: 0 + +patternProperties: + "^([a-z]*-)?sensor(-section)?@[0-9]+$": + type: object + description: + Represent one thermal sensor. + + properties: + reg: + description: Specify the sensor id. + maxItems: 1 + + nvmem-cells: + maxItems: 1 + description: + Reference to an nvmem node for the calibration data. + + nvmem-cell-names: + const: sen_delta_cal + + required: + - reg + - nvmem-cells + - nvmem-cell-names + + additionalProperties: false + +required: + - compatible + - reg + - clocks + - clock-names + - nvmem-cells + - nvmem-cell-names + - "#thermal-sensor-cells" + - "#address-cells" + - "#size-cells" + +additionalProperties: false + +examples: + - | + ap_thm0: thermal@32200000 { + compatible = "sprd,ums512-thermal"; + reg = <0x32200000 0x10000>; + clock-names = "enable"; + clocks = <&aonapb_gate 32>; + #thermal-sensor-cells = <1>; + nvmem-cells = <&thm0_sign>, <&thm0_ratio>; + nvmem-cell-names = "thm_sign_cal", "thm_ratio_cal"; + #address-cells = <1>; + #size-cells = <0>; + + prometheus-sensor@0 { + reg = <0>; + nvmem-cells = <&thm0_sen0>; + nvmem-cell-names = "sen_delta_cal"; + }; + + ank-sensor@1 { + reg = <1>; + nvmem-cells = <&thm0_sen1>; + nvmem-cell-names = "sen_delta_cal"; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/st,stm32-thermal.yaml b/Documentation/devicetree/bindings/thermal/st,stm32-thermal.yaml new file mode 100644 index 000000000..bee41cff5 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/st,stm32-thermal.yaml @@ -0,0 +1,79 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/st,stm32-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: STMicroelectronics STM32 digital thermal sensor (DTS) binding + +maintainers: + - Pascal Paillet <p.paillet@foss.st.com> + +properties: + compatible: + const: st,stm32-thermal + + reg: + maxItems: 1 + + interrupts: + maxItems: 1 + + clocks: + maxItems: 1 + + clock-names: + items: + - const: pclk + + "#thermal-sensor-cells": + const: 0 + +required: + - "#thermal-sensor-cells" + - compatible + - reg + - interrupts + - clocks + - clock-names + +additionalProperties: false + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/clock/stm32mp1-clks.h> + dts: thermal@50028000 { + compatible = "st,stm32-thermal"; + reg = <0x50028000 0x100>; + clocks = <&rcc TMPSENS>; + clock-names = "pclk"; + #thermal-sensor-cells = <0>; + interrupts = <GIC_SPI 147 IRQ_TYPE_LEVEL_HIGH>; + }; + + thermal-zones { + cpu_thermal: cpu-thermal { + polling-delay-passive = <0>; + polling-delay = <0>; + + thermal-sensors = <&dts>; + trips { + cpu_alert1: cpu-alert1 { + temperature = <85000>; + hysteresis = <0>; + type = "passive"; + }; + + cpu_crit: cpu-crit { + temperature = <120000>; + hysteresis = <0>; + type = "critical"; + }; + }; + + cooling-maps { + }; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/st-thermal.txt b/Documentation/devicetree/bindings/thermal/st-thermal.txt new file mode 100644 index 000000000..a2f939137 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/st-thermal.txt @@ -0,0 +1,32 @@ +Binding for Thermal Sensor driver for STMicroelectronics STi series of SoCs. + +Required parameters: +------------------- + +compatible : Should be "st,stih407-thermal" + +clock-names : Should be "thermal". + See: Documentation/devicetree/bindings/resource-names.txt +clocks : Phandle of the clock used by the thermal sensor. + See: Documentation/devicetree/bindings/clock/clock-bindings.txt + +Optional parameters: +------------------- + +reg : For non-sysconf based sensors, this should be the physical base + address and length of the sensor's registers. +interrupts : Standard way to define interrupt number. + NB: For thermal sensor's for which no interrupt has been + defined, a polling delay of 1000ms will be used to read the + temperature from device. + +Example: + + temp0@91a0000 { + compatible = "st,stih407-thermal"; + reg = <0x91a0000 0x28>; + clock-names = "thermal"; + clocks = <&CLK_SYSIN>; + interrupts = <GIC_SPI 205 IRQ_TYPE_EDGE_RISING>; + st,passive_cooling_temp = <110>; + }; diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml new file mode 100644 index 000000000..850a9841b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml @@ -0,0 +1,118 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal cooling device binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overload. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the cooling devices. + + There are essentially two ways to provide control on power dissipation: + - Passive cooling: by means of regulating device performance. A typical + passive cooling mechanism is a CPU that has dynamic voltage and frequency + scaling (DVFS), and uses lower frequencies as cooling states. + - Active cooling: by means of activating devices in order to remove the + dissipated heat, e.g. regulating fan speeds. + + Any cooling device has a range of cooling states (i.e. different levels of + heat dissipation). They also have a way to determine the state of cooling in + which the device is. For example, a fan's cooling states correspond to the + different fan speeds possible. Cooling states are referred to by single + unsigned integers, where larger numbers mean greater heat dissipation. The + precise set of cooling states associated with a device should be defined in + a particular device's binding. + +select: true + +properties: + "#cooling-cells": + description: + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + const: 2 + +additionalProperties: true + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/thermal/thermal.h> + + // Example 1: Cpufreq cooling device on CPU0 + cpus { + #address-cells = <2>; + #size-cells = <0>; + + CPU0: cpu@0 { + device_type = "cpu"; + compatible = "qcom,kryo385"; + reg = <0x0 0x0>; + enable-method = "psci"; + cpu-idle-states = <&LITTLE_CPU_SLEEP_0>, + <&LITTLE_CPU_SLEEP_1>, + <&CLUSTER_SLEEP_0>; + capacity-dmips-mhz = <607>; + dynamic-power-coefficient = <100>; + qcom,freq-domain = <&cpufreq_hw 0>; + #cooling-cells = <2>; + next-level-cache = <&L2_0>; + L2_0: l2-cache { + compatible = "cache"; + next-level-cache = <&L3_0>; + L3_0: l3-cache { + compatible = "cache"; + }; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + /* Corresponds to 1000MHz in OPP table */ + cooling-device = <&CPU0 5 5>; + }; + }; + }; + + /* ... */ + }; +... diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt new file mode 100644 index 000000000..e136946a2 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt @@ -0,0 +1,95 @@ +General Purpose Analog To Digital Converter (ADC) based thermal sensor. + +On some of platforms, thermal sensor like thermistors are connected to +one of ADC channel and sensor resistance is read via voltage across the +sensor resistor. The voltage read across the sensor is mapped to +temperature using voltage-temperature lookup table. + +Required properties: +=================== +- compatible: Must be "generic-adc-thermal". +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description + of this property. +Optional properties: +=================== +- temperature-lookup-table: Two dimensional array of Integer; lookup table + to map the relation between ADC value and + temperature. When ADC is read, the value is + looked up on the table to get the equivalent + temperature. + + The first value of the each row of array is the + temperature in milliCelsius and second value of + the each row of array is the ADC read value. + + If not specified, driver assumes the ADC channel + gives milliCelsius directly. + +Example : +#include <dt-bindings/thermal/thermal.h> + +i2c@7000c400 { + ads1015: ads1015@4a { + reg = <0x4a>; + compatible = "ads1015"; + sampling-frequency = <3300>; + #io-channel-cells = <1>; + }; +}; + +tboard_thermistor: thermal-sensor { + compatible = "generic-adc-thermal"; + #thermal-sensor-cells = <0>; + io-channels = <&ads1015 1>; + io-channel-names = "sensor-channel"; + temperature-lookup-table = < (-40000) 2578 + (-39000) 2577 + (-38000) 2576 + (-37000) 2575 + (-36000) 2574 + (-35000) 2573 + (-34000) 2572 + (-33000) 2571 + (-32000) 2569 + (-31000) 2568 + (-30000) 2567 + :::::::::: + 118000 254 + 119000 247 + 120000 240 + 121000 233 + 122000 226 + 123000 220 + 124000 214 + 125000 208>; +}; + +dummy_cool_dev: dummy-cool-dev { + compatible = "dummy-cooling-dev"; + #cooling-cells = <2>; /* min followed by max */ +}; + +thermal-zones { + Tboard { + polling-delay = <15000>; /* milliseconds */ + polling-delay-passive = <0>; /* milliseconds */ + thermal-sensors = <&tboard_thermistor>; + + trips { + therm_est_trip: therm_est_trip { + temperature = <40000>; + type = "active"; + hysteresis = <1000>; + }; + }; + + cooling-maps { + map0 { + trip = <&therm_est_trip>; + cooling-device = <&dummy_cool_dev THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + contribution = <100>; + }; + + }; + }; +}; diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml new file mode 100644 index 000000000..cc938d7ad --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml @@ -0,0 +1,146 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal idle cooling device binding + +maintainers: + - Daniel Lezcano <daniel.lezcano@linaro.org> + +description: | + The thermal idle cooling device allows the system to passively + mitigate the temperature on the device by injecting idle cycles, + forcing it to cool down. + + This binding describes the thermal idle node. + +properties: + $nodename: + const: thermal-idle + description: | + A thermal-idle node describes the idle cooling device properties to + cool down efficiently the attached thermal zone. + + '#cooling-cells': + const: 2 + description: | + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + + duration-us: + description: | + The idle duration in microsecond the device should cool down. + + exit-latency-us: + description: | + The exit latency constraint in microsecond for the injected idle state + for the device. It is the latency constraint to apply when selecting an + idle state from among all the present ones. + +required: + - '#cooling-cells' + +additionalProperties: false + +examples: + - | + #include <dt-bindings/thermal/thermal.h> + + // Example: Combining idle cooling device on big CPUs with cpufreq cooling device + cpus { + #address-cells = <2>; + #size-cells = <0>; + + /* ... */ + + cpu_b0: cpu@100 { + device_type = "cpu"; + compatible = "arm,cortex-a72"; + reg = <0x0 0x100>; + enable-method = "psci"; + capacity-dmips-mhz = <1024>; + dynamic-power-coefficient = <436>; + #cooling-cells = <2>; /* min followed by max */ + cpu-idle-states = <&CPU_SLEEP>, <&CLUSTER_SLEEP>; + thermal-idle { + #cooling-cells = <2>; + duration-us = <10000>; + exit-latency-us = <500>; + }; + }; + + cpu_b1: cpu@101 { + device_type = "cpu"; + compatible = "arm,cortex-a72"; + reg = <0x0 0x101>; + enable-method = "psci"; + capacity-dmips-mhz = <1024>; + dynamic-power-coefficient = <436>; + #cooling-cells = <2>; /* min followed by max */ + cpu-idle-states = <&CPU_SLEEP>, <&CLUSTER_SLEEP>; + thermal-idle { + #cooling-cells = <2>; + duration-us = <10000>; + exit-latency-us = <500>; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal_zones { + cpu_thermal: cpu { + polling-delay-passive = <100>; + polling-delay = <1000>; + + /* ... */ + + trips { + cpu_alert0: cpu_alert0 { + temperature = <65000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_alert1: cpu_alert1 { + temperature = <70000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_alert2: cpu_alert2 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_crit: cpu_crit { + temperature = <95000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_alert1>; + cooling-device = <&{/cpus/cpu@100/thermal-idle} 0 15 >, + <&{/cpus/cpu@101/thermal-idle} 0 15>; + }; + + map1 { + trip = <&cpu_alert2>; + cooling-device = + <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>, + <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + }; + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml new file mode 100644 index 000000000..4bd345c71 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml @@ -0,0 +1,77 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal sensor binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of thermal zones required to take appropriate + action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-sensor. + + Thermal sensor devices provide temperature sensing capabilities on thermal + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor + devices may control one or more internal sensors. + +properties: + "#thermal-sensor-cells": + description: + Used to uniquely identify a thermal sensor instance within an IC. Will be + 0 on sensor nodes with only a single sensor and at least 1 on nodes + containing several internal sensors. + enum: [0, 1] + +required: + - "#thermal-sensor-cells" + +additionalProperties: true + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + + // Example 1: SDM845 TSENS + soc: soc { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml new file mode 100644 index 000000000..8d2c6d74b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml @@ -0,0 +1,343 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# +$schema: http://devicetree.org/meta-schemas/base.yaml# + +title: Thermal zone binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-zones. + + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt + (temperature derivative over time) in two situations for a thermal zone: + 1. when passive cooling is activated (polling-delay-passive) + 2. when the zone just needs to be monitored (polling-delay) or when + active cooling is activated. + + The maximum dT/dt is highly bound to hardware power consumption and + dissipation capability. The delays should be chosen to account for said + max dT/dt, such that a device does not cross several trip boundaries + unexpectedly between polls. Choosing the right polling delays shall avoid + having the device in temperature ranges that may damage the silicon structures + and reduce silicon lifetime. + +properties: + $nodename: + const: thermal-zones + description: + A /thermal-zones node is required in order to use the thermal framework to + manage input from the various thermal zones in the system in order to + mitigate thermal overload conditions. It does not represent a real device + in the system, but acts as a container to link a thermal sensor device, + platform-data regarding temperature thresholds and the mitigation actions + to take when the temperature crosses those thresholds. + +patternProperties: + "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$": + type: object + description: + Each thermal zone node contains information about how frequently it + must be checked, the sensor responsible for reporting temperature for + this zone, one sub-node containing the various trip points for this + zone and one sub-node containing all the zone cooling-maps. + + properties: + polling-delay: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone. Setting this to 0 disables the polling + timers setup by the thermal framework and assumes that the thermal + sensors in this zone support interrupts. + + polling-delay-passive: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone while doing passive cooling. Setting + this to 0 disables the polling timers setup by the thermal + framework and assumes that the thermal sensors in this zone + support interrupts. + + thermal-sensors: + $ref: /schemas/types.yaml#/definitions/phandle-array + maxItems: 1 + description: + The thermal sensor phandle and sensor specifier used to monitor this + thermal zone. + + coefficients: + $ref: /schemas/types.yaml#/definitions/uint32-array + description: + An array of integers containing the coefficients of a linear equation + that binds all the sensors listed in this thermal zone. + + The linear equation used is as follows, + z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn + where c0, c1, .., cn are the coefficients. + + Coefficients default to 1 in case this property is not specified. The + coefficients are ordered and are matched with sensors by means of the + sensor ID. Additional coefficients are interpreted as constant offset. + + sustainable-power: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An estimate of the sustainable power (in mW) that this thermal zone + can dissipate at the desired control temperature. For reference, the + sustainable power of a 4-inch phone is typically 2000mW, while on a + 10-inch tablet is around 4500mW. + + trips: + type: object + description: + This node describes a set of points in the temperature domain at + which the thermal framework needs to take action. The actions to + be taken are defined in another node called cooling-maps. + + patternProperties: + "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$": + type: object + + properties: + temperature: + $ref: /schemas/types.yaml#/definitions/int32 + minimum: -273000 + maximum: 200000 + description: + An integer expressing the trip temperature in millicelsius. + + hysteresis: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An unsigned integer expressing the hysteresis delta with + respect to the trip temperature property above, also in + millicelsius. Any cooling action initiated by the framework is + maintained until the temperature falls below + (trip temperature - hysteresis). This potentially prevents a + situation where the trip gets constantly triggered soon after + cooling action is removed. + + type: + $ref: /schemas/types.yaml#/definitions/string + enum: + - active # enable active cooling e.g. fans + - passive # enable passive cooling e.g. throttling cpu + - hot # send notification to driver + - critical # send notification to driver, trigger shutdown + description: | + There are four valid trip types: active, passive, hot, + critical. + + The critical trip type is used to set the maximum + temperature threshold above which the HW becomes + unstable and underlying firmware might even trigger a + reboot. Hitting the critical threshold triggers a system + shutdown. + + The hot trip type can be used to send a notification to + the thermal driver (if a .notify callback is registered). + The action to be taken is left to the driver. + + The passive trip type can be used to slow down HW e.g. run + the CPU, GPU, bus at a lower frequency. + + The active trip type can be used to control other HW to + help in cooling e.g. fans can be sped up or slowed down + + required: + - temperature + - hysteresis + - type + additionalProperties: false + + additionalProperties: false + + cooling-maps: + type: object + description: + This node describes the action to be taken when a thermal zone + crosses one of the temperature thresholds described in the trips + node. The action takes the form of a mapping relation between a + trip and the target cooling device state. + + patternProperties: + "^map[-a-zA-Z0-9]*$": + type: object + + properties: + trip: + $ref: /schemas/types.yaml#/definitions/phandle + description: + A phandle of a trip point node within this thermal zone. + + cooling-device: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of cooling device phandles along with the minimum + and maximum cooling state specifiers for each cooling + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the + cooling-device phandle limit specifier lets the framework + use the minimum and maximum cooling state for that cooling + device automatically. + + contribution: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The cooling contribution to the thermal zone of the referred + cooling device at the referred trip point. The contribution is + a ratio of the sum of all cooling contributions within a + thermal zone. + + required: + - trip + - cooling-device + additionalProperties: false + + required: + - polling-delay + - polling-delay-passive + - thermal-sensors + - trips + + additionalProperties: false + +additionalProperties: false + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/thermal/thermal.h> + + // Example 1: SDM845 TSENS + soc { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_alert1: trip-point1 { + temperature = <95000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_crit: cpu_crit { + temperature = <110000>; + hysteresis = <1000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + /* Corresponds to 1400MHz in OPP table */ + cooling-device = <&CPU0 3 3>, <&CPU1 3 3>, + <&CPU2 3 3>, <&CPU3 3 3>; + }; + + map1 { + trip = <&cpu0_alert1>; + /* Corresponds to 1000MHz in OPP table */ + cooling-device = <&CPU0 5 5>, <&CPU1 5 5>, + <&CPU2 5 5>, <&CPU3 5 5>; + }; + }; + }; + + /* ... */ + + cluster0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 5>; + + trips { + cluster0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + cluster0_crit: cluster0_crit { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + /* ... */ + + gpu-top-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 11>; + + trips { + gpu1_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + }; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml new file mode 100644 index 000000000..ea14de80e --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml @@ -0,0 +1,56 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Texas Instruments AM654 VTM (DTS) binding + +maintainers: + - Keerthy <j-keerthy@ti.com> + +properties: + compatible: + const: ti,am654-vtm + + reg: + maxItems: 1 + + power-domains: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + +required: + - compatible + - reg + - power-domains + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include <dt-bindings/soc/ti,sci_pm_domain.h> + vtm: thermal@42050000 { + compatible = "ti,am654-vtm"; + reg = <0x42050000 0x25c>; + power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>; + #thermal-sensor-cells = <1>; + }; + + mpu0_thermal: mpu0_thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <500>; /* milliseconds */ + thermal-sensors = <&vtm0 0>; + + trips { + mpu0_crit: mpu0_crit { + temperature = <125000>; /* milliCelsius */ + hysteresis = <2000>; /* milliCelsius */ + type = "critical"; + }; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml new file mode 100644 index 000000000..c74f124eb --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml @@ -0,0 +1,63 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/ti,j72xx-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Texas Instruments J72XX VTM (DTS) binding + +maintainers: + - Keerthy <j-keerthy@ti.com> + +properties: + compatible: + enum: + - ti,j721e-vtm + - ti,j7200-vtm + + reg: + items: + - description: VTM cfg1 register space + - description: VTM cfg2 register space + - description: VTM efuse register space + + power-domains: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + +required: + - compatible + - reg + - power-domains + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include <dt-bindings/soc/ti,sci_pm_domain.h> + wkup_vtm0: thermal-sensor@42040000 { + compatible = "ti,j721e-vtm"; + reg = <0x42040000 0x350>, + <0x42050000 0x350>, + <0x43000300 0x10>; + power-domains = <&k3_pds 154 TI_SCI_PD_EXCLUSIVE>; + #thermal-sensor-cells = <1>; + }; + + mpu_thermal: mpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <500>; /* milliseconds */ + thermal-sensors = <&wkup_vtm0 0>; + + trips { + mpu_crit: mpu-crit { + temperature = <125000>; /* milliCelsius */ + hysteresis = <2000>; /* milliCelsius */ + type = "critical"; + }; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt new file mode 100644 index 000000000..6299dd8de --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt @@ -0,0 +1,88 @@ +* Texas Instrument OMAP SCM bandgap bindings + +In the System Control Module, OMAP supplies a voltage reference +and a temperature sensor feature that are gathered in the band +gap voltage and temperature sensor (VBGAPTS) module. The band +gap provides current and voltage reference for its internal +circuits and other analog IP blocks. The analog-to-digital +converter (ADC) produces an output value that is proportional +to the silicon temperature. + +Required properties: +- compatible : Should be: + - "ti,omap34xx-bandgap" : for OMAP34xx bandgap + - "ti,omap36xx-bandgap" : for OMAP36xx bandgap + - "ti,omap4430-bandgap" : for OMAP4430 bandgap + - "ti,omap4460-bandgap" : for OMAP4460 bandgap + - "ti,omap4470-bandgap" : for OMAP4470 bandgap + - "ti,omap5430-bandgap" : for OMAP5430 bandgap +- interrupts : this entry should indicate which interrupt line +the talert signal is routed to; +Specific: +- gpios : this entry should be used to inform which GPIO +line the tshut signal is routed to. The informed GPIO will +be treated as an IRQ; +- regs : this entry must also be specified and it is specific +to each bandgap version, because the mapping may change from +soc to soc, apart of depending on available features. + +Example: +OMAP34xx: +bandgap { + reg = <0x48002524 0x4>; + compatible = "ti,omap34xx-bandgap"; +}; + +OMAP36xx: +bandgap { + reg = <0x48002524 0x4>; + compatible = "ti,omap36xx-bandgap"; +}; + +OMAP4430: +bandgap { + reg = <0x4a002260 0x4 0x4a00232C 0x4>; + compatible = "ti,omap4430-bandgap"; +}; + +OMAP4460: +bandgap { + reg = <0x4a002260 0x4 + 0x4a00232C 0x4 + 0x4a002378 0x18>; + compatible = "ti,omap4460-bandgap"; + interrupts = <0 126 4>; /* talert */ + gpios = <&gpio3 22 0>; /* tshut */ +}; + +OMAP4470: +bandgap { + reg = <0x4a002260 0x4 + 0x4a00232C 0x4 + 0x4a002378 0x18>; + compatible = "ti,omap4470-bandgap"; + interrupts = <0 126 4>; /* talert */ + gpios = <&gpio3 22 0>; /* tshut */ +}; + +OMAP5430: +bandgap { + reg = <0x4a0021e0 0xc + 0x4a00232c 0xc + 0x4a002380 0x2c + 0x4a0023C0 0x3c>; + compatible = "ti,omap5430-bandgap"; + interrupts = <0 126 4>; /* talert */ +}; + +DRA752: +bandgap { + reg = <0x4a0021e0 0xc + 0x4a00232c 0xc + 0x4a002380 0x2c + 0x4a0023C0 0x3c + 0x4a002564 0x8 + 0x4a002574 0x50>; + compatible = "ti,dra752-bandgap"; + interrupts = <0 126 4>; /* talert */ +}; |